Business Wire

CHINA-HI-TECH-FAIR

23.12.2021 11:56:09 CET | Business Wire | Press release

Share
CHTF 2021 to Kick off This Month Showing Latest Trends in Hi-tech World

The 23rd China Hi-Tech Fair (CHTF 2021) will be unveiled on December 27-29, 2021 at the Shenzhen Convention and Exhibition Center and Shenzhen World Convention & Exhibition Center, while the virtual exhibition will last five days from December 27 to 31. As China’s largest, most effective and influential tech event, CHTF is a platform for international exchanges and cooperation in the fields of economy and technology.

Themed "Advance Quality Development and Build a Novel Development Pattern", CHTF 2021 will feature exhibitions, conferences and business networking events. The display categories will include IT, Environmental Protection & Energy, Construction Innovation, New Materials, Smart Healthcare, and Semiconductor Display. International exhibitors representing Belt & Road countries will be the highlights.

Conferences will include the China Hi-Tech Forum, technical seminars, business salons, product launches, and B2B meetings. Guest list: https://www.chtf.com/english/Conferences/GuestSpeaker

This year’s virtual exhibition will bring together exhibitors and visitors from around the world.

If you are enthusiastic about high-tech trends or have investment and purchase intentions, CHTF 2021 warmly welcomes you to visit the fair. Free admission badges are available by registering on our official website. Key visitors will be granted with our special services including official catalogues, VIP rest areas, working lunches, souvenirs and seat reservations for important forums and activities. To register: http://cis.chtf.com/#!/login_en

Official Website: https://www.chtf.com/english/
Facebook: @CHTFChina
LinkedIn: @China Hi-tech Fair

Link:

ClickThru

Social Media:

https://www.facebook.com/CHTFChina/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

The Open Group Launches the Open Footprint® Standard, Edition 1.0 to Streamline Scope 1, 2, and 3 Emissions Management2.6.2026 09:00:00 CEST | Press release

The Open Group, the vendor-neutral technology and standards organization, today announced the release of the Open Footprint® Standard, Edition 1.0, that will help organizations streamline scope 1, 2, and 3 emissions reporting. The new standard is the first open emissions data model to address all three scopes, providing a comprehensive framework that enables organizations to collect and standardize data from their value chain and report across multiple jurisdictions. “There is an urgent need to streamline emissions data management and reduce the manual effort required to capture data within supply chains, perform data conversion, and report out to various regulators,” said Steve Nunn, President and CEO of The Open Group. “The Open Footprint Standard removes friction and lowers cost, helping organizations identify emissions reduction opportunities.” Key features of the model include: Standardized emissions data definitions and relationships Simplified emissions data sharing and interope

Thredd Renews and Expands Partnership with Caxton2.6.2026 09:00:00 CEST | Press release

Five-year renewal and strategic expansion strengthens travel, corporate, and parent-child card innovation Thredd, the AI-first issuer processing platform, today announced a five-year renewal and strategic programme expansion with Caxton, the leading payments solutions provider, reinforcing Thredd’s role as the company’s primary issuer-processor across consumer and corporate cards. Caxton, a leading UK payments provider, has partnered with Thredd since 2020 to power its multi-currency prepaid travel and expense cards. Customers can hold up to 15 currencies on a single card. As part of the renewed agreement, Thredd will bring Caxton’s parent-child card programme, nimbl, onto the Thredd platform. All nimbl customers will be re-carded as the programme is launched using Thredd’s infrastructure, with completion targeted before the end of the year. nimbl is a financial education-focused debit card designed for children aged 6–16, enabling parents to manage allowances and teach money managemen

Medscape Brings AI to the Hematology Frontline at EHA 20262.6.2026 08:00:00 CEST | Press release

Landmark symposium to equip clinicians with practical, ethical AI frameworks, chaired by a lead author of Europe's ESMO EBAI and ELCAP oncology guidelines. Medscape Education will launch Future-Ready Hematologists: Practical and Ethical Use of AI in Hematology and Oncology at EHA 2026 on June 11, where leading experts will convene to explore responsible AI in one of medicine's most complex, rapidly evolving specialties. Registration is free for all EHA delegates. Reserve your seat here. The session is chaired by Prof. Jakob N. Kather, MD, MSc, Else Kroener Fresenius Center for Digital Health, Technical University Dresden, and NCT, University Hospital Heidelberg. He is joined by Prof. Chan Cheah, MBBS, DMSc, Consultant Hematologist, Sir Charles Gairdner Hospital, Perth, Australia; and Prof. Matthew Lunning, DO, FACP, Chief of Hematology and Assistant Vice Chancellor of Research, University of Nebraska Medical Center. Hematology moves faster than any clinician can track alone. AI can clo

Signaloid Announces Preview of New ASIC Targeted at Physical AI and Robotics Applications2.6.2026 06:00:00 CEST | Press release

Signaloid previews a new ASIC purpose-built for physical AI and robotics workloads.The chip, taped out with TSMC in partnership with IC-Link by imec and Cadence, is projected to deliver up to 1000× better performance-per-watt in key physical AI workloads. Signaloid (https://signaloid.com), a computing platform company providing hardware and binary-translation-based acceleration of AI, robotics, aerospace, and quantitative finance workloads, today announced the tapeout and preliminary specifications documents for its C0-ASIC. Delivery of engineering samples to the first customer is due in Q3 2026 and additional FPGA-based systems implementing the ASIC’s design are under discussion for deployment in the UK and Switzerland later in 2026. The C0-ASIC was targeted specifically at energy-efficient physical AI workloads. The UK Advanced Research and Invention Agency (ARIA) will take delivery of systems based on the ASIC for use in next-generation AI workloads such as second order methods. “Th

Blackstone Raises its Largest Asia Private Equity Fund at $13.1 Billion2.6.2026 03:00:00 CEST | Press release

Oversubscribed Fund More than Doubles Capital Raised for Predecessor Vehicle Blackstone (NYSE: BX) today announced the final close of Blackstone Capital Partners Asia III (“BCP Asia III”) at $13.1 billion, exceeding its $10 billion target and marking the firm’s largest private equity fundraise in the region. The oversubscribed fund reached its hard cap and builds on the strong performance of the strategy’s first two vintages, with this close representing more than double the amount of capital raised for its predecessor vehicle. Joe Baratta, Global Head of Blackstone Private Equity Strategies,said: “We are grateful for the continued trust of our investors in Blackstone and our leading Asia Private Equity franchise. This successful fundraise reflects the strength of our platform and our ability to perform through cycles. Asia Pacific is the fastest-growing region in the world, presenting compelling opportunities to invest at scale behind our high-conviction themes and deliver for our inv

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye