CHINA-HI-TECH-FAIR
17.11.2022 17:59:41 CET | Business Wire | Press release
The 24th China Hi-Tech Fair (CHTF 2022), which opened in Shenzhen, China on November 15 and will last until November 19, has surprised visitors both offline and online during the first three days with numerous future-facing technologies and innovations on display in the fields of IT, high-end medical equipment, new energy, aviation and aerospace.
This year’s CHTF is expected to gather over 8,000 innovative items from over 5,000 exhibitors from nearly 40 countries and regions. Various overseas delegations exhibited international cutting-edge technologies and key cooperation and exchange programs, including Canva, a graphic design APP developed by a super unicorn from the Australian Delegation; a dynamic visual intelligence SoC from the Swiss Delegation; a bioHUB cloud platform from the Brazilian Delegation; and programs for sustainable innovation and digital development and successful investment cases from the Belgium Pavilion.
On the domestic side, the Shenzhen Institute of Advanced Technology alone brought 250 items to this year’s CHTF, including rapid imaging technology, a flexible tactile sensor based on a six-dimensional force, and a wearable brain function enhancement system.
Technologies designed for smarter living have drawn particular interest in the exhibition hall, and include inspection robots for parking lots, translation headsets, and ultra-thin transparent holographic screens. For example, a two-arm hand-brewing coffee robot drew a large crowd as it demonstrated how to leverage its two-arm collaboration and high-precision algorithms to make a cup of barista-level hand-brewed coffee.
Meanwhile, at the China Hi-tech Forum held on November 15-17, speakers discussed topics such as the future of industry, digital twin, and future transportation. Mr. Yu Feng, President of Honeywell China, shared his insights into the relationship between intelligent manufacturing and sustainable development, while Mr. Xue Wei, President of Fujitsu (China) Information Systems Co., Ltd., elaborated on how Fujitsu used digital innovation to promote sustainable development.
To ensure online visitors from across the world enjoy an immersive experience, CHTF has upgraded its online exhibition system to integrate cutting-edge technologies such as 5G+ ultra-HD video and VR, allowing visitors to freely browse exhibits, trade projects, cloud forums, live streaming and playback, international exhibitions, and themed tour highlights, as well as communicate remotely with exhibitors. Please visit: https://online.chtf.com/pcen24/#/home
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20221117005912/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
WHOOP Names Dirk-Jan "DJ" van Hameren Chief Marketing Officer as Member Base Surpasses 3 Million8.7.2026 13:00:00 CEST | Press release
Former Nike Global CMO and two-time Olympian joins WHOOP amid record global acceleration WHOOP, the human performance company, today named Dirk-Jan "DJ" van Hameren as Chief Marketing Officer. The appointment comes as WHOOP surpasses 3 million members worldwide after adding its latest one million members in just seven months. The former Nike Global Chief Marketing Officer and two-time Olympian joins WHOOP to help build the world's defining global brand for human performance and proactive health. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260708877245/en/ WHOOP Names Dirk-Jan "DJ" van Hameren (left) Chief Marketing Officer as Member Base Surpasses 3 Million Van Hameren spent more than three decades at Nike, where he rose from the mailroom at the company's European headquarters to become one of the most influential marketing leaders in the world. He served as NIKE Inc.’s Executive Vice President and Chief Marketing Officer
Endace and Artiza Networks Partner to Deliver Cybersecurity and Defense Solutions to the Japanese Market8.7.2026 13:00:00 CEST | Press release
Endace, a leading provider of always-on packet capture, network visibility, and packet forensics solutions, and Artiza Networks, Inc. ("Artiza"), a leading provider of telecommunications test, measurement, and network assurance solutions, today announced a partnership to deliver advanced cybersecurity and defense solutions to customers in Japan. “Artiza is exactly the partner we have been looking for to satisfy demand in Japan, with the right balance of expertise, and market reach,” said Stuart Wilson, CEO of Endace. Through this partnership, Artiza will offer Endace's packet capture, network recording, and packet forensics solutions to customers in Japan, including telecommunications operators, enterprises, government agencies, defense organizations, and critical infrastructure providers. Endace's EndaceProbe Analytics Platform provides highly scalable, always-on packet capture and recording capabilities across a wide range of network environments, including enterprise networks, data
HTEC Introduces “OneLoopAi” Redefining How Enterprises Scale AI Into Production8.7.2026 12:28:00 CEST | Press release
OneLoopAi is the first platform to provide end-to-end transparency between enterprise and partner on AI usage, resource utilization, costs, and value realized. HTEC, the global technology and engineering firm headquartered in Palo Alto, Silicon Valley, today announced it has launched HTEC OneLoopAi—a new platform and approach to managing AI execution and value realization. The platform brings real-time visibility into progress, transparency with customers, and acceleration to how AI is deployed and scaled into production. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260708166155/en/ HTEC, the global technology and engineering firm headquartered in Palo Alto, Silicon Valley, today announced it has launched HTEC OneLoopAi—a new platform and approach to managing AI execution and value realization. The platform brings real-time visibility into progress, transparency with customers, and acceleration to how AI is deployed and sc
Robbyant Upgrades and Open-Sources LingBot-VLA 2.0 as a Next-Generation Universal Brain for Embodied AI8.7.2026 10:11:00 CEST | Press release
Robbyant, an embodied AI company within Ant Group, today announced the upgrade and open-source release of LingBot-VLA 2.0. Building upon the foundation of LingBot-VLA 1.0 released in January 2026, this next-generation vision-language-action (VLA) model delivers significant leaps in morphological generalization, degrees of freedom (DoF) support, and deployment efficiency, delivering a more advanced “universal brain” for scalable real-world robotics. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260707394646/en/ LingBot-VLA 2.0 supports a wide range of robot morphologies While the embodied AI industry is witnessing rapid advancements in hardware and control systems, the lack of a truly universal brain remains a primary bottleneck for industrial-scale deployment. LingBot-VLA 2.0 addresses this critical gap by dramatically expanding its pre-training data and architectural capabilities. LingBot-VLA 2.0 was pre-trained on 60,000
TetraMem and SK hynix Showcase Successful Technology Collaboration Advancing Memory-Centric AI Computing8.7.2026 10:06:00 CEST | Press release
Joint achievement highlights how Analog In-Memory Computing can address the growing energy and thermal challenges of AI while laying the foundation for deeper collaboration on next-generation memory and computing architectures. TetraMem Inc., a leader in Analog In-Memory Computing (A-IMC) technology, and SK hynix Inc., a global leader in AI memory and semiconductor technologies, today announced the successful completion of a joint technology collaboration, highlighted by the publication of their research paper, “A Memristor-based In-Memory Computing SoC with Efficient Depthwise Convolution,” in Advanced Intelligent Systems. The work has also been selected as the cover feature of the journal, recognizing its technical innovation and potential impact on next-generation AI computing. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260708244132/en/ The collaboration brings together SK hynix’s expertise in advanced memory technolo
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom