CA-VELODYNE-LIDAR,-INC.
19.8.2020 14:02:10 CEST | Business Wire | Press release
Velodyne Lidar, Inc. today announced it was selected as “Hardware Supplier of the Year” by a panel of industry expert judges for the TU-Automotive awards. The award recognizes Velodyne as the top hardware supplier globally which had a stellar year, specifically relating to its development, adoption and integration of automotive technology into vehicles.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20200819005134/en/
Velodyne focuses on delivering high-quality lidar sensor products and helping deliver the promise of safer mobility. The company once again proved this by introducing new perception solutions to advance the autonomous and advanced driver assistance systems (ADAS) markets. Velodyne introduced the Puck 32MR™ sensor, a compact sensor with state-of-the-art capabilities. Following that, Velodyne introduced the Alpha Prime™ , which provides a world-class combination of field-of-view, range and image quality. The company also launched Velabit™ , Velodyne’s smallest sensor which brings new levels of versatility and affordability to 3D lidar perception. Velodyne has a diverse product portfolio with sensors that provide surround view, directional, long- and close-range capabilities.
In 2019, Velodyne scaled production by licensing core lidar technology to Tier 1 supplier Veoneer for a long-term, high-volume manufacturing agreement with a global automaker. Velodyne also announced an agreement with Hyundai Mobis to launch a new ADAS-based lidar that integrates Velodyne lidar technology and Hyundai Mobis cognitive software. The Velodyne VELARRAY™-based system is designed specifically to advance ADAS features in consumer vehicles.
“Winning this prestigious award further demonstrates how Velodyne innovations are a widespread catalyst for the acceleration of autonomous vehicle development and enhancing advanced driver assistance systems,” said Anand Gopalan, Velodyne Lidar CEO. “We take great pride in how our products help our customers. Velodyne Lidar is working to deliver on the promise of safer mobility by advancing our technology to save cost, save lives and reduce injuries.”
The 2020 TU-Automotive Awards recognize company performance in automotive technology, achieved from January 1, 2019 to February 19, 2020. The winners were honored in a virtual ceremony during the Informa Tech Automotive Group’s Festival of Automotive held August 18 to 20. For more information about the awards and virtual conference, visit https://automotive.knect365.com/tu-auto-detroit/ .
About Velodyne Lidar
Velodyne provides smart, powerful lidar solutions for autonomy and driver assistance. Headquartered in San Jose, Calif., Velodyne is known worldwide for its portfolio of breakthrough lidar sensor technologies. Velodyne’s founder, David Hall, invented real-time surround view lidar systems in 2005 as part of Velodyne Acoustics. Mr. Hall’s invention revolutionized perception and autonomy for automotive, new mobility, mapping, robotics, and security. Velodyne’s high-performance product line includes a broad range of sensing solutions, including the cost-effective Puck™, the versatile Ultra Puck™, the autonomy-advancing Alpha Prime™, the ADAS-optimized VELARRAY™, and the groundbreaking software for driver assistance, Vella™.
View source version on businesswire.com: https://www.businesswire.com/news/home/20200819005134/en/
Link:
Social Media:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Signaloid Announces Preview of New ASIC Targeted at Physical AI and Robotics Applications2.6.2026 06:00:00 CEST | Press release
Signaloid previews a new ASIC purpose-built for physical AI and robotics workloads.The chip, taped out with TSMC in partnership with IC-Link by imec and Cadence, is projected to deliver up to 1000× better performance-per-watt in key physical AI workloads. Signaloid (https://signaloid.com), a computing platform company providing hardware and binary-translation-based acceleration of AI, robotics, aerospace, and quantitative finance workloads, today announced the tapeout and preliminary specifications documents for its C0-ASIC. Delivery of engineering samples to the first customer is due in Q3 2026 and additional FPGA-based systems implementing the ASIC’s design are under discussion for deployment in the UK and Switzerland later in 2026. The C0-ASIC was targeted specifically at energy-efficient physical AI workloads. The UK Advanced Research and Invention Agency (ARIA) will take delivery of systems based on the ASIC for use in next-generation AI workloads such as second order methods. “Th
Blackstone Raises its Largest Asia Private Equity Fund at $13.1 Billion2.6.2026 03:00:00 CEST | Press release
Oversubscribed Fund More than Doubles Capital Raised for Predecessor Vehicle Blackstone (NYSE: BX) today announced the final close of Blackstone Capital Partners Asia III (“BCP Asia III”) at $13.1 billion, exceeding its $10 billion target and marking the firm’s largest private equity fundraise in the region. The oversubscribed fund reached its hard cap and builds on the strong performance of the strategy’s first two vintages, with this close representing more than double the amount of capital raised for its predecessor vehicle. Joe Baratta, Global Head of Blackstone Private Equity Strategies,said: “We are grateful for the continued trust of our investors in Blackstone and our leading Asia Private Equity franchise. This successful fundraise reflects the strength of our platform and our ability to perform through cycles. Asia Pacific is the fastest-growing region in the world, presenting compelling opportunities to invest at scale behind our high-conviction themes and deliver for our inv
Phison Unlocks Full-Scale AI Deployment Across Industries2.6.2026 02:00:00 CEST | Press release
Building an Ecosystem with Pascari aiDAPTIV™ Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a new strategic initiative at COMPUTEX 2026 under the theme “AI Enabler: Evolving Data Storage Intelligence.” Expanding beyond its role as a storage technology leader, Phison is taking a systems-level approach to AI solutions spanning AI infrastructure, edge AI computing and AI software platforms. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601070396/en/ Phison evolving data storage intelligence at COMPUTEX 2026 At COMPUTEX 2026, Phison is showcasing comprehensive AI storage and computing architecture solutions designed to address key challenges facing enterprises and end users in the AI era, including high AI deployment costs, GPU and memory limitations, data privacy concerns and the increasing storage bandwidth and power demands driven by AI workloads. Four Core Te
Phison Collaborates with Intel to Bring Larger Local AI Workloads to Intel AI PC Platforms2.6.2026 02:00:00 CEST | Press release
Phison's Pascari aiDAPTIV™ removes local memory constraints on client PCs, enabling larger MoE AI models and agentic AI applications COMPUTEX — Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a collaboration with Intel to enable AI PCs to deploy larger, more capable AI applications locally. The collaboration combines Intel® Core™ Ultra Series 3 processors with Phison’s Pascari aiDAPTIV, a memory extension solution that unblocks memory-constrained systems to support larger Mixture-of-Experts (MoE) AI models, longer-running AI sessions and agentic AI workflows. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601878925/en/ Phison and Intel collaborate to bring larger local AI workloads to Intel AI PC Platforms Today, AI PCs are moving beyond simple assistant applications toward more advanced local AI use cases. These solutions now support end users and businesses i
SymphonyAI Brings AI-Powered Assortment and Space Platform to Global CPGs, Compressing Category Review Cycles from Weeks to Days2.6.2026 00:35:00 CEST | Press release
CINDE Assortment and Space closes the loop between assortment, planogram, and in-store execution, proven across 500-plus global CPG deployments Planogram compliance failures, undetected out-of-stocks, and the lag between headquarters planning and store-level execution cost grocers measurably in comp sales, shrink, and associate labor hours. The tools built for category planning have never been designed to close that execution gap. In response, SymphonyAI, a global leader in Vertical AI, today announced the availability of CINDE Assortment and Space for CPGs, an AI platform that closes the loop between assortment strategy, planogram execution, and in-store compliance, compressing the category review cycle from four to six weeks to a matter of days. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260602137061/en/ The platform is underpinned by SymphonyAI's Transferable Demand AI, a model trained across 25 years of retail data a
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom