CA-TSMC
16.6.2022 23:32:06 CEST | Business Wire | Press release
TSMC (TWSE: 2330, NYSE: TSM) today showcased the newest innovations in its advanced logic, specialty, and 3D IC technologies at the Company’s 2022 North America Technology Symposium, with the next-generation leading-edge N2 process powered by nanosheet transistors and the unique FinFlex™ technology for the N3 and N3E processes making their debut.
Resuming as an in-person event after being held online in the past two years, the North America symposium in Santa Clara, California, kicks off a series of Technology Symposiums around the world in the coming months. The Symposiums also feature an Innovation Zone that spotlights the achievements of TSMC’s emerging start-up customers.
“We are living in a rapidly changing, supercharged, digital world where demand for computational power and energy efficiency is growing faster than ever before, creating unprecedented opportunities and challenges for the semiconductor industry,” said Dr. C.C. Wei, CEO of TSMC. “The innovations we will showcase at our Technology Symposiums demonstrate TSMC’s technology leadership and our commitment to support our customers through this exciting period of transformation and growth.”
Major technologies highlighted at the Symposium include:
TSMC FinFlex™ for N3 and N3E - TSMC’s industry-leading N3 technology, set to enter volume production later in 2022, will feature the revolutionary TSMC FinFlex™ architectural innovation offering unparalleled flexibility for designers. The TSMC FinFlex™ innovation offers choices of different standard cells with a 3-2 fin configuration for ultra performance, a 2-1 fin configuration for best power efficiency and transistor density, and a 2-2 fin configuration providing a balance between the two for Efficient Performance. With TSMC FinFlex™ architecture, customers can create system-on-chip designs precisely tuned for their needs with functional blocks implementing the best optimized fin configuration for the desired performance, power and area target, and integrated on the same chip. For more information on FinFlex, please visit N3.TSMC.COM .
N2 Technology - TSMC’s N2 technology represents another remarkable advancement over N3, with 10-15% speed improvement at the same power, or 25-30% power reduction at the same speed, ushering in a new era of Efficient Performance. N2 will feature nanosheet transistor architecture to deliver a full-node improvement in performance and power efficiency to enable next-generation product innovations from TSMC customers. The N2 technology platform includes a high-performance variant in addition to the mobile compute baseline version, as well as comprehensive chiplet integration solutions. N2 is scheduled to begin production in 2025.
Expanding Ultra -Low Power Platform - Building on the success of the N12e technology announced at the 2020 Technology Symposium, TSMC is developing N6e, the next evolution in process technology tuned to provide the computing power and energy efficiency required by edge AI and IoT devices. N6e will be based on TSMC’s advanced 7nm process and is expected to have three times greater logic density than N12e. It will serve as a part of TSMC’s Ultra-Low Power platform, a comprehensive portfolio of logic, RF, analog, embedded nonvolatile memory, and power management IC solutions aimed at applications in edge AI and the Internet of Things.
TSMC 3DFabric™ 3D Silicon Stacking Solutions - TSMC is showcasing two groundbreaking customer applications of the TSMC-SoIC™ chip stacking solution:
- The world’s first SoIC-based CPU employing Chip-on-Wafer (CoW) technology to stack SRAM as a Level 3 cache
- A groundbreaking intelligence processing unit stacked on top of a deep trench capacitor die using Wafer-on-Wafer (WoW) technology.
With N7 chips already in production for both CoW and WoW, support for N5 technology is scheduled for 2023. To meet customer demand for SoIC and other TSMC 3DFabric™ system integration services, the world’s first fully automated 3DFabric factory is set to begin production in the second half of 2022.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 291 distinct process technologies, and manufactured 12,302 products for 535 customers in 2021 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com .
View source version on businesswire.com: https://www.businesswire.com/news/home/20220616005367/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Ant International, Mastercard and Visa Initiate Collaboration on Know-Your-Agent Interoperability to Scale Agentic Commerce10.9.2026 03:00:00 CEST | Press release
Ant International, Mastercard, and Visa have begun collaboration on a Know-Your-Agent (KYA) interoperability framework, designed to help card networks, digital wallet ecosystems, agent platforms and marketplaces streamline agent onboarding and identification across networks, based on shared principles while preserving each network's own verification and decisioning processes. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260909003891/en/ Ant International, Mastercard and Visa initiate collaboration on Know-Your-Agent interoperability to scale agentic commerce AI agents are evolving from making recommendations to completing purchases on behalf of users. By 2030, AI agents are projected to orchestrate US$3 trillion to 5 trillion of global consumer commercei. Underlying the mega-trend is the KYA architecture of payment networks and service providers, which establishes requirements and accountability, verifies agent identities,
Andersen Global etablerer nyt medlemsvirksomhed i Frankrig9.9.2026 23:00:00 CEST | Pressemeddelelse
Andersen Global styrker sin tilstedeværelse i Frankrig med tilføjelsen af Andersen Société d'Avocats (Andersen in France), en medlemsvirksomhed baseret i Paris, der tilbyder integrerede juridiske ydelser til klienter i Frankrig og internationalt. Andersen in France tilbyder strategiske juridiske løsninger inden for selskabsskat, international skat, transfer pricing, moms og skatteprocesser og bistår klienter over hele verden. Under ledelse af de administrerende partnere Benoît Dambre og François Morazin håndterer det tværfaglige team også specialiserede områder som byplanlægning, fast ejendom, intellektuel ejendomsret og privatlivsbeskyttelse, bæredygtighed og ESG, EU-ret og sanktioner samt andre komplekse juridiske problemstillinger. "Vi ser juridisk rådgivning som mere end blot at håndtere umiddelbare udfordringer – det bør hjælpe klienter med at træffe kvalificerede beslutninger og opsøge muligheder med selvtillid," udtalte Benoît. "At blive en del af Andersen Global giver os muligh
Cyclic Materials Opens America’s First Commercial-Scale Facility Delivering Automated Rare Earth Magnet Recovery9.9.2026 22:09:00 CEST | Press release
The Mesa, Arizona facility deploys Cyclic Materials’ proprietary technology to process up to 25,000 metric tons of magnet-bearing products annually, creating a new domestic source of rare earth elements and copper, aluminum and steel for direct reintegration into U.S. manufacturing Cyclic Materials announced today the opening of its first commercial-scale rare earth magnet recycling facility in Mesa, Arizona, marking a major milestone in building domestic supply of rare earths and critical minerals. With an annual processing capacity of up to 25,000 metric tons of magnet-bearing end-of-life products, the facility produces Cyclic’s rare earth magnet material, Mag-Xtract™, and critical minerals such as copper and aluminum, and steel. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260909142592/en/ Leaders gather to mark the opening of Cyclic Materials’ new facility in Mesa, Arizona. From left to right: Herbert Flores, Arizona C
Belkin Introduces Titan SmartShield Pro Collection for the New iPhone 18 Pro Lineup9.9.2026 21:00:00 CEST | Press release
New collection combines advanced Nano-Titan protection with options for crystal-clear viewing, enhanced screen privacy and blue-to-red light conversion Belkin, a leading consumer electronics brand for over 40 years, today introduced its new Titan SmartShield Pro collection, designed to protect and enhance the experience of the new iPhone 18 Pro lineup. The collection includes three distinct screen protectors – clear, Blue-to-Red and Bright Privacy – each combining advanced Nano-Titan Technology with premium anti-reflective properties, exceptional scratch resistance and up to 9 feet of impact protection.* This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260909094720/en/ Belkin Titan SmartShield Pro Blue-to-Red Light screen protector As smartphones become increasingly central to how people work, travel and connect, the Titan SmartShield Pro collection goes beyond traditional screen protection to address the different ways consum
PPAI Releases Landmark Study Showing Branded Merchandise Supports a $472 Billion Global Economic Footprint9.9.2026 19:24:00 CEST | Press release
First-of-its-kind Oxford Economics study reveals annual spending, jobs and tax contributions Branded merchandise connects brands and people every day, but its impact extends well beyond the products consumers wear, use, receive or purchase. A landmark study commissioned by Promotional Products Association International (PPAI) provides the first comprehensive look at the global economic ecosystem behind branded merchandise. Conducted by independent global advisory firm Oxford Economics, the Branded Merchandise Global Market Report measures the industry end to end, from manufacturing and decoration to distribution, retail, e-commerce, fulfillment, marketing and brand activation. Key findings: $338.3 billion was spent on branded merchandise globally in 2025. The industry supported $472.3 billion in global GDP. Branded merchandise supported 11.9 million jobs worldwide. The sector supported $141.3 billion in global tax revenues – roughly the same as the entire Swiss federal budget. “For yea
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom