CA-TSMC
16.6.2022 23:32:06 CEST | Business Wire | Press release
TSMC (TWSE: 2330, NYSE: TSM) today showcased the newest innovations in its advanced logic, specialty, and 3D IC technologies at the Company’s 2022 North America Technology Symposium, with the next-generation leading-edge N2 process powered by nanosheet transistors and the unique FinFlex™ technology for the N3 and N3E processes making their debut.
Resuming as an in-person event after being held online in the past two years, the North America symposium in Santa Clara, California, kicks off a series of Technology Symposiums around the world in the coming months. The Symposiums also feature an Innovation Zone that spotlights the achievements of TSMC’s emerging start-up customers.
“We are living in a rapidly changing, supercharged, digital world where demand for computational power and energy efficiency is growing faster than ever before, creating unprecedented opportunities and challenges for the semiconductor industry,” said Dr. C.C. Wei, CEO of TSMC. “The innovations we will showcase at our Technology Symposiums demonstrate TSMC’s technology leadership and our commitment to support our customers through this exciting period of transformation and growth.”
Major technologies highlighted at the Symposium include:
TSMC FinFlex™ for N3 and N3E - TSMC’s industry-leading N3 technology, set to enter volume production later in 2022, will feature the revolutionary TSMC FinFlex™ architectural innovation offering unparalleled flexibility for designers. The TSMC FinFlex™ innovation offers choices of different standard cells with a 3-2 fin configuration for ultra performance, a 2-1 fin configuration for best power efficiency and transistor density, and a 2-2 fin configuration providing a balance between the two for Efficient Performance. With TSMC FinFlex™ architecture, customers can create system-on-chip designs precisely tuned for their needs with functional blocks implementing the best optimized fin configuration for the desired performance, power and area target, and integrated on the same chip. For more information on FinFlex, please visit N3.TSMC.COM .
N2 Technology - TSMC’s N2 technology represents another remarkable advancement over N3, with 10-15% speed improvement at the same power, or 25-30% power reduction at the same speed, ushering in a new era of Efficient Performance. N2 will feature nanosheet transistor architecture to deliver a full-node improvement in performance and power efficiency to enable next-generation product innovations from TSMC customers. The N2 technology platform includes a high-performance variant in addition to the mobile compute baseline version, as well as comprehensive chiplet integration solutions. N2 is scheduled to begin production in 2025.
Expanding Ultra -Low Power Platform - Building on the success of the N12e technology announced at the 2020 Technology Symposium, TSMC is developing N6e, the next evolution in process technology tuned to provide the computing power and energy efficiency required by edge AI and IoT devices. N6e will be based on TSMC’s advanced 7nm process and is expected to have three times greater logic density than N12e. It will serve as a part of TSMC’s Ultra-Low Power platform, a comprehensive portfolio of logic, RF, analog, embedded nonvolatile memory, and power management IC solutions aimed at applications in edge AI and the Internet of Things.
TSMC 3DFabric™ 3D Silicon Stacking Solutions - TSMC is showcasing two groundbreaking customer applications of the TSMC-SoIC™ chip stacking solution:
- The world’s first SoIC-based CPU employing Chip-on-Wafer (CoW) technology to stack SRAM as a Level 3 cache
- A groundbreaking intelligence processing unit stacked on top of a deep trench capacitor die using Wafer-on-Wafer (WoW) technology.
With N7 chips already in production for both CoW and WoW, support for N5 technology is scheduled for 2023. To meet customer demand for SoIC and other TSMC 3DFabric™ system integration services, the world’s first fully automated 3DFabric factory is set to begin production in the second half of 2022.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 291 distinct process technologies, and manufactured 12,302 products for 535 customers in 2021 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com .
View source version on businesswire.com: https://www.businesswire.com/news/home/20220616005367/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Brightfin Unveils Budget Clarity AI, Giving Every Finance and IT Leader a Financial Analyst at the Tip of Their Fingers29.9.2026 16:18:00 CEST | Press release
New AI capability turns the 101 questions finance teams field every day into self-service answers, letting anyone dig into spend, risk, and budget tradeoffs without waiting on an analyst or learning a new system Brightfin, the leader in technology financial management, today announced Budget Clarity AI, a new capability that gives finance and IT teams instant, self-service answers to the budget questions they field dozens of times a day. Built into the Brightfin platform, Budget Clarity AI acts as an always-available financial analyst, letting users ask plain-language questions about their spend and get grounded answers, visualizations, and recommendations in seconds. Finance and IT leaders are fielding an ever-growing volume of ad-hoc budget questions from stakeholders across the business, while the analysts who could answer them are stretched thin. Budget Clarity AI is designed to close that gap. Users don't need to know ServiceNow, and they don't need to know Brightfin's products —
Laserfiche Names Garrett Boss as CIO to Lead Enterprise IT, Security, and Business Transformation29.9.2026 16:00:00 CEST | Press release
Laserfiche — the leading SaaS provider of intelligent content management and business process automation — today announced the appointment of Garrett Boss as chief information officer. Boss will oversee Laserfiche’s global IT services team and business transformation office, including deployment of internal Laserfiche solutions and all other enterprise-wide IT systems. In this role, he will also oversee governance, risk, and compliance, supporting Laserfiche's mission to scale AI innovation while safeguarding the critical content and lifecycle tools customers rely on. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260929335686/en/ Garrett Boss joins Laserfiche as chief information officer. “Laserfiche’s own technology infrastructure and security posture are central to how we deliver an exceptional product and responsive services,” said CEO Karl Chan. “Garrett is a proven leader with a track record of leading global IT and go
CEO Pay Tops $18 Million as Turnover Drives Six-Year High in Sign-On Bonuses, According to Diligent29.9.2026 15:00:00 CEST | Press release
New Diligent Market Intelligence report finds succession costs rising as boards compete for scarce leadership talent and compensation committees face sharper investor scrutiny Median granted CEO pay at S&P 500 companies rose by more than 8% in 2025 to reach $18.2 million, while cash sign-on bonuses for incoming CEOs hit a six-year high, according to the Executive Compensation in 2026 report from Diligent Market Intelligence. The findings point to a more consequential compensation environment for boards: leadership talent is in shorter supply, CEO transitions are costly, and investors continue to scrutinize how pay decisions connect to performance and long-term value. The Russell 3000 also saw remuneration packages grow larger, with median granted CEO pay climbing over 2% to $7.4 million. “This level of growth has been fueled by performance-based equity and stock awards while both indices have been delivering strong total shareholder returns,” said Josh Black, Editor-in-Chief of Diligen
Momentum Grows for Miro MCP as Users Embrace the Canvas for AI Collaboration29.9.2026 15:00:00 CEST | Press release
Calls to Miro’s MCP server surge past 16 million; MCP jumps the developer niche with individuals in non-engineering roles now among the majority embracing the technology Miro®, the collaboration and context layer for the AI era, has reported more than 16 million calls to its MCP server since its launch in February 2026, with usage more than doubling since May. In September alone, MCP calls are on track to reach 6 million*. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260929837812/en/ Miro's MCP server is a Model Context Protocol integration letting AI tools connect to Miro boards—creating diagrams, tables, and canvas content, and reading existing board data programmatically. Teams increasingly rely on AI to accelerate work—from discovery and planning to design and code. Yet most AI interactions happen in chat windows or static outputs that exist separately from the team's actual workspace. Miro's MCP server changes this by
NTT DATA Launches ‘Intact, intelligent action.’ to Protect Fragile Places and Advance Sustainability Commitments29.9.2026 15:00:00 CEST | Press release
Global initiative will combine awareness, technology and stewardship to support fragile places around the world. Program will help translate sustainability commitments into practical actions. In the initiative’s first chapter, NTT DATA employees will join Antarctic expedition led by Robert Swan, OBE, on the 40th anniversary of his first South Pole expedition. NTT DATA, a global leader in AI, digital business and technology services, today announced “Intact, intelligent action.” This global initiative is designed to help people and organizations translate sustainability commitments into meaningful action. The effort combines awareness, technology and stewardship in support of some of the world’s most treasured yet fragile places. Antarctica will be the first chapter. From November 25 to December 2, 2026, a dozen NTT DATA employees will join polar explorer Robert Swan and his 2041 Leadership on the Edge expedition aboard the Magellan Explorer. With the Antarctic Peninsula and nearby isla
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom