Business Wire

CA-SOLIDIGM

16.5.2023 16:01:29 CEST | Business Wire | Press release

Share
Solidigm Introduces the D5-P5430 — A Data Center SSD with Exceptional Density, Performance, and Value

Solidigm, a leading global provider of innovative NAND flash memory solutions, is expanding its D5 Product Series with the Solidigm™ D5-P5430, a new QLC solid-state storage drive (SSD) optimized for mainstream and read-intensive workloads.

With most of today’s enterprise applications read-dominant, the D5-P5430 — a 4th gen PCIe QLC SSD — offers substantial storage density and Total Cost of Ownership (TCO) opportunities while delivering read performance that is equivalent to the most widely-adopted TLC SSDs.

The D5-P5430 is optimized for mainstream workloads (e.g., email/unified communications, decision support systems, object storage, and virtual desktop infrastructure) and read-intensive workloads (e.g., content delivery networks, data lakes/pipelines, video-on-demand). These workloads are typically 80% reads or higher and need to move massive amounts of data at high throughput.

As a drop-in replacement for TLC NAND-based PCIe-based SSDs, the D5-P5430 can reduce TCO by up to 27% for a typical object storage solution with a 1.5X increase in storage density and 18% lower energy cost. In addition, Solidigm’s newest drive can deliver up to 14% higher lifetime writes vs. leading TLC SSDs.

Important data center issues like power efficiency, edge computing, and sustainability of infrastructure, all benefit from the density of the D5-P5430, which can reduce power and cooling costs and lower the number of drives needed by up to 2x when compared to alternative solutions.

“Data centers need to store and analyze massive amounts of data with cost-effective and sustainable solutions,” said Greg Matson, VP, Strategic Planning and Marketing, Solidigm. “Solidigm’s D5-P5430 drives are ideal for this purpose, delivering high density, reduced TCO, and ‘just right’ performance for mainstream and read-intensive workloads.”

The D5-P5430 supports a wide range of 1U and 2U server and storage configurations with a broad range of capacities that support the following legacy and modern EDSFF form factors:

  • U.2 15mm 3.84 TB – 30.72 TB*
  • E1.S 9.5mm 3.84 TB – 15.36 TB
  • E3.S 7.5 mm 3.84 TB – 30.72 TB*

“Supermicro works with leading storage suppliers like Solidigm to bring the latest technology to our global customers that expect high-performance and secure storage technology,” said Vik Malyala, Managing Director and President, EMEA; SVP, WW FAE, Supermicro. “Solidigm’s new QLC-based E3.S SSD, the D5-P5430, gives customers a compelling combination of high density and efficiency for the data center infrastructure.”

*30 TB versions will be available later this year

ABOUT SOLIDIGM

Solidigm is a leading global provider of innovative NAND flash memory solutions. Solidigm technology unlocks data’s unlimited potential for customers, enabling them to fuel human advancement. Originating from the sale of Intel’s NAND and SSD business, Solidigm became a standalone U.S. subsidiary of semiconductor leader SK hynix in December 2021. Headquartered in Rancho Cordova, California, Solidigm is powered by the inventiveness of more than 2,000 employees in 13 locations worldwide. For more information, please visit solidigm.com and follow us on Twitter and LinkedIn. “Solidigm” is a trademark of SK hynix NAND Product Solutions Corp. (d/b/a Solidigm).

  • All products, computer systems, dates, and figures specified are preliminary based on current expectations and are subject to change without notice.
  • Differences in hardware, software, or configuration will affect actual performance.
  • Solidigm optimizations, for Solidigm compilers or other products may not optimize to the same degree for non-Solidigm products.
  • Solidigm technologies may require enabled hardware, software, or service activation.
  • Nothing herein is intended to create any express or implied warranty.
  • The products described in this document may contain design defects or errors known as “errata,” which may cause the product to deviate from published specifications. Currently characterized errata are available on request.
  • Your costs and results may vary.
  • © Solidigm. “Solidigm” is a trademark of SK hynix NAND Product Solutions Corp. (d/b/a Solidigm). Other names and brands may be claimed as the property of others.

To learn more about Solidigm™ D5-5430 and the benefits of QLC, visit solidigm.com/qlc.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20230516005023/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Lattice Delivers Industry-First PQC-Enabled Platform Firmware Resilience for AI Infrastructure with Lattice Sentry Solution Stack12.10.2026 22:00:00 CEST | Press release

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced the latest version of its Lattice Sentry™ solution stack (v5.0), the industry’s first post-quantum cryptography (PQC)-enabled Platform Firmware Resilience (PFR) and attestation solution. Extending Lattice's post-quantum cryptography leadership from silicon to a complete platform security stack, Lattice Sentry now delivers CNSA 2.0-aligned, NIST-compliant protection across AI data centers, and critical infrastructure, giving system designers a validated, production-ready path to quantum-resistant security. Lattice Sentry extends the company’s PQC leadership, combining the industry's first CNSA 2.0-compliant FPGA portfolio with AMI's platform management software to deliver a complete, integrated platform security solution. “AI infrastructure and the threat landscape are evolving rapidly. Platform firmware has become a primary attack vector, and the quantum era will upend decades

Cooler Master Expands End-to-End Cooling Solutions for AI Infrastructure12.10.2026 19:00:00 CEST | Press release

2,500 kW CDU anchors a portfolio spanning facility cooling, coolant distribution, rack-level thermal management and deployment equipment for high-density AI infrastructure Cooler Master, a global leader in digital infrastructure cooling solutions, has outlined its end-to-end cooling portfolio for AI infrastructure, designed to support high-density computing deployments in new data centers and existing facilities expanding AI capacity. Anchored by a 2,500 kW Liquid-to-Liquid In-Row Coolant Distribution Unit (CDU), the portfolio spans facility-level heat transfer, rack and server cooling, and the equipment used to prepare liquid cooling systems for operation. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012102572/en/ “Customers need choices that bring fast time-to-market, flexibility, and scalability for the deployment of their facilities,” said Thomas Chen, CEO at Cooler Master Corporation. “We aim to help them put liqui

GigaDevice Deepens Ecosystem Collaboration with LVGL to Advance GD32’s Global Open-Source GUI Ecosystem12.10.2026 15:00:00 CEST | Press release

GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, is deepening its ecosystem collaboration with LVGL. LVGL's Open graphics library is one of the world’s most widely‑adopted open‑source embedded frameworks. Eight GD32 MCU product families have now been officially included in the LVGL ecosystem, providing developers worldwide with more convenient and efficient support for embedded graphics development. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012320702/en/ Eight GD32 product series supported on LVGL website LVGL is an open-source graphical user interface framework designed for embedded devices, commercially supported by LVGL Ltd., a technology company based in Cambridge, UK. Lightweight, efficient, and cross-platform, it can be widely used in applications such as smart home devices, industrial control systems, consumer electronics, a

W. L. Gore & Associates Launches GORE® Battery Vents – MultiVent Series at the Battery Show12.10.2026 14:00:00 CEST | Press release

The integrated battery vent combines pressure equalization, moisture protection, and resealable thermal-runaway evacuation in a single part, with one opening in the pack wall. Today, W. L. Gore & Associates (Gore) introduced GORE® Battery Vents – MultiVent Series at The Battery Show North America 2026, a new integrated venting architecture that combines all three functions into a single device. Designed for lithium-ion battery packs in electric vehicles and energy storage systems, GORE® MultiVent is an integrated battery vent: one device that equalizes pressure, protects against moisture and evacuates gas during thermal runaway, then reseals. It gives pack designers an alternative to combining dual-stage vents, separate evacuation valves and desiccants. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012625188/en/ GORE® MultiVent GORE MultiVent builds on technology Gore acquired from Vernay Laboratories in 2026 and combine

Echodyne and ACS Sign Strategic Collaboration Agreement to Advance Counter-UAS Capabilities Worldwide12.10.2026 14:00:00 CEST | Press release

Successful integration of EchoShield® radar with ACS’s Bullfrog™ autonomousweapon station delivers precise tracking and affordable kinetic defeat across land and maritime missions. Echodyne, the radar platform company, and ACS, a precision robotics company for defense, today announced the signing of a Strategic Collaboration Agreement to accelerate the development, demonstration, and deployment of integrated counter-unmanned aircraft system (C-UAS) solutions. The agreement establishes collaboration across Echodyne’s high-performance commercial counter-UAS radar hardware and software roadmaps and ACS’s Bullfrog robotic weapon station capabilities, and follows the recent announcement of each company’s award from Joint Interagency Task Force 401 for Domestic Shield, the JIATF-401 C-UAS Marketplace, and other critical counter-drone requirements. Bullfrog combines computer vision, autonomous control, and precision robotics with existing weapon systems to detect, track, identify, and engage

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye