CA-NOODLE.AI
16.1.2020 15:02:14 CET | Business Wire | Press release
Leading Enterprise Artificial Intelligence® provider Noodle.ai and the digitalization team at SMS group , a trailblazer in digitalization for plant and equipment used in steel and nonferrous-metals production and processing, launched MPV today. MPV is the first joint AI-driven application for the steel industry. The launch follows the announcement of their partnership in June 2019.
As steel industry margins continue to shrink, one promising way for manufacturers to increase profitability is to pursue more advanced, high-strength steel production for applications such as automotive and electrical. However, production of these advanced steel grades requires much tighter control of the overall production process, which is impacted by numerous parameters across the mill.
The MPV (Mechanical Properties Variability) application utilizes artificial intelligence and machine learning to create a unique 'sense, predict, and recommend' framework that addresses challenges associated with the variability of mechanical properties in steel production. Mechanical properties include things such as yield strength, tensile strength, and elongation. The application senses patterns within mill data to fully understand the drivers of mechanical property variability. It then predicts when increased variability will occur and recommends the optimal input parameters, or PDI settings, required to optimize target mechanical properties such as yield strength, tensile strength, and elongation. As a result, the MPV application can help steel manufacturers achieve cost savings 3 ways: by reducing mechanical properties variability, reducing alloy costs due to better variability control, and minimizing out-of-spec production, which are sold as secondary grades or scrapped. One steel manufacturer using MPV is anticipating savings $2M per year.
“Our ability to deploy AI to produce steel with tighter tolerances allows us to address the requirements of high margin segments such as automotive and electrical, which immediately impacts our top line revenues in addition to the obvious cost savings,” said Denis Hennessy, Director of Product Development at Big River Steel, after implementing the MPV application.
In addition to addressing these challenges in mechanical properties variability, the AI and machine learning solutions that Noodle.ai and SMS digital have co-developed will also help steel manufacturers optimize product quality, asset availability and production efficiency. Together, Noodle.ai and SMS digital combine manufacturing equipment expertise, process modeling experience, and cutting-edge data science to accelerate time to value, enabling customers to quickly realize bottom-line impact.
“This partnership with SMS digital was created to make efficiency improvements that not only help steel manufacturers’ bottom line, but to rid the world of unnecessary industrial waste that often plagues this industry,” said Stephen Pratt, Founder and CEO, Noodle.ai. “We are encouraged by the results we’ve already seen with this application developed in partnership with SMS digital, and anticipate being able to assist an even larger list of steel manufacturers as we enter 2020 with MPV and the other applications we develop together.”
About Noodle.ai
Noodle.ai applies advanced data science to industries at the core of the global economy to create a world without waste. With Noodle.ai’s advanced Enterprise AI® applications, business leaders are empowered to make better decisions, reduce wasted energy, money, and resources, and ensure their businesses are built to last. Noodle.ai focuses on radical efficiency for supply chain and manufacturing using leading-edge artificial intelligence.
About SMS digital comprising SMS group Inc. Digital Solutions and SMS digital GmbH
SMS digital GmbH, the digital subsidiary of SMS group GmbH, and SMS group Inc. Digital Solutions collectively are a market leading supplier of digitalization for plant and equipment used in steel and NF-metals production and processing. SMS group GmbH generates worldwide sales totaling EUR 3.3 billion with more than 14,000 employees.
In close collaboration with its customers, SMS digital identifies and develops innovative products for the metals industry building on most advanced development techniques, in-depth metallurgical process knowhow and technological expert knowledge. SMS digital helps its customers make their plants and machines ready for the digital age by means of digital applications and the use of AI.
View source version on businesswire.com: https://www.businesswire.com/news/home/20200116005174/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
