Business Wire

CA-KAVA-LABS

31.8.2021 14:49:07 CEST | Business Wire | Press release

Share
Kava Labs Introduces Kava Swap

Kava Labs™, an open source and non-custodial developer of financial products and services for decentralized finance (DeFi), announced the successful launch of its newest platform project, Kava Swap™.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210831005132/en/

Kava Swap is a cross-chain Autonomous Market Making (AMM) protocol designed to provide an efficient and safe way to swap natively between the world’s largest assets. The new protocol is built on the Kava Platform™ and is backed by low fees, high efficiency, and the ability to generate strong returns for liquidity providers. Kava Swap gives both retail and institutional users access to the over $1 billion of on-chain liquidity on the Kava ecosystem to efficiently trade assets, extend earning opportunities and maximize yields. The new product comes as part of the Kava Mainnet 8 upgrade and has successfully completed a full security audit with CertiK.

“From our inception four years ago, Kava Labs’ mission has been to build a portfolio of decentralized products and services that allow users to gain access to all of the benefits of DeFi, but without the risks present in the current marketplace,” said Scott Stuart, Co-Founder and Head of Products at Kava Labs. “As we expand our ecosystem, Kava continues to deliver on the promise of constructing an open and scalable institutional-grade platform that provides the same level of efficiency, security and ease of use as main street financial products.”

Kava Swap is the third protocol built on the Kava Platform and is an open and permissionless application accessible by anyone, anytime, anywhere in the world. It joins Kava Mint™, which allows users to take out USDX stablecoin loans using their assets as collateral, and Kava Lend™, which allows users to earn rewards by supplying and borrowing assets from money markets. All three protocols come complete with interoperable cross-chain tooling, secure price feeds and institutional-grade safety and reliability. In addition, the Platform’s upgrade to Kava Mainnet 8 will strengthen token holder participation and governance across all applications on the Kava Platform by activating voting on the HARD™ and SWP™ tokens. This gives token investors direct access to governance over the Kava Platform and the Mint Protocol through the KAVA™ token, the Kava Lend Protocol through the HARD token and the Kava Swap Protocol with the SWP token.

“Kava has been focused on developing the safest way for users to grow their cryptocurrency portfolios,” continued Stuart. “We believe that accessing the wealth creating opportunities inside of DeFi does not need to mean increased exposure to risks. Our guiding product principle is to develop an institutional-grade DeFi ecosystem that unlocks the massive growth opportunities available in the crypto marketplace in a de-risked model that helps to evolve our marketplace into the mainstream.”

For more information please visit https://www.kava.io
To Access Kava Swap, please visit: https://app.kava.io
Follow on Twitter: https://twitter.com/kava_labs
Follow on Telegram: https:// http://t.me/kavalabs

Link:

ClickThru

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release

Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana

Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp

Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release

Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve

ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release

ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material

ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release

Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye