CA-ITT
November 30, 2021-- ITT Inc.’s (NYSE: ITT) connector business introduces its ruggedized, modular circular series Veam MOVE-MOD™. The flexible design delivers power, signal, and data in a single connector by utilizing a range of snap-in modules with various contact layouts to match individual system requirements. Developed for use in harsh environments, these ultra-durable connectors are suitable for a wide range of applications, including rail, heavy and off-road vehicles, alternative energy and infrastructure, robotics, and other industrial equipment.
“Our customers have relied on Veam connectors to overcome their critical challenges for more than 60 years. MOVE-MOD is a next-generation solution designed to meet their evolving needs,” says Ellen McMillan, Vice President and General Manager Europe, ITT Connect and Control Technologies. “The modular nature of these innovative connectors give long-term flexibility to adapt, convert and expand connectivity post-design-in by simply swapping out modules.”
One key advantage the circular MOVE-MOD series has over its rectangular equivalents is its suitability for size-restricted applications. In comparison to standard rectangular connectors with equivalent pin counts, MOVE-MOD has a condensed footprint. Toolless assembly and installation combined with ultra-secure bayonet coupling that features visual, tactile, and audible secondary locking confirmation ensure MOVE-MOD is a fast and easy solution to work with.
The series is available in two ultra-harsh-environment, RoHS and REACH compliant plating options that deliver 500-hour salt spray resistance. The first option is the proprietary Blue Generation® plating is a high-performance Zinc Nickel formulation that is conductive and offers excellent RFI shielding. While the second option, Black Hard Anodized plating, is a popular non-conductive option, also for use in extreme environments.
Additional key features of the MOVE-MOD series include:
- Minimized component requirements deliver time and cost efficiencies
- IP67 environmental sealing
- Minimum of 500 mating cycles
- Wide operating temperature range (-55°C to -115°C)
- RoHS and REACH compliance
For more information about the MOVE-MOD series of modular, circular interconnects, please visit: www.ittcannon.com
About ITT
ITT is a diversified leading manufacturer of highly engineered critical components and customized technology solutions for the transportation, industrial, and oil and gas markets. Building on its heritage of innovation, ITT partners with its customers to deliver enduring solutions to the key industries that underpin our modern way of life. ITT is headquartered in White Plains, N.Y., with employees in more than 35 countries and sales in approximately 125 countries. For more information, visit www.itt.com
About ITT's Connect and Control Technologies Business
ITT's Connect and Control Technologies business designs and manufactures harsh-environment connectors and critical energy absorption, motion, flow and environmental control components. Through leading brands such as Aerospace Controls, BIW Connector Systems, Cannon, Compact, Enidine and Veam, the business serves customers in the aerospace, automation, defense, energy, industrial, infrastructure and transportation markets.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211130005827/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
OCP Announces Date of Third Quarter and Nine-Month 2025 Earnings19.11.2025 22:05:00 CET | Press release
OCP S.A. (“OCP” or the “Company”), a global leader in the fertilizer industry, will release its third quarter and nine-month 2025 results on Tuesday, November 25, 2025. The results will be available to holders of the Company’s bonds, qualified institutional buyers, securities analysts and market makers on the OCP Intralinks portal from 9:00 a.m. EDT, 3:00 p.m. Morocco (GMT+1), and 2:00 p.m. London time (GMT). OCP senior management will host a conference call to discuss third quarter and nine-month 2025 results at 10:00 a.m. EDT, 4:00 p.m. Morocco (GMT+1), and 3:00 p.m. London time (GMT) on Tuesday, November 25, 2025, for holders of the Company’s bonds, qualified institutional buyers, securities analysts and market makers. Eligible parties that have not already registered for access to the Intralinks portal may do so by contacting the Investor Relations Department by emailing g.laraki@ocpgroup.ma. About OCP OCP is a global leader in the fertilizer industry, backed by almost a century’s
Marquee Brands Broadens Global Portfolio with Strategic Acquisition of Stance19.11.2025 21:00:00 CET | Press release
Marquee’s 19th Brand Signals a Bold Expansion into Lifestyle and Performance Marquee Brands, the premier global brand accelerator, today announced the acquisition of Stance, the innovative lifestyle and performance sock brand. Founded in 2009 in San Clemente, California, Stance joins Marquee Brands’ renowned portfolio, home to some of the world’s most notable brands, including Martha Stewart, Laura Ashley, Sur La Table, BCBG, Ben Sherman, Body Glove and Dakine. The addition of Stance brings total retail sales across Marquee’s portfolio to $4.5 Billion USD. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251119216623/en/ Marquee also announces a new partnership with United Legwear and Apparel Co. (ULAC), which becomes the brand’s core global licensee, managing operations across all territories apart from China. With products sold in 42 countries through more than 1,100 U.S. wholesale accounts, e-commerce, international distrib
AWS and HUMAIN Expand Partnership with NVIDIA AI Infrastructure and AWS AI Chip Deal to Drive Global AI Innovation19.11.2025 19:38:00 CET | Press release
Expanded partnership includes deployment of up to 150,000 AI accelerators including the latest NVIDIA GB300s AI infrastructure and AWS’s Trainium chips.Amazon Bedrock will provide customers access to best-in-class foundation models optimized across diverse, high performance AI chip infrastructures.AWS becomes HUMAIN’s preferred AI partner with AWS and HUMAIN collaborating to bring AI compute and services to customers worldwide. Amazon Web Services, Inc. (AWS), an Amazon.com, Inc. company (NASDAQ: AMZN), and HUMAIN, a Public Investment Fund (PIF) company delivering global full-stack AI solutions, announced today at the U.S.-Saudi Investment Forum their plans to provide, deploy and manage up to 150,000 AI accelerators in a data center facility known as an “AI Zone” in Riyadh. As part of the expanded partnership, AWS will become HUMAIN’s preferred AI partner globally, and the two companies will collaborate to bring AI compute and services from Saudi Arabia to customers worldwide. This pre
Luma AI Raises $900 Million Series C Led by HUMAIN And Partners on 2 Gigawatt AI Supercluster in Saudi Arabia19.11.2025 18:15:00 CET | Press release
New capital and compute infrastructure will accelerate Luma AI’s path towards Multimodal AGI – AI that can simulate reality and help humans in the physical world.HUMAIN to build Project Halo, one of the world’s largest AI compute clusters that will include the training of World Models, the next step in AI after LLMs - a potential trillion-dollar opportunity spanning entertainment, marketing/brands, education, world understanding, and robotics industries.Partnership includes HUMAIN Create, an initiative to build AI models trained on Arabic and regional data, helping enterprises and governments across MENA adopt culturally aligned AI. Luma AI, the frontier artificial intelligence company building multimodal AGI, today announced it has raised $900 million in Series C funding, led by HUMAIN, a PIF company delivering global full-stack AI solutions, with significant participation from AMD Ventures, and existing investors Andreessen Horowitz, Amplify Partners, and Matrix Partners. This press
Synthio Labs Raises $5 Million to Build the Voice AI Operating System for Life Sciences Customer Engagement19.11.2025 16:00:00 CET | Press release
Synthio Labs, a clinical-grade voice AI company transforming how life sciences organisations engage clinicians and patients, today announced that it has raised $5 million in seed funding. The round was led by Elevation Capital with participation from 1984 Ventures, Peak XV Partners, Y Combinator, and several strategic angels from the global healthcare and AI ecosystem. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251119509940/en/ Rajashekar Vasantha (left), Supreet Deshpande (center), and Sahitya Sridhar (right), the founding team behind Synthio Labs’ voice-powered AI platform for pharma “We believe Synthio Labs is defining the next major Customer Engagement infrastructure for Life Sciences. Their Clinical-grade Voice AI platform unifies how pharma communicates - giving field teams a powerful voice companion, and giving physicians and patients instant, trusted, compliant answers 24/7. Pharma’s global Commercial and GTM foo
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
