Business Wire

CA-INTEGRA

21.6.2022 15:47:07 CEST | Business Wire | Press release

Share
Integra Technologies Begins Production Shipments of Industry First 100V RF GaN

Integra, a leading provider of innovative RF and Microwave Power solutions that help make a safer and more connected world, today announced it has begun production shipments to US and European customers of its groundbreaking 100V RF GaN technology. Tom Kole, Integra’s Vice President of Sales and Marketing, said, “In collaboration with our customers, our system engineers have helped design new radar architectures that take full advantage of the benefits of our third generation 100V RF GaN technology. It’s exciting to see Integra’s 100V RF GaN products move into production with customers as it signifies another industry first.”

Integra also announced expansion of their 100V RF GaN product portfolio with the introduction of 7 new products for avionics, directed energy, electronic warfare, radar and scientific market segments with power levels up to 5kW in a single transistor. These products incorporate Integra’s 100V RF GaN technology optimized to deliver the highest power and efficiency in a single transistor while maintaining reliable operating junction temperatures. Combined with Integra’s thermally enhanced patents and transistor design expertise, these products offer reliable operation with a MTTF of 107 hours. Suja Ramnath, Integra’s President and CEO, said, “Integra has spent a decade innovating, maturing and commercializing our groundbreaking 100V RF GaN technology. Building upon our 25 year heritage of semiconductor innovation, this 3rd generation 100V RF GaN continues to extend our technical and market leadership.”

Additionally, Integra’s partner Teledyne e2v HiRel is offering high reliability options for all of Integra's 100V RF GaN power devices and pallets targeted at the defense market. Brad Little, Vice President and General Manager of Teledyne e2v HiRel, said, “Our space customers can benefit from Integra’s 100V RF GaN products combined with Teledyne’s expertise and long heritage providing space RF components. These innovative products offer space payload engineers state-of-the-art power devices for insertion into their applications.”

New 100V RF GaN parts introduced:

Part Number

Description

Market

IGW4000

100V, Ultra-Wideband Multi Chip Module

Electronic Warfare

IGN1012S2500

100V, 2.5kW L Band Directed Energy Transistor

Directed Energy

IGN1030S3100

75V, 3.1kW L Band Avionics Transistor

Avionics

IGN1030S3600

100V, 3.6kW L-Band Avionics Transistor

Avionics

IGN1313S3600

100V, 3.6kW 1.3GHz Scientific Transistor

Scientific

IGN1214M3200

75V, 3.2kW 1.2-1.4GHz, L Band Radar Transistor

L-Band Radar

IGN2729M1500

100V, 1.5kW 2.7-2.9GHz, S Band Radar Transistor

S-Band Radar

ABOUT INTEGRA TECHNOLOGIES, INC.

Founded in 1997, Integra is a leading innovator of RF and Microwave high power semiconductor and pallet solutions for mission-critical applications, including state-of-the-art radar, electronic warfare and advanced communications systems. www.integratech.com .

ABOUT TELEDYNE E2V HIREL ELECTRONICS

Teledyne e2v HiRel innovations lead developments in space, transportation, defense and industrial markets. Teledyne e2v’s unique approach involves listening to the market and to the application challenges of customers and partnering with our customers to provide innovative standard, semi-custom or fully custom solutions, bringing increased value to their systems. Teledyne e2v HiRel Electronics is part of the Teledyne Defense Electronics Group. www.tdehirel.com

Link:

ClickThru

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Blackstone Raises its Largest Asia Private Equity Fund at $13.1 Billion2.6.2026 03:00:00 CEST | Press release

Oversubscribed Fund More than Doubles Capital Raised for Predecessor Vehicle Blackstone (NYSE: BX) today announced the final close of Blackstone Capital Partners Asia III (“BCP Asia III”) at $13.1 billion, exceeding its $10 billion target and marking the firm’s largest private equity fundraise in the region. The oversubscribed fund reached its hard cap and builds on the strong performance of the strategy’s first two vintages, with this close representing more than double the amount of capital raised for its predecessor vehicle. Joe Baratta, Global Head of Blackstone Private Equity Strategies,said: “We are grateful for the continued trust of our investors in Blackstone and our leading Asia Private Equity franchise. This successful fundraise reflects the strength of our platform and our ability to perform through cycles. Asia Pacific is the fastest-growing region in the world, presenting compelling opportunities to invest at scale behind our high-conviction themes and deliver for our inv

Phison Unlocks Full-Scale AI Deployment Across Industries2.6.2026 02:00:00 CEST | Press release

Building an Ecosystem with Pascari aiDAPTIV™ Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a new strategic initiative at COMPUTEX 2026 under the theme “AI Enabler: Evolving Data Storage Intelligence.” Expanding beyond its role as a storage technology leader, Phison is taking a systems-level approach to AI solutions spanning AI infrastructure, edge AI computing and AI software platforms. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601070396/en/ Phison evolving data storage intelligence at COMPUTEX 2026 At COMPUTEX 2026, Phison is showcasing comprehensive AI storage and computing architecture solutions designed to address key challenges facing enterprises and end users in the AI era, including high AI deployment costs, GPU and memory limitations, data privacy concerns and the increasing storage bandwidth and power demands driven by AI workloads. Four Core Te

Phison Collaborates with Intel to Bring Larger Local AI Workloads to Intel AI PC Platforms2.6.2026 02:00:00 CEST | Press release

Phison's Pascari aiDAPTIV™ removes local memory constraints on client PCs, enabling larger MoE AI models and agentic AI applications COMPUTEX — Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a collaboration with Intel to enable AI PCs to deploy larger, more capable AI applications locally. The collaboration combines Intel® Core™ Ultra Series 3 processors with Phison’s Pascari aiDAPTIV, a memory extension solution that unblocks memory-constrained systems to support larger Mixture-of-Experts (MoE) AI models, longer-running AI sessions and agentic AI workflows. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601878925/en/ Phison and Intel collaborate to bring larger local AI workloads to Intel AI PC Platforms Today, AI PCs are moving beyond simple assistant applications toward more advanced local AI use cases. These solutions now support end users and businesses i

SymphonyAI Brings AI-Powered Assortment and Space Platform to Global CPGs, Compressing Category Review Cycles from Weeks to Days2.6.2026 00:35:00 CEST | Press release

CINDE Assortment and Space closes the loop between assortment, planogram, and in-store execution, proven across 500-plus global CPG deployments Planogram compliance failures, undetected out-of-stocks, and the lag between headquarters planning and store-level execution cost grocers measurably in comp sales, shrink, and associate labor hours. The tools built for category planning have never been designed to close that execution gap. In response, SymphonyAI, a global leader in Vertical AI, today announced the availability of CINDE Assortment and Space for CPGs, an AI platform that closes the loop between assortment strategy, planogram execution, and in-store compliance, compressing the category review cycle from four to six weeks to a matter of days. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260602137061/en/ The platform is underpinned by SymphonyAI's Transferable Demand AI, a model trained across 25 years of retail data a

SymphonyAI Launches CINDE Retail Media Intelligence to Connect Merchandising and Media for Mid-to-Large Grocers2.6.2026 00:05:00 CEST | Press release

CINDE RMI connects merchandising and retail media in a single closed-loop platform — without replacing your existing retail media stack Retail media has become the fastest-growing profit line in grocery, yet the billions of dollars CPG advertisers invest in it every year flow through a system where media buyers and merchants never see the same data. Merchants plan assortments, negotiate trade spend, and execute resets with no visibility into which CPG media investments are driving category velocity, while CPG advertisers renew or walk based on incrementality proof that most retailers cannot provide. To solve for this, SymphonyAI, a global leader in Vertical AI, today announced the general availability of CINDE Retail Media Intelligence (RMI), an AI platform that connects merchandising, media, and shopper intelligence into a single closed-loop system, giving retailers and CPG partners shared visibility into how every media dollar moves category turns, trade spend ROI, and gross margin a

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye