CA-GRAI-MATTER-LABS
23.11.2020 20:02:11 CET | Business Wire | Press release
GrAI Matter Labs, a pioneer of brain inspired ultra-low latency computing, today announced its latest financing round of $14 million. The round was led by iBionext, joined by all existing investors and newly welcomed Bpifrance through the Future Investment Program and Celeste Management. The company will utilize the funds to accelerate design and market launch of its first GrAI® full-stack AI system-on-chip platform, to deliver on customer needs at the edge.
GrAI Matter Labs’ programmable NeuronFlow™ technology enables industry-leading inference latency efficiently – more than an order of magnitude better than competing solutions. Its current accelerator chip GrAI One and the GrAI One HDK are available for product evaluation and application programming. The upcoming GrAI® full-stack AI system-on-chip platform will drive a significant step in visual inference capabilities in robotics, industrial automation, AR/VR and surveillance products and markets.
“Securing this funding round is a testament to our breakthrough innovation and market potential. We are excited to bring the fastest AI per Watt to every device on the edge,” said Ingolf Held, CEO of GrAI Matter Labs. “This funding will help us to partner with application specialists and integrators, and to deliver best-in-class visual inference performance, system-on-chip platforms and end-to-end applications to our customers.”
“GrAI Matter Labs has demonstrated a unique architecture capability with NeuronFlow and GrAI One - an industry first silicon compute and machine learning architecture based on learnings from biology and the human brain,” said Bernard Gilly, Chairman of iBionext. “We are thrilled with the prospects of GrAI Matter Labs and look forward to grow the company to become a major success.”
“GrAI Matter Labs has established a technology leadership position within the rapidly emerging edge computing market,” said Dimitri Boulanger, CEO of Celeste Management. “We expect the company to develop into a leading AI computing platform supplier across segments of this market, which is set to grow to billions of dollars over the coming years.”
“The market for edge AI inferencing is the most active segment of the AI chip market. GML has developed several innovations that combined have produced an outstanding AI accelerator,” said Michael Azoff, Chief Analyst, Kisaco Research. “It is exploiting sparsity (spatial and temporal) in the input data that is the stand-out approach taken by GML.”
About GrAI Matter Labs
GML’s mission is to bring fastest edge AI per Watt for sensor analytics and machine learning to every device on the edge. GrAI Matter Labs has offices in Paris / France, in Eindhoven / The Netherlands and in San Jose / Silicon Valley. It is led by a team of visionary and seasoned engineers, and is backed by leading investors including iBionext, 360 Capital Partners and 3T Finance. For more information, please visit www.graimatterlabs.ai .
View source version on businesswire.com: https://www.businesswire.com/news/home/20201123005371/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom