CA-GOTRUSTID-INC.
23.3.2021 16:02:07 CET | Business Wire | Press release
Today, GoTrustID Inc. (GoTrust) announced that their Idem Keys have been upgraded from FIDO2 Security Level 1 to Security Level 2 certification for passwordless login for devices, applications and cloud services. The Idem Keys have USB-A, USB-C and NFC interfaces. All GoTrust Idem Keys work with Windows, MAC, Chromebook, iOS and Android phones. The Idem Key can also be used for physical access.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210323005056/en/
An eager customer for the GoTrust Level 2 Idem Key is the mojeID Identity service provided by CZ.NIC. Authorized by the Czech Ministry of the Interior, mojeID is able to access online government services. There are 700,000 users registered with mojeID today.
Going forward, to access more sensitive sites that require the highest level of assurance (LoA) such as opening a bank account or potentially in the future transferring property in property registry, mojeID users will need to use a FIDO2 Security Level 2 token with a security element certified by FIPS/CC. The only such token on the market today that works across every user device is the GoTrust Idem Key. “We were delighted to find exactly the token we required to get LoA High accreditation,” commented Ondřej Filip, CEO at CZ.NIC. “Cooperation with GoTrustID Inc. has been perfect since the beginning and we really admire their decision to go the through L2 certification process.”
Shipment of Idem Keys to CZ.NIC has already started and is expected to grow rapidly as the demand for the highest LoA services increases.
About GoTrustID Inc.
GoTrustID Inc. (GoTrust) is the pioneer company providing a passwordless multi-factor authentication (MFA) platform for an employee’s everyday items: phone, a USB Key or their smart badge. Our mission is to make simple & secure login anywhere and anytime. With every authenticator and server certified by FIDO, GoTrust Authentication Platform makes every employee become their own ID, having effortless login to their computer, corporate systems and cloud services. GoTrustID has twenty-four international patents granted, including six US patents.
GoTrust FIDO2 Security Level 2 Idem Key is available on Amazon. https://www.amazon.com/dp/B07YTL3Q1Y?ref=myi_title_dp
About CZ.NIC
CZ.NIC, z. s. p. o., is an interest association of legal entities, founded in 1998. The association currently has 117 members. One key activity of the association is the operation of the domain name registry for the .CZ domain. The association is now intensively working on development of the mojeID service supporting new technologies and projects beneficial to the Internet infrastructure in the Czech Republic.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210323005056/en/
Link:
Social Media:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom