CA-GLOBALLOGIC
28.9.2021 02:02:16 CEST | Business Wire | Press release
Hitachi, Ltd. (TSE: 6501, “Hitachi”) and GlobalLogic*1 , a Hitachi Group Company, today announced the launch of a collaborative hub to promote digital transformation (DX) services in the Japanese market. Based in the Lumada Innovation Hub Tokyo*2 , a co-creation base for Hitachi, this collaboration hub combines capabilities of GlobalLogic and Lumada. Delivering on the joint integration strategy, this partnership aims to jump-start GlobalLogic’s entry into Japan, and will accelerate business development for design-led Digital Engineering services of GlobalLogic, establishing a system to support customers in Japan starting from fiscal 2022.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210927005848/en/
"The market demand for DX continues to grow at a fast pace, as global brands increasingly leverage digital technologies to create new revenue streams and better engage customers,” said Nitesh Banga, Chief Operating Officer, GlobalLogic. “GlobalLogic and Hitachi are well positioned to address this need, and the launch of the collaboration Hub will be a great first step in bringing expanded DX capability to the Japan market."
Recently acquired by Hitachi in July 2021 and operating as a Hitachi Group Company, GlobalLogic is a leader in Digital Engineering services, with capabilities that span Strategy, Experience Design, and Chip-to-Cloud software engineering. GlobalLogic not only provides upstream services such as product ideation, but also implements that vision into actual products, platforms, and experiences.
Hitachi has the expertise and experience in DX that has been cultivated in the Lumada business, including design thinking and data science, and is working with customers and partners to create new value by combining wisdom and ideas.
As the first project to leverage the strengths of both companies, Hitachi and GlobalLogic have begun work to accelerate the transformation of Hitachi's Storage business into a cloud-based "as-a-Service" business model. This initiative will enable Hitachi and GlobalLogic to create and customize joint service offerings for the Japanese market.
About the Collaboration Between Hitachi and GlobalLogic
Lumada Innovation Hub Tokyo and GlobalLogic's design studios and engineering centers around the globe are connected online, and workshops are being conducted for collaborative projects, leveraging GlobalLogic's extensive DX implementation experience, experience design, and capabilities in Chip-to-Cloud software engineering. Hitachi and GlobalLogic will implement projects that accelerate DX for customers in Japan.
Design thinkers*3 from Lumada Innovation Hub Tokyo, with expertise in the industries and businesses of the Japanese market, will work with Hitachi business stakeholders and GlobalLogic's designers and solution architects to identify transformational goals. GlobalLogic's rapid problem-solving approach will be applied to develop DX strategies and quickly create business model prototypes.
The first workshop was held for Hitachi's storage business, where Hitachi and GlobalLogic worked on architectures to enhance cloud readiness. By leveraging GlobalLogic's digital engineering services, Hitachi will strengthen and accelerate its "as-a-Service" model for its storage business. Hitachi and GlobalLogic will apply the outcomes of this workshop to Hitachi's other product businesses to accelerate DX for its customers.
Future Opportunities
Based on the new, co-created business process established through this project, Hitachi will test its applicability against a variety of digital transformation projects and plans to launch the service to Japanese customers in fiscal 2022.
In the future, GlobalLogic's more than 22,000 design and software engineering professionals around the world and Hitachi's 35,000 digital professionals will work together through the Lumada Innovation Hub Tokyo to promote Social Innovation Businesses that leverage digital technology to solve problems faced by customers and society globally, including the Japanese market.
Collaboration Introduction at Hitachi Social Innovation Forum 2021 JAPAN
You can learn more about this collaboration at the “Hitachi Social Innovation Forum 2021 JAPAN” from October 11th (Monday) to 15th (Friday), 2021. The project will be showcased in the following sessions:
- October 11, 9:00-9:25 a.m. Keynote Speech: Toshiaki Higashihara "Future Achieved by DX of Social Infrastructure – Sustainable Society and Creative Consumer”
- October 12, 9:30-10:00 a.m. Highlight Session "Towards Becoming a Global DX Partner – Hitachi’s Acceleration of Global Lumada Business”
- October 12, 1:30-1:50 p.m. Seminar "How to Combine Knowledge and Ideas by Lumada”
Hitachi Social Innovation Forum 2021 JAPAN Official Site: https://www.service.event.hitachi/en/
About GlobalLogic
GlobalLogic (www.globallogic.com ) is a leader in digital product engineering. We help brands across the globe design and build innovative products, platforms, and digital experiences for the modern world. By integrating experience design, complex engineering, and data expertise -- we help our clients imagine what’s possible and accelerate their transition into tomorrow’s digital businesses. Headquartered in Silicon Valley, GlobalLogic operates design studios and engineering centers around the world, extending our deep expertise to customers in the communications, financial services, automotive, healthcare and life sciences, technology, media and entertainment, manufacturing, and semiconductor industries. GlobalLogic is a Hitachi Group Company.
About Lumada Innovation Hub Tokyo
Lumada Innovation Hub Tokyo is a place where knowledge and ideas are crossed to stimulate innovation. It offers workshops and idea generation with digital human resources such as Design Thinkers and Data Scientists who are familiar with the Japanese market, as well as agile development services that utilize the Digital Transformation experience of the Lumada business.
https://www.hitachi.com/products/it/lumada/global/en/innovation_hub/index.html
About Hitachi, Ltd.
Hitachi, Ltd. (TSE: 6501), headquartered in Tokyo, Japan, is contributed to a sustainable society with a higher quality of life by driving innovation through data and technology as the Social Innovation Business. Hitachi is focused on strengthening its contribution to the Environment, the Resilience of business and social infrastructure as well as comprehensive programs to enhance Security & Safety. Hitachi resolves the issues faced by customers and society across six domains: IT, Energy, Mobility, Industry, Smart Life and Automotive Systems through its proprietary Lumada solutions. The company’s consolidated revenues for fiscal year 2020 (ended March 31, 2021) totaled 8,729.1 billion yen ($78.6 billion), with 871 consolidated subsidiaries and approximately 350,000 employees worldwide. For more information on Hitachi, please visit the company's website at https://www.hitachi.com .
*1 - July 14, 2021 News Release "Hitachi Completes Acquisition of GlobalLogic” https://www.hitachi.com/New/cnews/month/2021/07/f_210714.pdf
*2 - March 22, 2021 News Release " Hitachi Establishes Lumada Innovation Hub Tokyo to Accelerate the Lumada Movement Through New Collaborative Creation With a View to the Post-COVID-19 World” https://www.hitachi.com/New/cnews/month/2021/03/210322a.html
*3 - Design Thinker: Digital human resources who can discover essential corporate issues and propose DX by utilizing design thinking.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210927005848/en/
Link:
Social Media:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom