CA-ERGOMOTION
21.12.2020 20:42:12 CET | Business Wire | Press release
Ergomotion , the largest manufacturer of adjustable bases worldwide, has launched Quest, a new product designed to empower a proactive healthy lifestyle with in-home solutions, and their first entry into an e-commerce site with Direct-to-Consumer products. Quest was created to assist everyone on their wellness journey. The line consists of three different models and a modified design to target consumers at all price points. The product line will be available at local retailers and on Ergomotion’s website .
The new Quest line is a more diverse and advanced product that was developed for a generation that prioritizes health and wellness, including better sleep at an affordable price. As consumers begin to embrace a more holistic approach to health, they want to feel comfortable at home, increasing demand in wellness with home-based products, especially during COVID times. Ergomotion understands the importance of taking better care of yourself during these unprecedented times and the need to enhance the overall quality of life, starting with one’s sleep. Quest adjustable bed bases are equipped with all of your bedroom needs; providing a place to recharge after a long day to simply controlling your bed settings through wand voice activation.
“We’ve been evolving our product collection through a combination of innovative technology and a seamless integration to a healthier lifestyle at a reasonable price,” says Johnny Griggs, Chief Operating Officer at Ergomotion. “The current lifestyle changes that are being experienced worldwide have provided insight to how we are a more health conscious generation, allowing us to focus on what the consumer truly needs and wants in their own home.”
Technology-specific trends are helping the Ergomotion team create products that will be mutli-functional, adaptable, technology infused and overall, more accessible and cost-effective for everyone. The exclusive design benefits of the new Quest product line include:
- Light Weight for the “mobile” customer
- 3 step set-up
- Under 10 min assembly
- Courier Friendly
- Contactless Delivery
- Foldable – Easy Storage
- Wand voice activation
You can learn more about Ergomotion and the Quest product at www.ergomotion.com .
ABOUT ERGOMOTION
Ergomotion, headquartered in Santa Barbara, California, is the largest manufacturer of adjustable bases worldwide. The company’s products are created to provide a holistic wellness solution infused with smart technology to enrich sleep, health, and the overall quality of life. Ergomotion’s adjustable bases are designed to accommodate the industry’s leading mattresses and to seamlessly integrate with existing bed frames. The products have been sold in more than 30 countries to over 170 major brands. Ergomotion is part of the Keeson Technology Corp. family based in Jiaxing City, China. To learn more about Ergomotion visit www.ergomotion.com .
View source version on businesswire.com: https://www.businesswire.com/news/home/20201221005690/en/
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom