CA-CRATEDB
1.3.2023 14:16:17 CET | Business Wire | Press release
CrateDB, the distributed SQL database company enabling data insights at scale, is pleased to announce the appointment of Lars Färnström as new Chief Executive Officer (CEO). With expansive leadership experience across the software sector, Lars is tasked with taking CrateDB into a new phase of growth as it looks to deliver data-driven decision making to global enterprises.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230228005068/en/
Real-Time Analytics Database Company CrateDB Names Lars Färnström as New CEO (Photo: Business Wire)
Lars Färnström, CEO, CrateDB - “I am thrilled to join the talented team at CrateDB and help drive the next phase of growth for this innovative database company. CrateDB addresses the urgent need for companies to make data driven decisions in real-time and leverage the power of insight that AI/ML can bring.”
“CrateDB is unique in this sense it allows developers, data engineers and data scientists to use standard SQL to access and query time series data, relational data, semi-structured data, complex files like JSONs, geo-spatial, full text and blobs. CrateDB stores all this critical data in a single unified database and delivers results in real-time, at a scale and with low costs – on-premise, in the cloud and at the Edge. These are unique capabilities any company needs to remain competitive.”
“We are incredibly pleased to announce Lars as our new CEO. After speaking with Lars about his experience and vision for CrateDB, we knew immediately that he is the person to take the company forward. Lars’ knowledge of the software sector, and in particular the ability for data to transform how enterprises operate, will be hugely significant for CrateDB.” - Alois Flatz, Chairman of the Board, CrateDB.
Lars Färnström has more than 25 years of experience in the software industry, where he has held a variety of senior and executive positions in management, sales, marketing, product marketing and program management. He joins CrateDB from C3.ai where he was responsible for the Nordics, Benelux, and Switzerland. Prior to C3.ai, he worked for small, medium, and large enterprises such as HPE, Siebel Systems, GoodData, and Board International where he helped scale their businesses.
For more information about CrateDB, visit www.crate.io.
ENDS
About CrateDB
CrateDB is a real-time analytics database solution, enabling data insights at scale. CrateDB’s ability to ingest and manage massive amounts of data from diverse sources empowers companies worldwide to turn data into business value.
CrateDB was founded in 2013 and operates globally with offices in Germany, Austria, Switzerland and the US. In 2021, CrateDB was named as an Honorable Mention in the 2021 Gartner Magic Quadrant for Cloud Database Management Systems and won the IoT Evolution Industrial IoT Product of the Year Award. Clients maximizing their data potential with CrateDB include ABB, Alpla, Rauch, TGW Logistics, and Bitmovin.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230228005068/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom