Business Wire

CA-CEPTON-TECHNOLOGIES

19.8.2021 15:02:13 CEST | Business Wire | Press release

Share
Cepton Lidar Innovations Score Twice at the 2021 Tech.AD Europe Awards

Leading lidar solutions provider Cepton received two recognitions at Tech.AD Europe this year for its innovations, adding to the company’s growing portfolio of award-winning lidar solutions across industries.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210819005247/en/

Tech.AD is a leading technical conference in Europe focused on technologies for autonomous driving (AD) and the advancements of artificial intelligence (AI) technology in the automotive industry. The annual Tech.AD Europe Award exclusively honors "extraordinary projects in the automotive industry and celebrates exceptional solutions & innovations." Awards are announced after submissions are rated by a jury of some of the top subject matter experts in Europe.

Cepton was recognized in the category of Most Innovative Use of Artificial Intelligence & Machine Learning in the Development of Autonomous Vehicles & Respective Technologies for its Nova lidar . Second place award-winner in this category, Nova is a pathbreaking miniature, wide field of view (FOV) lidar sensor for near-range perception in advanced driver assistance systems (ADAS), autonomous vehicle (AV) and autonomous ground vehicle (AGV) applications. Nova provides an attractive combination of performance, compactness, FOV coverage and affordability and enables a range of use cases such as high-accuracy blind spot detection, small object detection, automated park assist and free space estimation around the vehicle.

Another award was given to a Cepton lidar-enabled smart cities project - Traffic Monitoring as Source of Training Data for Autonomous Vehicles - by Cepton partner ALP.Lab , which won the top prize in the category of Most Advanced Real-Life Testing & Simulation Techniques in Autonomous Driving . Deployed in the City of Graz, the ALP.Lab project utilizes Cepton’s Helius ® Smart Lidar System and Vista® -P lidars to enable advanced, real-time, 3D traffic and pedestrian analytics. According to ALP.Lab, “the enormous amount of time and expense involved in collecting training data for ADAS/AD development can be dramatically reduced by this new and sustainable lidar perception based technique focused on specific roads and environments likely to generate the most diverse and difficult driving environments.”

The Tech.AD Europe awards represent a continuation of past recognitions of Cepton’s lidar innovations. Previously, Cepton received awards for its lidar solutions across multiple applications, including the AUVSI XCELLENCE in Innovation Award in 2019 for the Sora™ lidar, the Security Today New Product of the Year Award in 2019 in the Perimeter Protection category for the first generation of Helius® known as Vista-Edge, the Autonomous Vehicle Technology ACES Award in 2020 jointly with Cepton partner Dataspeed for the Vista® -P lidar, and the CES Innovation Award in 2020 in two categories – Smart Cities and Tech for a Better World – for the Helius® Smart Lidar system, that also includes our Vista® -P lidars.

Dr. Jun Pei, CEO of Cepton, said: “The awards at Tech.AD Europe were not only based on jury selection, but also based on the voting of all of the conference attendees representing leading automotive OEMs, autonomous vehicle companies, Tier 1 suppliers, and other R&D organizations worldwide. We are grateful for this recognition and what it represents for the continued innovation we are bringing to market using our MMT® lidar technology. Increasingly, the role of Cepton lidars in the future of mobility is becoming clear worldwide and we are pleased to work with global partners such as ALP.Lab in advancing safety and autonomy.”

About Cepton Technologies, Inc.

Cepton provides state-of-the-art, intelligent, lidar-based solutions for a range of markets such as automotive (ADAS/AV), smart cities , smart spaces and smart industrial applications. Cepton’s patented MMT® -based lidar technology enables reliable, scalable and cost-effective solutions that deliver long range, high resolution 3D perception for smart applications.

Founded in 2016 and led by industry veterans with over two decades of collective experience across a wide range of advanced lidar and imaging technologies, Cepton is focused on the mass market commercialization of high performance, high quality lidar solutions. Cepton is headquartered in San Jose, California, USA, with a presence in North America, Germany, Japan, India and China, to serve a fast-growing global customer base. For more information, visit www.cepton.com and follow us on Twitter and LinkedIn .

Link:

ClickThru

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release

Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana

Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp

Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release

Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve

ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release

ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material

ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release

Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye