AXWAY
20.4.2016 08:01:53 CEST | Business Wire | Press release
Axway , a market leader in digital business enablement, is pleased to be the technology partner of Les Echos, the leading business and financial daily media in France, in support of its premier Hackathon event, “Hackapress des Echos ” in Paris, France. In less than 48 hours, 50 developers and designers in eight teams will compete to deliver the most innovative code that will better enable Les Echos’ use of data to enrich editorial work. With a successful track record enabling hackathons and other digital transformation initiatives, Axway will provide the digital platform for the event.
Today’s digital economy forces organizations to reinvent traditional business with innovative services. Many of them take advantage of hackathons to find new creative ways to provide better customer experiences and to build a digital culture between teams.
With the objective to reenergize the way Les Echos journalists work with their content in today’s digital age, “Hackapress des Echos” will help to forge connections between student developers, designers, and startups. Axway commits to innovation by supporting partners’ hackathon initiatives with API Management , providing technological means for hackathoners to utilize data intelligently to engage with their digital ecosystem, harvest information from data sources, and develop new methods for their projects.
“We are looking forward to seeing what creative and original projects the teams are able to develop, and this is exciting,” said Jeanine Banks, executive vice president, global products and solutions. “We believe that the future of digital business relies not only on APIs and other digital transformation technologies, but also the young minds of those who innovate.”
To stimulate and assist participants in preparing their projects, representatives from Les Echos (including journalists) will be present as mentors, observers, or participants. Teams will then present their projects at the conclusion of the event. The jury will be composed of Francis Morel, Chairman of Groupe Les Echos; Henri Gibier, Director of Editorials Developments Groupe Les Echos; Digital Village (start-ups and individuals freelancers specialize in digital); and Raise investment company.
The prize for winners, sponsored by Axway, will be presented by Francis Morel, and Bruno Patino (Director of the Journalism School of Sciences Po).
WHAT: Hackapress des Echos
WHEN: April 28-29, 2016
WHERE: Sciences Po Paris, 27 Rue Saint-Guillaume, 75007 Paris
PARTNERS OF HACKATHON DES ECHOS: Axway, Sciences Po, Digital Village, Digital Campus, Paris City Hall and Raise Endowment Fund
WHO: Students, freelancers, startups and observing outsiders
REGISTRATION: All attendees must register, here .
Follow Axway’s news on Twitter: @Axway #APIFirst #DigitalBusiness
About Axway
Axway (Euronext:AXW.PA) empowers more than 11,000 customers worldwide to collaborate smarter, innovate faster and engage better with their partners, developers and customers. From integration technology that securely connects people, processes and things to an engagement platform that enables API management, identity management, mobile app development and analytics, Axway solutions are enabling digital business. Axway is registered in France with headquarters in the United States. More information is available at: www.axway.com
View source version on businesswire.com: http://www.businesswire.com/news/home/20160419006912/en/
Contact:
Media
Neil Desai, 415-856-5150
Blanc & Otus
neil.desai@blancandotus.com
Link:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Westlake Epoxy Expands Distribution Relationship with Brenntag to India18.2.2026 02:30:00 CET | Press release
Westlake Corporation (NYSE: WLK) today announced that Westlake Epoxy will expand its long‑standing distribution relationship with Brenntag to South and West India. The agreement builds on a successful collaboration across Europe, North and South America, and Southeast Asia, extending Westlake Epoxy’s reach into one of the world’s fastest‑growing coatings, adhesives and construction markets. Under the expanded collaboration, Brenntag will distribute Westlake Epoxy’s established portfolio of epoxy solutions for coatings, adhesives and construction applications, including the EPON™, EPIKOTE™, EPIKURE™ and EPI‑REZ™ product lines. Customers are expected to benefit from reliable local supply, technical service and application‑focused formulation support tailored to regional requirements. India’s coatings, adhesives and construction sectors continue to grow, driven by infrastructure investment, urbanization and increasing performance expectations. By combining Westlake Epoxy’s proven epoxy te
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
