ADVA
16.12.2020 17:02:35 CET | Business Wire | Press release
ADVA (FSE: ADV) today announced that its technology has been selected for Germany’s first open radio access network (O-RAN) proof of concept (PoC). Conducted by Telefónica Germany / O2 , the field trial is a major step towards open and disaggregated RAN architectures. Built on Ensemble Activator , ADVA’s carrier-grade network operating system (NOS) running on Edgecore’s white box switches, and the OSA 5401 , ADVA’s pluggable grandmaster clock and GNSS receiver, the PoC shows how Telefónica Germany / O2 can build disaggregated and vendor-neutral mobile networks that significantly reduce deployment and operational costs. The unique combination of ADVA’s expertise in carrier-grade NOS technology and its Oscilloquartz synchronization solution has enabled this PoC to go beyond other such trials and address the most stringent network timing requirements.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20201216005737/en/
“This PoC is an important stage in our journey towards open 5G networking. It shows how we can achieve the scale and agility needed for the widespread rollout of next-generation mobile services and underlines the benefits of vendor collaboration and interoperability,” commented Matthias Sauder, director, mobile access network, Telefónica Germany / O2 . “With this open RAN pilot in our O2 live network, we’re highlighting what can be achieved when industry leaders from across the value chain cooperate closely together in an open environment. We’re also proving that a disaggregated model built on affordable software-empowered hardware can deliver transport infrastructure with new levels of efficiency – for 4G as well as 5G networks in the future.”
The multi-vendor PoC is built on ADVA’s feature-rich Ensemble Activator running on Edgecore’s switching device. Developed as part of the Telecom Infra Project (TIP), the software frees mobile network operators (MNOs) from closed proprietary systems and enables them to create vendor-neutral disaggregated infrastructure with best-of-breed components. The OSA 5401’s time synchronization capabilities are also central to the Telefónica Germany / O2 trial, including its ability to send PTP sync information and corresponding messages with precise timestamping data. The OSA 5401 also makes this advanced operation compatible with 5G radio access points from third-party suppliers and augments the accurate timing needed.
“By harnessing our high-performance NOS and compact timing solution, Telefónica Germany / O2 is taking a big step towards open and disaggregated 5G networking. This PoC shows how it will be able to utilize RAN technology from multiple vendors and leverage the full benefits of separated software and hardware,” said Eli Angel, VP, product line management, ADVA. “As we’re proving in multiple real-world trials with major MNOs, our Ensemble Activator is the ideal choice for turning third-party white box switches from a wide range of suppliers into disaggregated cell site gateways (DCSGs). What’s more, our OSA 5401 provides the strict timing and interoperability needed for an open model. To put it simply, our technology is the key to making open RAN work.”
About ADVA
ADVA is a company founded on innovation and focused on helping our customers succeed. Our technology forms the building blocks of a shared digital future and empowers networks across the globe. We’re continually developing breakthrough hardware and software that leads the networking industry and creates new business opportunities. It’s these open connectivity solutions that enable our customers to deliver the cloud and mobile services that are vital to today’s society and for imagining new tomorrows. Together, we’re building a truly connected and sustainable future. For more information on how we can help you, please visit us at www.adva.com .
Published by:
ADVA Optical Networking SE, Munich, Germany
View source version on businesswire.com: https://www.businesswire.com/news/home/20201216005737/en/
Social Media:
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
Toshiba Showcases End-to-End Innovations Shaping What’s Next in Retail at EuroShop 202617.2.2026 15:45:00 CET | Press release
At EuroShop, Toshiba showcases intelligent, scalable solutions that combine AI, computer vision, and energy-efficient design to transform the future of retail. At EuroShop 2026, Toshiba Global Commerce Solutions will showcase how retailers across Europe are using scalable, sustainable innovation to address today’s challenges and build what’s next. Exhibiting in Hall 6, Booth C41 from the 22nd to 26th February, Toshiba will demonstrate technologies designed to evolve with retailers, empowering flexibility, resilience, and long-term growth, and prepare them for what’s next. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260216755053/en/ At EuroShop, we’re showing how Toshiba empowers retailers across all segments to transform with confidence by scaling intelligent solutions to deliver lasting impact. “Retailers are under pressure to move faster, operate more efficiently, and deliver better experiences than ever before. At Euro
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom