Business Wire

ADVA

1.12.2022 09:02:15 CET | Business Wire | Press release

Share
ADVA answers on-premises cloud demand with Ensemble Cloudlet

ADVA (FSE: ADV) today expanded its uCPE solution with Ensemble Cloudlet. This new software is a direct response to the growing demand from enterprises for on-premises cloud solutions. With Ensemble Cloudlet, enterprises can harness edge computing to meet low-latency requirements for applications such as private 5G, AR and smart manufacturing. Removing the need for central hosting also boosts security and makes mission-critical applications more resilient. For CSPs, Ensemble Cloudlet creates an entirely new use case for uCPE. It enables them to offer customers an easily scalable edge cloud with localized control. With Ensemble Cloudlet, CSPs can effortlessly deploy and manage tens of thousands of edge clouds to host customer IT workloads, opening up a wealth of new revenue streams.

“Our Ensemble Cloudlet is a key step in the evolution of the cloud. No longer is it something hosted solely in large, centralized data centers. Now it’s easy to harness the benefits of multi-node clouds right on the customer premises. That means enterprises can utilize applications that require access to compute resources with extremely low latency. It also gives organizations with highly sensitive data the ability to keep all information in a specific area for complete data sovereignty,” said Mike Heffner, GM at Edge Cloud, ADVA. “And for CSPs, our Ensemble Cloudlet opens the door to a world of new opportunities. They already have the infrastructure in place to deliver hybrid workload clouds at the customer edge. Now we’re providing the easy scalability and secure remote management capabilities to make it work. CSPs can start with a single node and then scale up to meet customer demand.”

Ensemble Cloudlet extends traditional uCPE deployments by clustering multiple nodes together in a single cloud and delivering managed on-premises edge computing. With zero-touch provisioning, it makes deployment easy for teams without specialized expertise. Far more cost-efficient than data center cloud solutions, Ensemble Cloudlet also boosts resilience through redundant local cloud controllers and by enabling remote management. This is achieved with ADVA’s Ensemble management and orchestration suite, including Ensemble Orchestrator and Ensemble Virtualization Director, which features automation tools that reduce the need for technical resources and expert personnel.

“The launch of our Ensemble Cloudlet is big news for CSPs. The boom in uCPE deployments puts them in the perfect position to create scalable edge clouds with localized control. Now we’re giving them the tools they require to seize this new opportunity,” commented Brian Van Voorhis, director of PLM at Edge Cloud, ADVA. “For a growing number of applications, the model of a centralized data center cloud just doesn’t fit. Now CSPs can give customers access to the local cloud computing they need for use cases including VR and industrial IoT. From providing standalone resilience when network links fail to reducing backhaul for applications such as video surveillance, our Ensemble Cloudlet will be a game changer.”

Further details on Ensemble Cloudlet are available in this solution brief: https://adva.li/ensemble-cloudlet-solution-brief.

Supporting slides are also available: https://adva.li/ensemble-cloudlet-slides.

About ADVA
ADVA is a company founded on innovation and focused on helping our customers succeed. Our technology forms the building blocks of a shared digital future and empowers networks across the globe. We’re continually developing breakthrough hardware and software that leads the networking industry and creates new business opportunities. It’s these open connectivity solutions that enable our customers to deliver the cloud and mobile services that are vital to today’s society and for imagining new tomorrows. Together, we’re building a truly connected and sustainable future. For more information on how we can help you, please visit us at www.adva.com.

Published by:
ADVA Optical Networking SE, Munich, Germany
www.adva.com

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20221130005854/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Biocytogen Announces Clinical Milestone with First Patient Dosed in Phase 1 Trial of IDEAYA’s First-in-Class B7H3/PTK7 Bispecific TOP1 ADC IDE03428.2.2026 01:00:00 CET | Press release

IDE034 is a B7H3/PTK7 bispecific TOP1 ADC designed to target tumor cells expressing both B7H3 and PTK7 preferentially, and is being evaluated as monotherapy and in combination with IDEAYA’s PARG inhibitor IDE161. IDEAYA has dosed the first patient in its Phase 1 trial of IDE034, initially evaluating safety, tolerability, and PK. First dosing triggers a $5 million milestone payment to Biocytogen under the companies’ option and license agreement. Biocytogen Pharmaceuticals (Beijing) Co., Ltd. (Biocytogen, SSE: 688796; HKEX: 02315), a global biotechnology company that drives the research and development of novel antibody-based drugs with innovative technologies, today announced that its partner IDEAYA Biosciences, Inc. (“IDEAYA”; Nasdaq: IDYA) has dosed the first patient in IDEAYA’s Phase 1 dose-escalation/expansion clinical trial of IDE034, an investigational B7H3/PTK7 bispecific TOP1 ADC. Pursuant to the companies’ option and license agreement, first patient dosing triggers a $5 million

IQM and Real Asset Acquisition Corp. to Host Conference Call/Webcast to Discuss Proposed Transaction27.2.2026 13:00:00 CET | Press release

IQM Finland Oy, a global leader in full-stack superconducting quantum computers (“IQM”, “IQM Quantum Computers” or the “Company”), and Real Asset Acquisition Corp. (Nasdaq: RAAQ), a special purpose acquisition company (“RAAQ”), announced that they will host a conference call to discuss their recently announced business combination, including certain transaction highlights. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260227472716/en/ IQM Radiance quantum computer As previously disclosed, on February 23, 2026, IQM and RAAQ announced they have entered into a definitive business combination agreement, which will result in IQM becoming a public company and listing American Depositary Shares on one of the two leading U.S. stock exchanges. The transaction provides funding with the aim to accelerate IQM’s technology and commercial development towards fault-tolerance quantum computing, further advancing its position as a leading p

HighRadius Launches $0 Implementation Fee, $0 Subscription Fee via Outcome Based Pricing for oCFO Software27.2.2026 12:00:00 CET | Press release

HighRadius launches Office of the CFO first Outcome Based Pricing with $0 Implementation fee and $0 Subscription until Go-Live. Customers only pay a fraction of realized gains based on P&L impact. Chapter 1: Outcome Based Pricing (OBP)Introduction of OBP: HighRadius, a provider of 190+ AI agents for Order-to-Cash, Accounts Payable, Record-to-Report, and Treasury introduces Outcome Based Pricing (OBP). Three Components of OBP: Customers pay a) $0 in Implementation fees, b) $0 in Subscription fees until Go Live, c) HighRadius earns a fraction of the actual savings realized by the client. Chapter 2: US GAAP & ASC 606 ConstraintsNot Designed for Innovation: The traditional ASC 606 model requires companies to standardize and recognize revenue based on contractual obligations. For a traditional SaaS subscription, the obligation is access to software over time. AI agents are designed to deliver quantifiable, real-time Business Outcomes that do not fit the traditional accounting framework. Cha

Kioxia Appoints Yoshihiko Kawamura as Chief Financial Officer27.2.2026 09:15:00 CET | Press release

Kioxia Holdings Corporation (TOKYO:285A), a world leader in memory solutions, today announced the appointment of Yoshihiko Kawamura as Chief Financial Officer (CFO), effective April 1, 2026. Mr. Kawamura brings extensive international experience to Kioxia, having held assignments at Mitsubishi Corporation’s U.S. headquarters, served as General Manager of its Chicago office, and completed a tenure at the World Bank. At Hitachi, Ltd., he held senior leadership positions, including Chief Strategy Officer (CSO), Chief Financial Officer (CFO), and Chief Risk Management Officer (CRMO), where he was instrumental in leading the company’s management reforms. Since joining Kioxia as Executive Vice President in June 2025, Mr. Kawamura has worked closely with the executive team to advance the business through strategic capital and financial planning. Following its initial public offering on the Prime Market of the Tokyo Stock Exchange in December 2024, Kioxia is entering a new phase of growth char

DNP Invests in Rapidus to Support the Establishment of Mass Production for Next-Generation Semiconductors27.2.2026 08:18:00 CET | Press release

Will accelerate the development and mass production of EUV lithography photomasks Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) today announced that it has participated in Rapidus Corporation’s funding round as one of the round investors. This strategic funding initiative supports Rapidus’ plan to steadily progress from its current R&D phase to mass production of 2nm (10⁻⁹ meters) logic semiconductors by 2027. Through this initiative, DNP will advance the development and mass production of EUV lithography photomasks and support Rapidus as it establishes a mass production system for 2nm & next-generation semiconductors. Background In recent years, the rise in energy consumption, in line with increased data generation, has become a challenge, driving demand for next-generation semiconductors capable of improving device performance and reducing power consumption. Next-generation semiconductors manufactured using EUV lithography enable the formation of finer patterns on silicon wafers co

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye