Quectel and MediaTek Unveil Next Generation 5G-A and Wi-Fi 8 Intelligent CPE Reference Design at MWC 2026
3.3.2026 14:38:00 CET | Business Wire | Press release
Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the launch of a new intelligent CPE reference design based on the MediaTek T930 platform, integrating 5G-Advanced and Wi-Fi 8 technologies.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260303124613/en/
Quectel and MediaTek unveil next generation 5G-A and Wi-Fi 8 intelligent CPE reference design at MWC 2026
The solution combines the high-performance 5G-A connectivity, intelligent reliability and advanced capabilities of the MediaTek T930 platform with Quectel’s deep expertise in the global Fixed Wireless Access (FWA) market. Moving beyond a simple focus on high speed, it delivers a fully integrated, all-in-one solution featuring exceptional performance, ultra-high stability, and intelligent network management.
Designed for both residential and enterprise users, the solution enables transformative improvements in broadband access, mobile office connectivity, enterprise networking, and industrial IoT applications. Powered by Quectel’s RG660MK series modules, the solution adopts MediaTek’s advanced 4nm T930 5G platform, integrating a 3GPP Release 18-compliant 5G-A modem, quad-core CPU and dedicated network processing unit, with chip-level deep collaboration with Wi-Fi 8 technology, bringing users a disruptive intelligent connectivity experience.
"As a global enabler in the IoT industry, we are committed to translating state-of-the-art connectivity technologies into customer value. The FWA market is evolving from basic connectivity to differentiated, intelligent and scenario-based experiences,” commented Doron Zhang, COO, Quectel Wireless Solutions. “Our new intelligent solution developed with MediaTek responds precisely to this trend, aiming to become the core network hub for future smart homes and digital enterprises. Going forward, Quectel will continue to deepen innovation in 5G and AIoT, collaborate with partners to empower all industries with more advanced and intelligent connectivity, and jointly prosper the global digital economy ecosystem."
Evan Su, General Manager of Wireless Communications at MediaTek, said "We are delighted to partner with Quectel to launch this landmark next-generation intelligent solution. It demonstrates our joint innovation strengths in 5G-A, Wi-Fi 8 and other cutting-edge technologies, and marks a key step toward a smarter FWA ecosystem. We look forward to deepening cooperation with Quectel in technical research, product development and ecosystem building, delivering stronger and superior next-gen connectivity solutions for global operators and end users, and jointly shaping the future of wireless broadband."
Powered by 8Rx and 3Tx 5L technologies, the reference design expands 5G coverage and cell-edge efficiency by 40%, delivering stable, high-speed connectivity even in weak-signal areas and dense multi-user environments. With MediaTek’s L4S feature cutting latency to just 1/20 of traditional systems, it ensures ultra-responsive performance for cloud gaming, real-time control, and HD video conferencing. Wi-Fi 8 technologies, including Coordinated Spatial Reuse, Coordinated Beamforming, and dynamic spectrum management, further reduce interference, boost transmission efficiency by over 25%, and increase device throughput by up to 80%, keeping hundreds of devices running smoothly. A built-in NPU adds edge intelligence capabilities such as autonomous optimization, local voice interaction, and dynamic end-edge-cloud coordination, transforming the network from a passive pipe into an intelligent, proactive platform.
With sub-millisecond latency and ultra-reliable performance, it powers 8K UHD streaming, immersive VR/AR, and seamless whole-home smart device connectivity. For enterprises, it enables fast, flexible deployment of high-speed wireless broadband, ideal for branch offices, temporary sites, and areas without wired infrastructure. It also delivers cost-effective broadband access for underserved regions, while meeting the stringent low-latency and reliability demands of industrial IoT, telemedicine, smart education, and precision agriculture.
About Quectel
Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global end-to-end IoT solutions provider backed by outstanding support and services.
With a worldwide team of over 5,800 professionals, we lead the way in delivering end-to-end IoT solutions, spanning cellular, GNSS, satellite, Wi-Fi and Bluetooth modules, high-performance antennas, value-added services and full turnkey offerings including ODM services and system integration.
With regional offices and support across the globe, our international leadership is devoted to advancing IoT and helping build a smarter world.
For more information, please visit: www.quectel.com or LinkedIn
View source version on businesswire.com: https://www.businesswire.com/news/home/20260303124613/en/
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Signaloid Announces Preview of New ASIC Targeted at Physical AI and Robotics Applications2.6.2026 06:00:00 CEST | Press release
Signaloid previews a new ASIC purpose-built for physical AI and robotics workloads.The chip, taped out with TSMC in partnership with IC-Link by imec and Cadence, is projected to deliver up to 1000× better performance-per-watt in key physical AI workloads. Signaloid (https://signaloid.com), a computing platform company providing hardware and binary-translation-based acceleration of AI, robotics, aerospace, and quantitative finance workloads, today announced the tapeout and preliminary specifications documents for its C0-ASIC. Delivery of engineering samples to the first customer is due in Q3 2026 and additional FPGA-based systems implementing the ASIC’s design are under discussion for deployment in the UK and Switzerland later in 2026. The C0-ASIC was targeted specifically at energy-efficient physical AI workloads. The UK Advanced Research and Invention Agency (ARIA) will take delivery of systems based on the ASIC for use in next-generation AI workloads such as second order methods. “Th
Blackstone Raises its Largest Asia Private Equity Fund at $13.1 Billion2.6.2026 03:00:00 CEST | Press release
Oversubscribed Fund More than Doubles Capital Raised for Predecessor Vehicle Blackstone (NYSE: BX) today announced the final close of Blackstone Capital Partners Asia III (“BCP Asia III”) at $13.1 billion, exceeding its $10 billion target and marking the firm’s largest private equity fundraise in the region. The oversubscribed fund reached its hard cap and builds on the strong performance of the strategy’s first two vintages, with this close representing more than double the amount of capital raised for its predecessor vehicle. Joe Baratta, Global Head of Blackstone Private Equity Strategies,said: “We are grateful for the continued trust of our investors in Blackstone and our leading Asia Private Equity franchise. This successful fundraise reflects the strength of our platform and our ability to perform through cycles. Asia Pacific is the fastest-growing region in the world, presenting compelling opportunities to invest at scale behind our high-conviction themes and deliver for our inv
Phison Unlocks Full-Scale AI Deployment Across Industries2.6.2026 02:00:00 CEST | Press release
Building an Ecosystem with Pascari aiDAPTIV™ Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a new strategic initiative at COMPUTEX 2026 under the theme “AI Enabler: Evolving Data Storage Intelligence.” Expanding beyond its role as a storage technology leader, Phison is taking a systems-level approach to AI solutions spanning AI infrastructure, edge AI computing and AI software platforms. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601070396/en/ Phison evolving data storage intelligence at COMPUTEX 2026 At COMPUTEX 2026, Phison is showcasing comprehensive AI storage and computing architecture solutions designed to address key challenges facing enterprises and end users in the AI era, including high AI deployment costs, GPU and memory limitations, data privacy concerns and the increasing storage bandwidth and power demands driven by AI workloads. Four Core Te
Phison Collaborates with Intel to Bring Larger Local AI Workloads to Intel AI PC Platforms2.6.2026 02:00:00 CEST | Press release
Phison's Pascari aiDAPTIV™ removes local memory constraints on client PCs, enabling larger MoE AI models and agentic AI applications COMPUTEX — Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a collaboration with Intel to enable AI PCs to deploy larger, more capable AI applications locally. The collaboration combines Intel® Core™ Ultra Series 3 processors with Phison’s Pascari aiDAPTIV, a memory extension solution that unblocks memory-constrained systems to support larger Mixture-of-Experts (MoE) AI models, longer-running AI sessions and agentic AI workflows. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601878925/en/ Phison and Intel collaborate to bring larger local AI workloads to Intel AI PC Platforms Today, AI PCs are moving beyond simple assistant applications toward more advanced local AI use cases. These solutions now support end users and businesses i
SymphonyAI Brings AI-Powered Assortment and Space Platform to Global CPGs, Compressing Category Review Cycles from Weeks to Days2.6.2026 00:35:00 CEST | Press release
CINDE Assortment and Space closes the loop between assortment, planogram, and in-store execution, proven across 500-plus global CPG deployments Planogram compliance failures, undetected out-of-stocks, and the lag between headquarters planning and store-level execution cost grocers measurably in comp sales, shrink, and associate labor hours. The tools built for category planning have never been designed to close that execution gap. In response, SymphonyAI, a global leader in Vertical AI, today announced the availability of CINDE Assortment and Space for CPGs, an AI platform that closes the loop between assortment strategy, planogram execution, and in-store compliance, compressing the category review cycle from four to six weeks to a matter of days. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260602137061/en/ The platform is underpinned by SymphonyAI's Transferable Demand AI, a model trained across 25 years of retail data a
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom