Qualcomm Increases Quarterly Cash Dividend
18.3.2025 14:00:00 CET | Business Wire | Press release
Qualcomm Incorporated (NASDAQ: QCOM) today announced that its Board of Directors has approved an increase in the Company’s quarterly cash dividend from $0.85 to $0.89 per share of common stock. This dividend increase will be effective for quarterly dividends payable after March 27, 2025, and will raise the annualized dividend payout to $3.56 per share of common stock.
Cristiano Amon, President and CEO of Qualcomm Incorporated, said, “We are pleased to announce an increase in our quarterly dividend. Given our long-term growth expectations we provided at our 2024 Investor Day, we remain committed to returning capital to stockholders through a balanced capital return policy, including a baseline of anti-dilutive stock repurchases, and an annualized dividend target of low- to mid-single-digit percentage growth.”
About Qualcomm
Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Building on our 40 years of technology leadership in creating era-defining breakthroughs, we deliver a broad portfolio of solutions built with our leading-edge AI, high-performance, low-power computing, and unrivaled connectivity. Our Snapdragon® platforms power extraordinary consumer experiences, and our Qualcomm Dragonwing™ products empower businesses and industries to scale to new heights. Together with our ecosystem partners, we enable next-generation digital transformation to enrich lives, improve businesses, and advance societies. At Qualcomm, we are engineering human progress.
Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering and research and development functions and substantially all of our products and services businesses, including our QCT semiconductor business. Snapdragon and Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm patents are licensed by Qualcomm Incorporated. For more information, visit www.qualcomm.com.
Cautionary Note Regarding Forward-Looking Statements
In addition to historical information, this news release contains forward-looking statements. Such forward-looking statements speak only as of the date of this news release, and are based on our current assumptions, expectations and beliefs, and information currently available to us. These forward-looking statements, including but not limited to statements regarding our long-term growth expectations, our future dividend payments and dividend growth, and our commitment to returning capital to stockholders through a balanced capital return policy, including a baseline of anti-dilutive stock repurchases, are inherently subject to risks and uncertainties. Past dividends and stock repurchases provide no assurance as to future dividends or stock repurchases, and the timing and amount of future dividends or stock repurchases, if any, could vary significantly in comparison both to past dividends or stock repurchases and to current expectations. Forward-looking statements are generally identified by words such as “estimates,” “guidance,” “expects,” “anticipates,” “intends,” “plans,” “believes,” “seeks” and similar expressions. Actual results may differ materially from those referred to in the forward-looking statements due to a number of important factors, including but not limited to: a deterioration in our future results of operations, financial condition, cash flows or business prospects; a determination by our Board of Directors that dividends or stock repurchases are not in the best interests of the Company and its stockholders; unexpected, unplanned or alternative requirements for, or uses of, our available cash, including but not limited to potential business acquisitions or other strategic transactions; legal or contractual restrictions on the payment of dividends or stock repurchases, including under credit agreements or other financing arrangements; changes in tax or other laws relating to dividends or stock repurchases; changes in general economic, business and political conditions; and other risks detailed in our Quarterly Report on Form 10-Q for the fiscal quarter ended December 29, 2024 filed with the Securities and Exchange Commission (SEC). Our reports filed with the SEC are available on our website at www.qualcomm.com. We undertake no obligation to update, or continue to provide information with respect to, any forward-looking statement or risk factor, whether as a result of new information, future events or otherwise.
View source version on businesswire.com: https://www.businesswire.com/news/home/20250318343830/en/
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
BOCHK and Ant International Forge Strategic Partnership to Enhance Cross-border Payment Connectivity and Innovative Corporate Financial Service Solutions Through Fintech20.8.2026 08:00:00 CEST | Press release
Ant International and Bank of China (Hong Kong) (“BOCHK”) announced that the two parties have forged a strategic partnership. Leveraging BOCHK’s banking strengths and Ant International’s leading fintech and AI technologies, the two parties seek to explore the frontier of AI-driven innovative financial services, empower real-time treasury management and cross-border payments, deliver efficient and intelligent liquidity management and financial service solutions for global enterprises, while continuously enhancing financial services for small and medium-sized enterprises (“SMEs”). This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819555366/en/ From left to right: Kelvin Li, General Manager of Platform Tech and Senior Vice President of Ant International, Eric Jing, Chairman of Ant International, Sun Yu, Vice Chairman and Chief Executive of BOCHK, and Wang Huabin, Deputy Chief Executive of BOCHK Sun Yu, Vice Chairman and Chief E
Ant International’s FalconTST Model 2.0 Achieves SOTA, Elevating Predictive AI Application in Finance to New Levels20.8.2026 03:55:00 CEST | Press release
FalconTST 2.0 has achieved state-of-the-art performance on MASE metricon top global benchmark.Banks use FalconTST 2.0 to better forecast liquidity exposure with Barclays, Citi, Deutsche Bank and Standard Chartered having integrated FalconTST 2.0 for cashflow forecasting and FX management.FalconTST 2.0 has achieved >93% forecast accuracy rate consistently and is ready for broader industry application, including logistics, aviation, e-commerce, besides financial sector. Ant International has introduced Falcon Time-Series Transformer (TST) AI Model 2.0, its most advanced TST model so far designed to deliver more accurate forecasting in real-world FX risk management of cross-border payments, with more industry applications to come, such as demand forecasting for supply chain management for e-commerce platforms, and predictive operations management for aviation industry. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819055561
Grid Dynamics Earns MACH Alliance's 2026 Agent Ready Award for Production-Scale Agentic AI19.8.2026 22:05:00 CEST | Press release
Key Takeaways: Grid Dynamics is named to MACH Alliance's inaugural 2026 Agent Ready cohort. Grid Dynamics won the award for its agentic AI capabilities and for programs delivered at a global food and beverage company and a global payments company. Grid Dynamics delivered the qualifying work through its Grid Dynamics AI Native (GAIN) platforms and Forward Deployed Engineer delivery model. Grid Dynamics Holdings, Inc. (Nasdaq: GDYN) (“Grid Dynamics”), a premier AI transformation partner for the Fortune 1000, today announced it has earned MACH Alliance's 2026 Agent Ready Award, becoming one of 35 companies named in the program's inaugural cohort. Agent Ready is an advanced certification that builds upon MACH Certification, the MACH Alliance's baseline standard for open, composable, and connected technology. The honor recognizes certified members that have moved agentic AI from pilots and demos into production, at scale, with the guardrails enterprise deployment requires. Every award is in
Xsolla Announces Multi-Year Strategic Partnership With the Good Game Club Podcast to Amplify Positive Stories From the Global Games Industry19.8.2026 18:10:00 CEST | Press release
Collaboration Brings Co-Created Episodes, Live Recordings At gamescom And GDC, And Stories From Studios, With Episodes Recorded Across the Globe Xsolla, a global video game commerce company, today announced a multi-year strategic partnership with Good Game Club, the independent, global podcast dedicated to sharing positive stories from the gaming ecosystem. The partnership builds on a broader effort to support the developers, publishers, and creators shaping the future of the games industry in a positive way by supporting good stories from the human side of video game businesses. The partnership spans the global events calendar, with joint podcast recordings planned each year at gamescom in Cologne and the Game Developers Conference (GDC) in San Francisco. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819127662/en/ Graphic: Xsolla Xsolla and Good Game Club will collaborate on recurring editorial segments and deep-dive ep
KAGA FEI Expands Its Software-Embedded Bluetooth Low Energy Module Lineup with ES4L15MA1 and EC4L15MA119.8.2026 16:00:00 CEST | Press release
KAGA FEI Co., Ltd., a global provider of advanced short-range wireless modules, announced today the development of the ES4L15MA1 and EC4L15MA1 Bluetooth Low Energy modules with embedded software for wireless communication. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260802953307/en/ ES4L15MA1 (left) and EC4L15MA1 (right) sample modules These products are versions of KAGA FEI’s ES4L15BA1 and EC4L15BA1 wireless modules with embedded software, which use Nordic Semiconductor’s nRF54L15. Because the modules include the functions required for Bluetooth Low Energy communication, device manufacturers can develop products in a shorter period without having to develop wireless communication software from scratch. The modules help reduce software development workloads, shorten product development cycles, and lower development costs for a wide range of IoT devices. The need for wireless connectivity in IoT applications is growing acr
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom