Quectel Expands IoT Wi-Fi and Bluetooth Module Portfolio, Boosting Speed and Cost Efficiency for Faster Time-to-market
7.10.2024 17:00:00 CEST | Business Wire | Press release
Quectel Wireless Solutions, a global IoT solutions provider, today announced the introduction of three additional short-range modules to its portfolio. The modules are the FC30R, a cost-effective, industrial-grade Wi-Fi module; the FCU743R, featuring Wi-Fi 4 and Bluetooth 5.2 capabilities; and the FCM740D, an MCU with Wi-Fi 4 and Bluetooth 5.2. These modules enable customers to bring IoT devices to market more cost-effectively and with faster time to market.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20241007406027/en/
Quectel expands IoT Wi-Fi and Bluetooth module portfolio, boosting speed and cost efficiency for faster time-to-market. (Photo: Business Wire)
“We’re constantly striving to provide our customers with the strongest possible portfolio across the Quectel product range,” commented Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “The inclusion of these modules expands the range of options in our short-range portfolio for customers' IoT applications, empowering them to innovate in their IoT device designs and accelerate their time to market.”
The FC30R is an ultra-compact, cost-effective industrial-grade Wi-Fi module that supports IEEE 802.11 b/g/n standards. Measuring just 12.0 mm × 12.0 mm × 2.1 mm, it is perfect for size-sensitive applications. It can be seamlessly integrated with Quectel 5G modules (RT620T series), 4G modules (EG25 series, AG35 series, EG95 series, EC21 series, EC25 series, EC20 series, EC200A series, EC200R series, EC300R-LA series), and other application processors (NXP, ST, TI, Ambarella, etc.), making it suitable for a wide range of M2M applications including EV chargers, mobile hotspots, on-board diagnostics (OBD), gateways and industrial PDAs.
The FCU743R is a USB interface, high-performance Wi-Fi 4 and Bluetooth 5.2 module that supports the 2.4 GHz and 5 GHz Wi-Fi bands and can realize high-speed, low-power WLAN wireless transmission with a maximum data transmission rate of up to 150 Mbps. With an ultra-compact size of 13.0 mm × 12.2 mm × 2.0 mm, the module is ideal for size-sensitive applications.
Surface-mount technology (SMT) makes FCU743R an ideal solution for durable and rugged designs and the low profile and small size of LCC package ensure that it can be easily embedded into size-constrained applications and provide reliable connectivity with these applications
The FCM740D is an MCU Wi-Fi 4 and Bluetooth 5.2 module, that boasts a high-performance processor with a frequency of up to 120MHz and supports IEEE 802.11b/g/n protocol and BLE 5.2. The module features built-in 256 KB SRAM and 2 MB/4 MB flash (optional), complies with WPA-PSK, WPA2-PSK and WPA3-SAE security standards. The FCM740D has an LCC + DIP form factor with an ultra-compact size of 20.3 mm × 15.8 mm × 2.7 mm, which optimizes the size and cost for customers.
With a variety of low-power modes and long connection keep-alive mechanisms, the module is perfect for smart home, industrial IoT, consumer electronics and other applications, especially home appliances, small-sized smart lighting and other applications and IoT devices with high temperature requirements, such as HVAC, dimmer, light strips, smart sockets.
Finally, two MCU Bluetooth modules, the HCM511S and HCM010S, are now available in additional variants with stronger transmit power and additional antenna options. The HCM511S-E now features 8 dBm transmit power and an RF coaxial connector and external pin antenna interface, while the HCM010S-E now offers a pin antenna, RF coaxial connector and optional PCB antenna.
Quectel’s IoT modules are developed with security at the core. From product architecture to firmware/software development, Quectel incorporates leading industry practices and standards, mitigating potential vulnerabilities with third party independent test houses and have incorporated security practices like generating SBOMs and VEX files as well as performing firmware binary analysis into the entire software development lifecycle.
Quectel will be exhibiting at MWC Las Vegas 2024. Schedule a meeting to find out more about the Quectel product range.
About Quectel
Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of 5,600 professionals sets the pace for innovation in cellular, GNSS, Wi-Fi and Bluetooth modules as well as antennas and services.
With regional offices and support across the globe, our international leadership is devoted to advancing IoT and helping build a smarter world.
For more information, please visit: www.quectel.com, LinkedIn, Facebook, and X.
View source version on businesswire.com: https://www.businesswire.com/news/home/20241007406027/en/
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Venture Global Announces Final Investment Decision and Financial Close for Phase 2 of CP2 LNG13.3.2026 15:23:00 CET | Press release
$8.6 billion project financing for CP2 Phase 2 brings project’s total financing to $20.7 billionProject expected to make Venture Global the largest exporter of US LNGUnprecedented milestone of five FIDs in less than 7 years, with over $95 billion in capital markets transactions Today, Venture Global, Inc. (NYSE: VG) is announcing a final investment decision (FID) and successful closing of an $8.6 billion project financing for the second phase of the company’s third project, Venture Global CP2 LNG (CP2). When combined with the Phase One financing for CP2 announced July 2025, this milestone represents the largest standalone project financing in the U.S. bank market.The transaction garnered enormous interest from the world’s leading banks, resulting in over $19 billion of commitments for Phase Two in addition to the previous $34 billion of commitments for Phase One, and required no outside equity investment. “We are extremely proud to have taken FID on the second phase of CP2, our third g
NIQ Launches Beta of New AI-Powered Analytical Capabilities in Ask Arthur13.3.2026 12:00:00 CET | Press release
AI-guided analysis helps brands and retailers turn data into decision-ready insights NIQ (NYSE: NIQ), a global leader in consumer intelligence, has launched new AI-powered analytical capabilities in beta within Ask Arthur on the NIQ Discover platform. The expanded experience guides users through end-to-end analysis—helping them identify what matters in the data, understand why trends are occurring, and turn insights into clear, shareable narratives with recommended next steps. As organizations navigate increasing data complexity, the ability to move quickly from insight to action has become essential. Ask Arthur helps shorten analytical processes that once took days or weeks into minutes by surfacing the key drivers behind performance changes and generating decision-ready insights directly within Discover. By connecting analysis, explanation, and storytelling in a single experience, users can move seamlessly from understanding what is happening in the data to determining what to do nex
Reply at NVIDIA GTC: Digital Twins and Physical AI Driving the Next Stage of Industrial Value Creation13.3.2026 11:24:00 CET | Press release
Reply [EXM, STAR: REY] will be present at NVIDIA GTC from 16 to 19 March 2026 in San Jose, California, showcasing how companies can optimise production and logistics processes, scale robotics and sustainably increase industrial performance using digital twin technology and physical AI. The conference is regarded as the most important international meeting point for AI developers, researchers and decision makers. This year, more than 30,000 participants from over 190 countries are expected to attend. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260313000399/en/ By attending NVIDIA GTC, Reply is showcasing how digital simulation and physical automation are already being integrated in practice. Projects for the Otto Group and the industrial edge domain show how physical AI and precise digital twins work together to create new opportunities for industrial value generation. The focus will be on two concrete use cases that demon
Klarna Board Chair Michael Moritz Acquires 3.47 Million Shares for $50 Million13.3.2026 11:05:00 CET | Press release
Klarna Group plc (NYSE: KLAR) today discloses the following transactions by the Chair of its Board of Directors and Chief Product & Design Officer, filed with the U.S. Securities and Exchange Commission on Form 3. Share Purchases Michael Moritz, Chairman, through an associated entity, purchased 3,472,845 ordinary shares between March 3 and March 11, 2026, at an aggregate consideration of $49,913,138.73. David Fock, Chief Product & Design Officer, purchased 27,000 ordinary shares on March 9, 2026, for an aggregate consideration of $388,552.14. Share Sales David Sandström, Chief Marketing Officer, sold 32,703 shares on March 9, 2026, pursuant to a Rule 10b5-1 trading plan, established in 2025. David Sykes, Chief Commercial Officer, sold 23,799 shares on March 13, 2026, pursuant to a separately established Rule 10b5-1 trading plan, established in 2025. Form 3 filings for all transactions are available on the SEC's EDGAR database atwww.sec.gov. Forward-Looking Statements This press release
Intertek Launches Comprehensive Digital Product Passport Services13.3.2026 10:00:00 CET | Press release
Supporting circular economy and regulatory compliance Intertek, a leading Total Quality Assurance provider to industries worldwide, has announced the launch of its enhanced Digital Product Passport (DPP) suite of services. This includes a comprehensive advisory service designed to help manufacturers, brands and retailers navigate the fast-evolving regulatory and sustainability landscape associated with digital product passports and circular economy compliance. Mark Thomas, Executive Vice President, Global Sustainability, Assurance, Agri World and Food at Intertek, said: “With the introduction of regulatory frameworks for improving the sustainability performance of products, companies are facing mounting pressure to implement robust systems for transparency, traceability and sustainability reporting globally. This shift marks a significant regulatory milestone, requiring organisations to strengthen data governance, engage suppliers more effectively and demonstrate credible, verifiable s
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom