Business Wire

CHINA-HI-TECH-FAIR

22.8.2024 03:01:32 CEST | Business Wire | Press release

Share
Impress Global Markets with Innovations Featured at CHTF2024

The 26th China Hi-Tech Fair (CHTF2024) will take place on November 14-16 in Shenzhen. Under the theme "Technology Leads Development, Industry Integrates Fusion," CHTF2024 promises to be the most influential edition by bringing true innovations into spotlight.

Covering 400,000m2, CHTF2024 will highlight innovations in AI, robotics, equipment manufacturing, energy, and other 23 subdivided sectors to showcase unique products.

Leading companies and organizations from key industries:

  • Energy: Major players like CNPC, SINOPEC, and CNOOC will be present, showcasing their latest advancements and solutions.
  • Semiconductors: Top brands specializing in chips, memory and integrated circuits, including Loongson, Metorage, Shenzhen Liande, etc., will be present. The host is actively collaborating with industry giants like Tianma Microelectronics and TCL CSOT to create a diverse, international platform for networking and collaboration across the supply chain.
  • Finance: WeBank, China’s leading private neobank backed by Tencent, China Everbright Bank, China Merchants Bank and Bank of Communications have confirmed participation. Leading financial institutions including CITIC Bank and SPD Bank, have expressed strong interest in the intersection of finance and technology.
  • Transportation and Logistics: Key players including China Communications and Transportation Association, China State Railway Group, China Post Group, COMAC, and China Railway Signal & Communication Group, will exhibit their innovations and services.

A Global Stage for Innovation

CHTF2024 attracts participants from over 100 countries, including Australia, Japan, the UK, Germany, Canada, etc. Tsukuba, a friendship city of Shenzhen, has been a dedicated participant in CHTF since the 6th edition. Tsukuba Mayor Tatsuo Igarashi has sent a congratulatory letter to CHTF, expressing his support for the event's role in promoting innovation and international collaboration.

Nearly 400 buyers and 200 financial organizations are confirmed, with procurement intentions exceeding $1.5 billion.

Join Us at CHTF2024

In the first seven months of 2024, China's import and export volume hit a record high. The imports of semiconductor devices increased by 12.4% year-on-year. High-end instruments are imported for scientific research or industrial production. This growth, fueled by China's economic recovery, complete industrial system, technological and industrial innovation, and new quality productivity, is driving new momentum in foreign trade.

CHTF2024 offers a prime opportunity to build valuable partnerships in this thriving landscape. Be a part of CHTF2024 and shape the future of global technology!

Exhibitor registration: https://c.zhenweiexpo.com/web-reg-server/pc/exhibit-apply.html?EID=E0000000413&target=4&orgnum=1164&pid=1028&version=2&cid=&ctid=1#/index

Visitor registration: https://c.zhenweiexpo.com/web-reg-server/pc/vistor-register.html?EID=E0000000413&target=1&orgnum=1164&pid=1028&version=2&cid=&ctid=1#/index

Follow us on Facebook/LinkedIn/X for updates.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240821384196/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

IQM and Real Asset Acquisition Corp. to Host Conference Call/Webcast to Discuss Proposed Transaction27.2.2026 13:00:00 CET | Press release

IQM Finland Oy, a global leader in full-stack superconducting quantum computers (“IQM”, “IQM Quantum Computers” or the “Company”), and Real Asset Acquisition Corp. (Nasdaq: RAAQ), a special purpose acquisition company (“RAAQ”), announced that they will host a conference call to discuss their recently announced business combination, including certain transaction highlights. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260227472716/en/ IQM Radiance quantum computer As previously disclosed, on February 23, 2026, IQM and RAAQ announced they have entered into a definitive business combination agreement, which will result in IQM becoming a public company and listing American Depositary Shares on one of the two leading U.S. stock exchanges. The transaction provides funding with the aim to accelerate IQM’s technology and commercial development towards fault-tolerance quantum computing, further advancing its position as a leading p

HighRadius Launches $0 Implementation Fee, $0 Subscription Fee via Outcome Based Pricing for oCFO Software27.2.2026 12:00:00 CET | Press release

HighRadius launches Office of the CFO first Outcome Based Pricing with $0 Implementation fee and $0 Subscription until Go-Live. Customers only pay a fraction of realized gains based on P&L impact. Chapter 1: Outcome Based Pricing (OBP)Introduction of OBP: HighRadius, a provider of 190+ AI agents for Order-to-Cash, Accounts Payable, Record-to-Report, and Treasury introduces Outcome Based Pricing (OBP). Three Components of OBP: Customers pay a) $0 in Implementation fees, b) $0 in Subscription fees until Go Live, c) HighRadius earns a fraction of the actual savings realized by the client. Chapter 2: US GAAP & ASC 606 ConstraintsNot Designed for Innovation: The traditional ASC 606 model requires companies to standardize and recognize revenue based on contractual obligations. For a traditional SaaS subscription, the obligation is access to software over time. AI agents are designed to deliver quantifiable, real-time Business Outcomes that do not fit the traditional accounting framework. Cha

Kioxia Appoints Yoshihiko Kawamura as Chief Financial Officer27.2.2026 09:15:00 CET | Press release

Kioxia Holdings Corporation (TOKYO:285A), a world leader in memory solutions, today announced the appointment of Yoshihiko Kawamura as Chief Financial Officer (CFO), effective April 1, 2026. Mr. Kawamura brings extensive international experience to Kioxia, having held assignments at Mitsubishi Corporation’s U.S. headquarters, served as General Manager of its Chicago office, and completed a tenure at the World Bank. At Hitachi, Ltd., he held senior leadership positions, including Chief Strategy Officer (CSO), Chief Financial Officer (CFO), and Chief Risk Management Officer (CRMO), where he was instrumental in leading the company’s management reforms. Since joining Kioxia as Executive Vice President in June 2025, Mr. Kawamura has worked closely with the executive team to advance the business through strategic capital and financial planning. Following its initial public offering on the Prime Market of the Tokyo Stock Exchange in December 2024, Kioxia is entering a new phase of growth char

DNP Invests in Rapidus to Support the Establishment of Mass Production for Next-Generation Semiconductors27.2.2026 08:18:00 CET | Press release

Will accelerate the development and mass production of EUV lithography photomasks Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) today announced that it has participated in Rapidus Corporation’s funding round as one of the round investors. This strategic funding initiative supports Rapidus’ plan to steadily progress from its current R&D phase to mass production of 2nm (10⁻⁹ meters) logic semiconductors by 2027. Through this initiative, DNP will advance the development and mass production of EUV lithography photomasks and support Rapidus as it establishes a mass production system for 2nm & next-generation semiconductors. Background In recent years, the rise in energy consumption, in line with increased data generation, has become a challenge, driving demand for next-generation semiconductors capable of improving device performance and reducing power consumption. Next-generation semiconductors manufactured using EUV lithography enable the formation of finer patterns on silicon wafers co

EdgeConneX Looks to Enter Swedish Market as Part of European Data Center Expansion Strategy27.2.2026 08:05:00 CET | Press release

Planned data center campus in Skellefteå would support future AI and cloud infrastructure needs EdgeConneX®, an EQT portfolio company with an extensive Pan-European data center footprint, looks to expand its presence with a new site located in Skellefteå, Sweden. The data center site will be acquired from Lyten, a global company that specializes in lithium-sulfur batteries and energy storage. The site would support EdgeConneX broader strategy to expand digital infrastructure capacity across the Nordics. Subject to the completion of applicable administrative and regulatory processes, EdgeConneX will look to develop a data center campus with potential capacity of up to one gigawatt in support of future AI and cloud computing workloads. Upon completion, the data center campus would be one of the largest facilities in Europe that would be primarily powered by renewable energy. “Sweden represents an attractive long‑term market for digital infrastructure investment. The country’s access to r

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye