SAMSUNG-ELECTRONICS
6.8.2024 12:40:29 CEST | Business Wire | Press release
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced it has begun mass production for the industry’s thinnest 12 nanometer (nm)-class, 12-gigabyte (GB) and 16GB LPDDR5X DRAM packages, solidifying its leadership in the low-power DRAM market.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240806495293/en/
Samsung’s compact LPDDR5X DRAM packages measure 0.65mm high, allowing enhanced thermal control suitable for on-device AI mobile applications (Photo: Business Wire)
Leveraging its extensive expertise in chip packaging, Samsung is able to deliver ultra-slim LPDDR5X DRAM packages that can create additional space within mobile devices, facilitating better airflow. This supports easier thermal control, a factor that is becoming increasingly critical especially for high-performance applications with advanced features such as on-device AI.
"Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package," said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. "We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market."
With the new LPDDR5X DRAM packages, Samsung offers the industry’s thinnest 12 nm-class LPDDR DRAM in a 4-stack structure1, reducing the thickness by approximately 9% and improving heat resistance by about 21.2%, compared to the previous generation product.
By optimizing printed circuit board (PCB) and epoxy molding compound (EMC)2 techniques, the new LPDDR DRAM package is as thin as a fingernail at 0.65 millimeters (mm), the thinnest among existing LPDDR DRAM of 12GB or above. Samsung’s optimized back-lapping3 process is also used to minimize the package height.
Samsung plans to continue expanding the low-power DRAM market by supplying its 0.65mm LPDDR5X DRAM to mobile processor makers as well as mobile device manufacturers. As demand for high-performance, high-density mobile memory solutions in smaller package sizes continues to grow, the company plans to develop 6-layer 24GB and 8-layer 32GB modules into the thinnest LPDDR DRAM packages for future devices.
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, home appliances, network systems, and memory, system LSI, foundry and LED solutions, and delivering a seamless connected experience through its SmartThings ecosystem and open collaboration with partners. For the latest news, please visit the Samsung Newsroom at news.samsung.com
1 Structure with four layers packaged together, and each layer consists of two LPDDR DRAMs.
2 Material that protects semiconductor circuits from various external environments such as heat, impacts, and moisture.
3 Grinding the backside of a wafer.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240806495293/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Entrepreneurs Invited to Apply for 2027 SPIE Startup Challenge11.8.2026 20:40:00 CEST | Press release
The competition will bring seven teams head-to-head in pursuit of $10,000 first prize Entrepreneurs around the world are invited to apply for a chance to pitch their optics or photonics technologies or products to a panel of expert judges at the 17th annual SPIE Startup Challenge. SPIE, the international society of optics and photonics, holds the competition at Photonics West every January, with multiple teams walking away with cash prizes. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260811090450/en/ Coalesenz won first prize for their hand-held, point-of-care coagulation analyzer at the SPIE Startup Challenge at Photonics West in January 2026. More than a simple pitch competition, the SPIE Startup Challenge is an entry point into the community of high-tech business development of new products in healthcare and deep tech, with an audience of experienced photonics innovators and investors. Cash prizes of $10,000, $5,000, a
The Aga Khan Museum Welcomes Prince Aly Muhammad Aga Khan and Saira Bhojani to its Board of Directors11.8.2026 17:30:00 CEST | Press release
The Aga Khan Museum is pleased to announce the appointment of Prince Aly Muhammad Aga Khan and Saira Bhojani to its Board of Directors. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260811597825/en/ Prince Aly Muhammad Aga Khan, board member, Aga Khan Museum Prince Aly Muhammad Aga Khan joins the Board with a deep commitment to arts and culture. He brings an international outlook shaped by working with the Aga Khan Foundation and Aga Khan Music Programme. Committed to advancing pluralism and cultural dialogue, Prince Aly brings a fresh perspective that will help guide the Museum as it continues to evolve, engage new audiences, and expand its impact both in Canada and internationally. Prince Aly is the son of His Late Highness Prince Karim Aga Khan IV and brother of His Highness Prince Rahim Aga Khan V. Joining him on the Board is Saira Bhojani, Partner at Torys LLP and one of Canada's leading tax lawyers. Ms. Bhojani is wid
Mouser Explores the Future of Quantum Computing and Its Potential to Transform Engineering11.8.2026 16:48:00 CEST | Press release
Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, today announced the latest installment of its Empowering Innovation Together (EIT) technology series, A Quantum Leap in Computer Processing. This installment explores the emerging field of quantum computing and examines how the principles of quantum mechanics could unlock new computational capabilities for solving problems that remain difficult for conventional computing architectures. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260811222432/en/ Explore how quantum computing could help engineers address problems too complex for traditional systems. Unlike traditional computers, quantum computers leverage quantum-mechanical phenomena, such as superposition, entanglement, and interference, to perform calculations in fundamentally different ways. While today's quantum systems still face challe
Rehlko Expands Power Plus™ Connected-Services Capabilities, Enhancing Value Across Installed Base11.8.2026 15:15:00 CEST | Press release
Rehlko Power Plus™Delivers 24/7 Remote Monitoring, Advanced Diagnostics, and Fleet-Wide Asset Visibility to Critical Power Systems Rehlko, a global industrial energy resilience platform providing custom-engineered, integrated power solutions for mission-critical infrastructure worldwide, today announced the expanded capabilities of Rehlko Power Plus™ industrial remote monitoring. The cloud-based platform is designed to help customers reduce downtime, improve backup power reliability, and proactively manage critical power assets through real-time monitoring, alerts, diagnostics, and reporting. Rehlko Power Plus represents a meaningful expansion of Rehlko’s aftermarket capabilities and reinforces the company's strategy to deepen customer engagement across the asset lifecycle while growing its higher-value aftermarket business. As backup power systems become increasingly critical to business continuity, organizations need more than periodic inspections and reactive maintenance. Rehlko Pow
Boomi Ranked #1 Overall Leader in the 2026 ISG Buyers Guide™ for Application Integration11.8.2026 15:00:00 CEST | Press release
Boomi earns top rankings across Product Experience, Capability, Platform, Customer Experience in 2026 ISG Buyers Guide™ for Application Integration Boomi, the data activation company for AI, today announced it has been ranked the #1 overall software provider in ISG Buyers Guides™ for Application Integration 2026. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260811102868/en/ Boomi Ranked #1 Overall Leader in the 2026 ISG Buyers Guide™ for Application Integration In the report published by ISG Software Research, a division of ISG (Information Services Group), Boomi was placed within ISG's highest quadrant classification, Exemplary. ISG's report states that “Boomi was designated a Leader Overall and in every category,” a distinction no other provider assessed achieved. Capability, Platform and Customer Experience Leader The ISG Buyers Guide™ looks at how well software providers deliver for their customers, evaluating both the
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
