Business Wire

SAMSUNG-ELECTRONICS

6.8.2024 12:40:29 CEST | Business Wire | Press release

Share
Samsung Electronics Begins Mass Production of Industry’s Thinnest LPDDR5X DRAM Packages for On-Device AI

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced it has begun mass production for the industry’s thinnest 12 nanometer (nm)-class, 12-gigabyte (GB) and 16GB LPDDR5X DRAM packages, solidifying its leadership in the low-power DRAM market.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240806495293/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

Samsung’s compact LPDDR5X DRAM packages measure 0.65mm high, allowing enhanced thermal control suitable for on-device AI mobile applications (Photo: Business Wire)

Leveraging its extensive expertise in chip packaging, Samsung is able to deliver ultra-slim LPDDR5X DRAM packages that can create additional space within mobile devices, facilitating better airflow. This supports easier thermal control, a factor that is becoming increasingly critical especially for high-performance applications with advanced features such as on-device AI.

"Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package," said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. "We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market."

With the new LPDDR5X DRAM packages, Samsung offers the industry’s thinnest 12 nm-class LPDDR DRAM in a 4-stack structure1, reducing the thickness by approximately 9% and improving heat resistance by about 21.2%, compared to the previous generation product.

By optimizing printed circuit board (PCB) and epoxy molding compound (EMC)2 techniques, the new LPDDR DRAM package is as thin as a fingernail at 0.65 millimeters (mm), the thinnest among existing LPDDR DRAM of 12GB or above. Samsung’s optimized back-lapping3 process is also used to minimize the package height.

Samsung plans to continue expanding the low-power DRAM market by supplying its 0.65mm LPDDR5X DRAM to mobile processor makers as well as mobile device manufacturers. As demand for high-performance, high-density mobile memory solutions in smaller package sizes continues to grow, the company plans to develop 6-layer 24GB and 8-layer 32GB modules into the thinnest LPDDR DRAM packages for future devices.

About Samsung Electronics Co., Ltd.

Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, home appliances, network systems, and memory, system LSI, foundry and LED solutions, and delivering a seamless connected experience through its SmartThings ecosystem and open collaboration with partners. For the latest news, please visit the Samsung Newsroom at news.samsung.com

1 Structure with four layers packaged together, and each layer consists of two LPDDR DRAMs. 
2 Material that protects semiconductor circuits from various external environments such as heat, impacts, and moisture. 
3 Grinding the backside of a wafer.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240806495293/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Riskified Unveils Next-Generation AI Suite at Ascend 2026, Empowering Merchants with Unprecedented Visibility and Control Over Ecommerce Risk6.5.2026 15:00:00 CEST | Press release

New capabilities include Riskified ARIA the AI Risk Analyst, Identity Explore 2.0, and an enhanced Decision Studio, giving merchants the power to see, understand, and act on network risk intelligence like never before Riskified (NYSE: RSKD), a global leader in ecommerce fraud and risk intelligence, today announced a major leap forward in its AI platform capabilities, introducing a powerful suite of control and empowerment tools designed to give merchant fraud teams complete visibility into risk patterns and identity behavior, conversational AI-driven insights, and the ability to surgically tailor their risk strategies. The innovation suite was announced onstage at Ascend 2026, Riskified’s premier global summit series, taking place May 4-6, 2026, at the Conrad New York Downtown in Manhattan, NY. With global ecommerce continuing to expand and losses from AI-driven fraud attacks projected to spike, particularly with the rise of agentic commerce, where AI bots may conduct transactions on b

Twilio’s Next Generation Platform: An Infrastructure Layer for Every Conversation in the Agentic Era6.5.2026 15:00:00 CEST | Press release

New platform capabilities orchestrate context-rich conversations with persistent memory across multiple channels for humans and AI agentsConversation Memory, Conversation Orchestrator, Conversation Intelligence, and Agent Connect provide the nervous system for modern customer engagement Twilio (NYSE: TWLO), the infrastructure for customer engagement in the AI era, kicked off its user conference, SIGNAL, by unveiling its next generation platform capabilities for the agentic era. Generally available today, Conversation Memory, Conversation Orchestrator, Conversation Intelligence, and Agent Connect combine to turn disparate interactions into continuous, intelligent, and personal conversations across humans, agents, and systems. “The agentic era is here. Agents are joining conversations alongside the people they represent, and modern customer engagement requires an infrastructure that serves both equally,” said Khozema Shipchandler, Chief Executive Officer at Twilio. “Twilio’s new platform

Vultr, SUSE & Supermicro Debut Unified Cloud-to-Edge Architecture for Global AI Scaling6.5.2026 14:00:00 CEST | Press release

The strategic partnership bridges the gap between regional cloud and the far edge, combining ruggedized hardware and GitOps-driven Kubernetes to streamline large-scale AI deployments Vultr, the world's largest privately-held cloud infrastructure company, in collaboration with SUSE and Supermicro, today announces a strategic architectural framework designed to solve the complexities of deploying and operating AI workloads across distributed environments. As AI moves closer to the point of data creation - from manufacturing floors to retail storefronts - organizations face significant challenges in latency, cost and operational consistency. This joint initiative provides a seamless, Cloud-to-Edge pipeline that integrates high-performance hardware, localized cloud infrastructure, and unified Kubernetes management. The partnership addresses the reality that sending all data back to a central cloud is no longer viable for real-time AI. The solution breaks down the infrastructure into three

Waiv Enters Collaboration with Daiichi Sankyo to Deliver AI-Derived Biomarkers for ADC Program6.5.2026 14:00:00 CEST | Press release

Waiv, formerly Owkin Dx, to leverage its digital pathology platform encompassing foundation models and AI methodology for ADC biomarker discovery program Waiv, formerly Owkin Dx, a Paris-based company catalyzing AI precision testing, today announced it has entered a collaboration with Daiichi Sankyo (TSE: 4568) to lead digital pathology biomarker discovery for an antibody-drug conjugate (ADC) program. With deep expertise across diverse pathology and multimodal data, and a global data network spanning academic institutions, hospitals, and laboratories, Waiv has a proven track record delivering AI-powered biomarker solutions across the full drug development lifecycle. Under the collaboration, Waiv will apply its end-to-end computational pathology platform to early phase data. This includes tumor microenvironment (TME) analysis across both hematoxylin and eosin (H&E) and immunohistochemistry (IHC) stained samples, as well as biomarker discovery and outcome prediction capabilities aimed at

Elisa Expands PON Deployment with Vecima’s All-PON™ Shelf, Delivering 10G Fiber Services in Estonia6.5.2026 13:30:00 CEST | Press release

Elisa plans to install Vecima’s EXS1610 All-PON shelf across its footprint in Estonia, building on its existing Vecima PON deployment16-port EXS1610 All-PON Shelf supports a variety of PON standards, including GPON, XGS-PON, and 10G-EPON Vecima Networks Inc. (TSX: VCM) announced today that leading telecommunications operator Elisa has deployed Vecima’s Entra EXS1610 All-PON™ Shelf for 10G Fiber-to-the-Home (FTTH) services for its subscribers in Estonia. In Estonia’s competitive broadband market, Elisa brings highly innovative solutions to its subscribers. Vecima’s EXS1610 supports multiple deployment use cases, including greenfield, targeted brownfields, rural edge-outs, hybrid fiber-coax (HFC) overbuilds, footprint extensions, and hub collapses. Its compact shelf footprint can help reduce operating costs and allow operators to deploy anywhere – for maximum flexibility, including data centers, remote cabinets, the headend, and multi-dwelling units. The Entra EXS1610 All-PON Shelf featu

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye