SAMSUNG-ELECTRONICS
6.8.2024 12:40:29 CEST | Business Wire | Press release
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced it has begun mass production for the industry’s thinnest 12 nanometer (nm)-class, 12-gigabyte (GB) and 16GB LPDDR5X DRAM packages, solidifying its leadership in the low-power DRAM market.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240806495293/en/
Samsung’s compact LPDDR5X DRAM packages measure 0.65mm high, allowing enhanced thermal control suitable for on-device AI mobile applications (Photo: Business Wire)
Leveraging its extensive expertise in chip packaging, Samsung is able to deliver ultra-slim LPDDR5X DRAM packages that can create additional space within mobile devices, facilitating better airflow. This supports easier thermal control, a factor that is becoming increasingly critical especially for high-performance applications with advanced features such as on-device AI.
"Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package," said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. "We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market."
With the new LPDDR5X DRAM packages, Samsung offers the industry’s thinnest 12 nm-class LPDDR DRAM in a 4-stack structure1, reducing the thickness by approximately 9% and improving heat resistance by about 21.2%, compared to the previous generation product.
By optimizing printed circuit board (PCB) and epoxy molding compound (EMC)2 techniques, the new LPDDR DRAM package is as thin as a fingernail at 0.65 millimeters (mm), the thinnest among existing LPDDR DRAM of 12GB or above. Samsung’s optimized back-lapping3 process is also used to minimize the package height.
Samsung plans to continue expanding the low-power DRAM market by supplying its 0.65mm LPDDR5X DRAM to mobile processor makers as well as mobile device manufacturers. As demand for high-performance, high-density mobile memory solutions in smaller package sizes continues to grow, the company plans to develop 6-layer 24GB and 8-layer 32GB modules into the thinnest LPDDR DRAM packages for future devices.
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, home appliances, network systems, and memory, system LSI, foundry and LED solutions, and delivering a seamless connected experience through its SmartThings ecosystem and open collaboration with partners. For the latest news, please visit the Samsung Newsroom at news.samsung.com
1 Structure with four layers packaged together, and each layer consists of two LPDDR DRAMs.
2 Material that protects semiconductor circuits from various external environments such as heat, impacts, and moisture.
3 Grinding the backside of a wafer.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240806495293/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Kioxia to Showcase CXL™ Compatible Memory Expansion Module KIOXIA XL1 Series for AI Workloads3.8.2026 10:22:00 CEST | Press release
Kioxia Corporation, a world leader in memory solutions, today announced that it will exhibit the KIOXIA XL1 series, a Compute Express Link™ (CXL™) compatible memory expansion module, at the Kioxia booth at FMS: the Future of Memory and Storage, taking place August 4 - 6 in Santa Clara, CA. The product features KIOXIA XL-FLASH™, a low-latency and high-performance flash memory technology that enables flash memory, traditionally used for storage applications, to also be utilized as a memory expansion solution. In addition, it is being designed and developed to support the growing volume of memory-intensive AI applications. Evaluation samples are scheduled to be shipped to industry ecosystem collaborators in August 2026. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260803920975/en/ CXL™ Compatible Memory Expansion Module KIOXIA XL1 Series In recent years, the growing number of AI workloads has significantly increased memory de
Leading Data Centre Operator CEO Announced for Data Center World Europe Keynote3.8.2026 09:00:00 CEST | Press release
Powerhouse Conference Agenda Addresses Critical Infrastructure Challenges; Data Center World Europe Takes Place 13-14 October 2026 in Vienna Data Center World Europe, where data centre developers, AI and cloud providers, energy and utility operators, and solution providers come together to drive the development of an AI-ready, sustainable future, today announces Svein Alte Hagaseth, Founder and CEO, Heim Datacenter will deliver the opening keynote. A recognised industry leader, Svein spent a decade at Green Mountain in several leadership roles, including CEO, scaling the business from regional challenger to global leader. He is now Founder and CEO of Heim Datacenter, a Nordic platform developing scalable, sustainable infrastructure for hyperscale, high-performance computing. Bill Kleyman, Executive Chair, Data Center Programs, Data Center World/CEO and Co-Founder, Apolo will be joining the keynote as moderator. Data Center World Europe takes place 13-14 October 2026 at VIECON – Vienna
Energy Impact Partners Expands Nordic Investment Presence, Deepening Partnership with Nysnø Climate Investments3.8.2026 08:02:00 CEST | Press release
EIP reinforces commitment to Norway as a defining center for next-generation energy innovation Energy Impact Partners LP ("EIP"), a global investment firm with over $5 billion in assets under management, today announced an expanded commitment to the Nordic energy innovation ecosystem, building on its longstanding strategic partnership with Nysnø Climate Investments ("Nysnø"). The expansion reflects EIP's conviction that Norway and the broader Nordic region will be a defining source of next-generation energy companies. It also marks a deepening of the firm's institutional relationship with Nysnø, an investor in EIP's $1.36 billion flagship fund. Together, the two firms aim to strengthen connectivity between Nordic founders and EIP's global network spanning venture capital, private equity, and credit. "Norway is one of the most sophisticated and forward-looking energy markets in the world," said Matthias Dill, CEO & Managing Partner, Europe at EIP. "We believe many of the defining compan
First Plus Expands Relationship with SS&C to Support Cross-Border Operations in APAC3.8.2026 03:00:00 CEST | Press release
SS&C Technologies Holdings, Inc. (Nasdaq: SSNC) today announced that First Plus Asset Management (FPAM), a multi-asset investment management firm, has selected SS&C to provide cross-border operations support across Asia. SS&C will service First Plus across the full investment lifecycle, delivering a scalable, integrated solution supporting transfer agency, order management and execution and investment accounting. FPAM will utilize SS&C to service its growing cross-border operating model and support around $200 million in assets under management*. “As First Plus has expanded, managing our operations has become increasingly complex,” said Jeb Li, Co-Founder and CEO at First Plus. “SS&C’s global footprint and integrated offerings enable us to easily optimize our workflows, so we can focus on scaling quickly and securely while continuing to deliver risk-adjusted returns and best-in-class client service.” The engagement highlights the breadth and scalability of SS&C’s global service model.
Europe’s Largest Celebration of Irish Culture Arrives in Belfast2.8.2026 10:01:00 CEST | Press release
Fleadh Cheoil na hÉireann arrives in Belfast today (2 August), bringing eight days of traditional music, culture and celebration to the city, with organisers expecting up to 800,000 visitors over the course of the festival. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260729147569/en/ Belfast Fleadh - Maddens Bar accordian, guitar and fiddle player (Chris Heaney) One of Europe’s largest cultural events, Fleadh Cheoil na hÉireann is taking place in Belfast for the first time, transforming the city into a vibrant stage for Irish music, dance, language and culture. More than 200 events and 180 traditional music competitions are taking place across venues, streets and neighbourhoods throughout the week-long celebration. The landmark festival showcases the very best of Irish culture, with a packed programme of All-Ireland competitions, concerts, community events and performances from both established and emerging artists. As Ir
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
