SAMSUNG-ELECTRONICS
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced it has begun mass production for the industry’s thinnest 12 nanometer (nm)-class, 12-gigabyte (GB) and 16GB LPDDR5X DRAM packages, solidifying its leadership in the low-power DRAM market.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240806495293/en/
Samsung’s compact LPDDR5X DRAM packages measure 0.65mm high, allowing enhanced thermal control suitable for on-device AI mobile applications (Photo: Business Wire)
Leveraging its extensive expertise in chip packaging, Samsung is able to deliver ultra-slim LPDDR5X DRAM packages that can create additional space within mobile devices, facilitating better airflow. This supports easier thermal control, a factor that is becoming increasingly critical especially for high-performance applications with advanced features such as on-device AI.
"Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package," said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. "We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market."
With the new LPDDR5X DRAM packages, Samsung offers the industry’s thinnest 12 nm-class LPDDR DRAM in a 4-stack structure1, reducing the thickness by approximately 9% and improving heat resistance by about 21.2%, compared to the previous generation product.
By optimizing printed circuit board (PCB) and epoxy molding compound (EMC)2 techniques, the new LPDDR DRAM package is as thin as a fingernail at 0.65 millimeters (mm), the thinnest among existing LPDDR DRAM of 12GB or above. Samsung’s optimized back-lapping3 process is also used to minimize the package height.
Samsung plans to continue expanding the low-power DRAM market by supplying its 0.65mm LPDDR5X DRAM to mobile processor makers as well as mobile device manufacturers. As demand for high-performance, high-density mobile memory solutions in smaller package sizes continues to grow, the company plans to develop 6-layer 24GB and 8-layer 32GB modules into the thinnest LPDDR DRAM packages for future devices.
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, home appliances, network systems, and memory, system LSI, foundry and LED solutions, and delivering a seamless connected experience through its SmartThings ecosystem and open collaboration with partners. For the latest news, please visit the Samsung Newsroom at news.samsung.com
1 Structure with four layers packaged together, and each layer consists of two LPDDR DRAMs.
2 Material that protects semiconductor circuits from various external environments such as heat, impacts, and moisture.
3 Grinding the backside of a wafer.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240806495293/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Murata Unveils World’s First 15nF/1.25kV C0G MLCC in 1210-inch Size2.12.2025 03:00:00 CET | Press release
Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces the launch and mass production of its multilayer ceramic capacitor (MLCC) featuring a capacitance of 15nF, a rated voltage of 1.25kV, and C0G characteristics in the compact 1210-inch (3.2mm x 2.5mm) size. This product delivers highly efficient power conversion and stable performance under high-voltage conditions, making it suitable for onboard chargers (OBCs) in electric vehicles (EVs) and power supply circuits in high-performance consumer devices. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251201104421/en/ [Murata Manufacturing Co., Ltd.] 15nF/1.25kV/C0G MLCC in 1210-inch Size Resonant and snubber circuits are essential for efficient power conversion and suppressing current and voltage peaks. In both circuits, repeated exposure to high voltage and high current can cause even slight changes in component performance, leading to efficiency loss or
With 40% of Agentic AI Projects Predicted to Fail, Leading Software Developer Says Compliance Is the One Place Where Agentic AI Will Thrive2.12.2025 01:01:00 CET | Press release
Ideagen's CEO explains why binary outcomes and high stakes make compliance ideal for autonomous AI The CEO of one of the world’s leading global compliance software developers, Ideagen, has today (December 2, 2025) said compliance represents the one domain where autonomous AI will succeed – despite technology insights company Gartner® warning "… over 40% of agentic AI projects will be canceled by the end of 2027”. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251201511477/en/ Ben Dorks, Ideagen CEO Speaking at the launch of their own agentic AI platform Ideagen Mazlan, Ben Dorks said: “Autonomous AI will succeed in compliance because failure is measurable, stakes are high and outcomes are binary. “AI that continuously monitors jurisdictional or industry specific compliance frameworks, detects patterns across thousands of records, raises actions for others to follow, flags gaps before audits, autonomously? That's agentic. It
VeriSilicon’s NPU IP VIP9000NanoOi-FS has Achieved ISO 26262 ASIL B Certification2.12.2025 01:00:00 CET | Press release
Extending the company’s functional safety IP portfolio to NPU IP VeriSilicon (688521.SH) today announced that its NPU IP VIP9000NanoOi-FS has successfully achieved ISO 26262 ASIL B certification, marking a significant milestone in the functional safety capabilities of the company’s neural network processing unit portfolio. This IP features an architecture streamlined for seamless SoC integration, delivering high-quality inference with low power consumption and a compact silicon footprint. The certificate was issued by SGS-TÜV Saar, an international testing, inspection and certification institution. As part of VeriSilicon’s VIP9000 series, the VIP9000NanoOi-FS IP is designed for automotive and edge AI applications, providing high-performance neural network processing with a safety-compliant architecture. The IP supports a wide range of AI inferencing models including Large Language Models (LLMs) and Convolutional Neural Networks (CNNs), with hardware-accelerated AI inference, enabling r
UMA Launches from Europe to Shape the Global Future of Physical AI1.12.2025 23:52:00 CET | Press release
UMA (Universal Mechanical Assistant), a new robotics intelligence company founded by former leaders from Tesla, Google DeepMind, Nvidia and Hugging Face, launches today with a clear goal: to bring advanced AI into the physical world and build humanoid robots ready for real work, in real environments, at scale. UMA’s founders were instrumental in shaping the last decade of breakthroughs in deep learning, robotics and open-source AI. They are convinced that the next era of artificial intelligence won’t unfold on screens, it will happen in warehouses, hospitals, labs, factories and homes, where machines must face friction, unpredictability and human complexity. UMA is built for this transition: from digital intelligence to physical autonomy. AI Is Moving Off the Screen and into the World The past ten years gave rise to generative models, multimodal systems and language-based intelligence. The next decade will be defined by robotics, powered by an AI that can see, move, manipulate and make
FlightSafety International Appoints Eric Hinson as Chief Executive Officer1.12.2025 23:00:00 CET | Press release
FlightSafety International Inc. today announced the appointment of Eric Hinson as chief executive officer, effective immediately. Hinson will succeed former president Barbara Telek who recently announced her retirement. Hinson’s appointment marks a return to FlightSafety. He served as an executive vice president from 2009 to 2012 before leaving to be the president and CEO of Simcom International, Inc. Hinson started his aviation career as a naval aviator flying tactical aircraft in training, fleet, and operational test squadrons. Today, he is an active ATP-rated pilot with more than 5,000 total flight hours. He brings a unique operational perspective to the position—one that blends executive leadership with firsthand experience. In addition to FlightSafety and Simcom, Hinson has served in a variety of senior leadership positions at leading aviation companies, including Honeywell, Gulfstream, and Piaggio Aerospace. He also served as a board member of the General Aviation Manufacturer As
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom