CA-MIDEA-GROUP
10.7.2024 10:51:29 CEST | Business Wire | Press release
Midea Group, recognized as a leading global technology and innovation enterprise, has successfully completed its 1H 2024 Campus Recruitment Tour with the final event on July 6th at Stanford University. These recruitment activities also represent a significant step in the company's ongoing pursuit of global expansion and the strategic localization of innovation.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240709152530/en/
Midea Group's 2024 1H Overseas Campus Recruitment Tour at Stanford University (Photo: Business Wire)
With a diverse portfolio encompassing smart home solutions, industrial technology, building technology, robotics and automation, and innovative businesses, Midea Group has reaffirmed its dedication to global markets through this comprehensive recruitment initiative. Every year, approximately 15-20% of Midea Group's campus recruits have overseas study backgrounds, significantly enriching the company's international talent pool.
Highlights of the 2024 Midea Campus Recruitment:
- Over 3000 candidates participated in the event
- Over 4 countries and 20 engaging campus offline events conducted
- Over 10 specialized roundtables tailored for doctoral candidates
In-Depth Strategic Sessions:
- Leadership Insights: Keynote sessions led by Midea's CTO, CPO, and other executives provided visionary perspectives on the future of technology and Midea's pivotal role.
- Cultural Deep Dive: Emphasizing Midea's people-centric philosophy, the sessions highlighted the company's commitment to employee wellness, benefits, and personal growth.
- Innovation Showcase: Featuring Midea's expansive R&D network, including the Central Research Institute driving the "2+4+N" global R&D strategy, solidifying Midea's leadership in technological innovation.
Interactive and Immersive Experiences:
- Q&A Sessions: Transparent discussions on Midea's values, opportunities, and expectations.
- Roundtable Discussions: In-depth dialogues on R&D initiatives, career growth, and global presence.
- Alumni Sharing: Personal growth stories from alumni provided firsthand insights into career opportunities within Midea.
A Clear Path to Recruitment:
- Overseas Students Exclusive Channel: Overseas students graduating from January 2024 to December 2025 are all our target candidates and are allowed to submit resumes online.
- Process Clarity: Candidates were guided through a transparent application, interview, and job offer process.
- Diverse Opportunities: Roles spanning R&D, AI, IT, engineering, and more showcased Midea's commitment to diverse skill sets and professional interests.
- Global Outlook: With opportunities in over 40 global cities, Midea offered candidates a chance to work in multicultural environments.
Midea's Ongoing Commitment
From the UK to Germany, Japan, and the United States, Midea's 1H 2024 recruitment journey underscores its steadfast commitment to creating an innovative, inclusive, and open-minded platform. The company continues to invest significantly in its people and R&D, ensuring it remains at the forefront of technological advancement.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240709152530/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Lattice Delivers Industry-First PQC-Enabled Platform Firmware Resilience for AI Infrastructure with Lattice Sentry Solution Stack12.10.2026 22:00:00 CEST | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced the latest version of its Lattice Sentry™ solution stack (v5.0), the industry’s first post-quantum cryptography (PQC)-enabled Platform Firmware Resilience (PFR) and attestation solution. Extending Lattice's post-quantum cryptography leadership from silicon to a complete platform security stack, Lattice Sentry now delivers CNSA 2.0-aligned, NIST-compliant protection across AI data centers, and critical infrastructure, giving system designers a validated, production-ready path to quantum-resistant security. Lattice Sentry extends the company’s PQC leadership, combining the industry's first CNSA 2.0-compliant FPGA portfolio with AMI's platform management software to deliver a complete, integrated platform security solution. “AI infrastructure and the threat landscape are evolving rapidly. Platform firmware has become a primary attack vector, and the quantum era will upend decades
Cooler Master Expands End-to-End Cooling Solutions for AI Infrastructure12.10.2026 19:00:00 CEST | Press release
2,500 kW CDU anchors a portfolio spanning facility cooling, coolant distribution, rack-level thermal management and deployment equipment for high-density AI infrastructure Cooler Master, a global leader in digital infrastructure cooling solutions, has outlined its end-to-end cooling portfolio for AI infrastructure, designed to support high-density computing deployments in new data centers and existing facilities expanding AI capacity. Anchored by a 2,500 kW Liquid-to-Liquid In-Row Coolant Distribution Unit (CDU), the portfolio spans facility-level heat transfer, rack and server cooling, and the equipment used to prepare liquid cooling systems for operation. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012102572/en/ “Customers need choices that bring fast time-to-market, flexibility, and scalability for the deployment of their facilities,” said Thomas Chen, CEO at Cooler Master Corporation. “We aim to help them put liqui
GigaDevice Deepens Ecosystem Collaboration with LVGL to Advance GD32’s Global Open-Source GUI Ecosystem12.10.2026 15:00:00 CEST | Press release
GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, is deepening its ecosystem collaboration with LVGL. LVGL's Open graphics library is one of the world’s most widely‑adopted open‑source embedded frameworks. Eight GD32 MCU product families have now been officially included in the LVGL ecosystem, providing developers worldwide with more convenient and efficient support for embedded graphics development. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012320702/en/ Eight GD32 product series supported on LVGL website LVGL is an open-source graphical user interface framework designed for embedded devices, commercially supported by LVGL Ltd., a technology company based in Cambridge, UK. Lightweight, efficient, and cross-platform, it can be widely used in applications such as smart home devices, industrial control systems, consumer electronics, a
W. L. Gore & Associates Launches GORE® Battery Vents – MultiVent Series at the Battery Show12.10.2026 14:00:00 CEST | Press release
The integrated battery vent combines pressure equalization, moisture protection, and resealable thermal-runaway evacuation in a single part, with one opening in the pack wall. Today, W. L. Gore & Associates (Gore) introduced GORE® Battery Vents – MultiVent Series at The Battery Show North America 2026, a new integrated venting architecture that combines all three functions into a single device. Designed for lithium-ion battery packs in electric vehicles and energy storage systems, GORE® MultiVent is an integrated battery vent: one device that equalizes pressure, protects against moisture and evacuates gas during thermal runaway, then reseals. It gives pack designers an alternative to combining dual-stage vents, separate evacuation valves and desiccants. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012625188/en/ GORE® MultiVent GORE MultiVent builds on technology Gore acquired from Vernay Laboratories in 2026 and combine
Echodyne and ACS Sign Strategic Collaboration Agreement to Advance Counter-UAS Capabilities Worldwide12.10.2026 14:00:00 CEST | Press release
Successful integration of EchoShield® radar with ACS’s Bullfrog™ autonomousweapon station delivers precise tracking and affordable kinetic defeat across land and maritime missions. Echodyne, the radar platform company, and ACS, a precision robotics company for defense, today announced the signing of a Strategic Collaboration Agreement to accelerate the development, demonstration, and deployment of integrated counter-unmanned aircraft system (C-UAS) solutions. The agreement establishes collaboration across Echodyne’s high-performance commercial counter-UAS radar hardware and software roadmaps and ACS’s Bullfrog robotic weapon station capabilities, and follows the recent announcement of each company’s award from Joint Interagency Task Force 401 for Domestic Shield, the JIATF-401 C-UAS Marketplace, and other critical counter-drone requirements. Bullfrog combines computer vision, autonomous control, and precision robotics with existing weapon systems to detect, track, identify, and engage
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom