Business Wire

QUECTEL-WIRELESS

12.6.2024 11:06:35 CEST | Business Wire | Press release

Share
Quectel Revolutionizes Short-Range Communication Adding Five New Wi-Fi and Bluetooth Modules to Its Portfolio

Introducing the latest innovation in short-range communication technology, Quectel Wireless Solutions, a global IoT solutions provider, today unveils five modules, designed to transform IoT through seamless Wi-Fi and Bluetooth connectivity and offering unparalleled performance, reliability, and versatility, catering to the diverse needs of IoT worldwide.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240612636711/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

Quectel revolutionizes short-range communication adding five new Wi-Fi and Bluetooth modules to its portfolio (Photo: Business Wire)

“We’re aiming to redefine the landscape of short-range communication technology with this range of five different modules,” commented Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “From lightning-fast Wi-Fi to robust Bluetooth connectivity, our latest innovations promise unparalleled performance, reliability, and versatility. With compact designs tailored to meet the demands of size-sensitive applications, these modules empower IoT solutions worldwide to reach new heights of connectivity and efficiency."

The FCS866R and FCE863R are high performance Wi-Fi 6 and Bluetooth 5.2 modules boasting 2T2R capabilities packaged in an LCC format. Both modules are ideal for WLAN and Bluetooth connections, delivering lightning-fast data rates of up to 1201Mbps. At just 15.0mm × 13.0mm × 2.0mm for the FCS866R and 15.0 mm × 13.0 mm × 2.2 mm for the FCE863R, both modules optimize size and cost for end-products, catering perfectly to size-sensitive applications.

The FCS866R is designed with a reliable SDIO 3.0 interface to provide WLAN capability, the module achieves low-power and high-speed data transmission, while the FCE863R uses the reliable PCIe 1.1 interface to achieve high-speed and low-power WLAN wireless transmission. The FCE863R can support industrial operating temperatures of -40 to around +85°C.

The FGS061N is another Wi-Fi 6 and Bluetooth 5.2 module, this time housed in an LGA package. Operating under the IEEE 802.11ax standard protocol, it supports MCS 0–MCS 11 rates within an 80 MHz bandwidth, with 1024QAM support. Boasting a reliable SDIO 3.0 interface, it ensures seamless WLAN capability.

The FC906A is a robust Wi-Fi 5 and Bluetooth 5.2 module packaged in LCC format. Designed for establishing both WLAN and Bluetooth connections, it operates under IEEE 802.11ac mode, supporting rates from MCS 0–MCS 8 in 20 MHz channels and MCS 0–MCS 9 in 40 MHz and 80 MHz channels. With 256QAM support, it achieves a maximum data rate of up to 433.3 Mbps, while also ensuring compatibility with all rates specified in IEEE 802.11a/b/g/n standards.

Equipped with a reliable SDIO 3.0 interface for WLAN capability, the FC906A includes 2.4 GHz and 5 GHz transmit power amplifiers and low noise amplifiers. On the Bluetooth front, it complies with Bluetooth 5.2 standards, featuring a Class 1 power amplifier for extended range. Plus, it supports Extended Synchronous Connection Oriented link (eSCO) for enhanced voice quality and Adaptive Frequency Hopping (AFH) to minimize radio frequency interference.

Finally, the FCS945R is a dual band Wi-Fi 4 and Bluetooth 5.2 module designed for WLAN and Bluetooth connections. Operating under IEEE 802.11n mode, it achieves a maximum data rate of up to 150 Mbps. With its LCC form factor and ultra-compact package size of just 12.0mm × 12.0mm × 2.15mm, the FCS945R is optimized for size and cost, perfectly meeting the requirements of size-sensitive applications, and can support industrial operating temperatures of -40 to +85°C.

The five modules are available in either LCC or LGA package and the surface-mount technology (SMT), alongside the low profile and small size ensure that all five modules can be easily embedded into size-constrained applications to provide reliable connectivity.

Quectel’s IoT modules are developed with security at the core. From product architecture to firmware/software development, Quectel incorporates leading industry practices and standards, mitigating potential vulnerabilities with third party independent test houses and have incorporated security practices like generating SBOMs and VEX files as well as performing firmware binary analysis into the entire software development lifecycle.

More information on the short-range module range can be found on the Quectel website.

About Quectel

Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of 5,900 professionals sets the pace for innovation in cellular, GNSS, Wi-Fi and Bluetooth modules as well as antennas and services.

With regional offices and support across the globe, our international leadership is devoted to advancing IoT and helping build a smarter world.

For more information, please visit: www.quectel.com, LinkedIn, Facebook, and X.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240612636711/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

TestMu AI Announces Day-Zero Support for macOS Golden Gate and iOS 27 Beta Following WWDC 202610.6.2026 21:52:00 CEST | Press release

Developers can now test websites, web applications, and mobile apps on Apple's latest operating systems before their public release TestMu AI (formerly LambdaTest), the world's first full-stack Agentic AI Quality Engineering platform, today announced day-zero support for Apple's newly unveiled operating systems, macOS Golden Gate and iOS 27 Beta, across its cloud testing platform. Announced at Apple's Worldwide Developers Conference (WWDC) 2026, macOS Golden Gate and iOS 27 introduce significant platform updates that will impact application compatibility, user experience, and performance. Both operating systems are now available for testing on TestMu AI, the same day Apple released its beta versions, allowing engineering teams to identify issues months before the stable rollout reaches millions of users worldwide. macOS Golden Gate is available through the TestMu AI Real Time Testing platform, while iOS 27 Beta is available on TestMu AI Real Device Cloud across the latest iPhones and i

Pure Lithium Corporation Named World Economic Forum Technology Pioneer10.6.2026 20:10:00 CEST | Press release

Lithium metal battery innovator joins a select global cohort of 100 pioneering companies shaping the future of energy and advanced materials Pure Lithium Corporation, a disruptive lithium metal battery technology company, is pleased to announce that the company has been selected as a 2026 Technology Pioneer by the World Economic Forum. Launched in 2000, the Technology Pioneers is a leading community for companies from around the world that are shaping the future through breakthrough technologies and innovations. These companies are selected for their potential to have a significant impact on business and society and are invited to engage with public and private sector leaders through the World Economic Forum’s global platform. “We are delighted to be selected as a World Economic Forum Technology Pioneer. I would like to express my gratitude to the World Economic Forum for this honor,” said Pure Lithium Founder, Chairman and CEO, Emilie Bodoin. “Pure Lithium’s selection is a testament t

Visa Partners with OpenAI to Power the Next Generation of AI Commerce10.6.2026 20:00:00 CEST | Press release

New collaboration brings Visa’s global payment networkto one of the largest AI platforms and aims to support seamless, secure transactions and broader AI-powered use cases across commerce environments supported by agents Visa (NYSE: V) today announced a strategic collaboration with OpenAI to enable secure Visa payments within agentic commerce, enabling seamless and trusted payments across OpenAI. The companies made the announcement at the Visa Payments Forum in San Francisco. Through the partnership, Visa will provide its global network, credentialing capabilities and security infrastructure to support agentic commerce experiences, helping consumers and businesses interact and transact with confidence. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260610422687/en/ The collaboration is part of the broader Visa Intelligent Commerce initiative, which is focused on extending secure payment capabilities into new digital environm

Visa Announces New AI, Stablecoin and Token Innovations to Power Intelligent, Programmable Commerce at Visa Payments Forum10.6.2026 20:00:00 CEST | Press release

New Agent Scoring, Agentic Registry and Large Transaction Model capabilities, stablecoin settlement and token enhancements support the next gen of digital commerce At Visa Payments Forum 2026, Visa (NYSE: V) today announced new AI, stablecoin and token capabilities designed to help clients unlock the next generation of commerce. These innovations reflect a simple objective: ensuring trust, security and control evolve alongside increasingly fast, automated and intelligent commerce experiences. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260610464331/en/ In a keynote presentation, Jack Forestell, Chief Product & Strategy Officer at Visa, outlined how two foundational shifts—artificial intelligence and stablecoins—are transforming both the front end and back end of money movement, and how Visa is enabling clients to participate. “AI is transforming the front end of commerce. Stablecoins are reshaping the back end,” said Fore

NEURA Robotics Announces Record Series C of up to $1.4 Billion to Accelerate the World’s Leading Physical AI Platform10.6.2026 17:26:00 CEST | Press release

Landmark investment drives NEURA's open ecosystem, where humanoid and cognitive robots share intelligence and capabilities at scaleBacking from Tether, Qualcomm Technologies, Amazon, NVIDIA, imec.xpand, Bosch, Schaeffler, European Investment Bank, Lingotto Horizon, InterAlpen Partners and others demonstrates global confidence in NEURA’s leadershipNew capital raise is the largest of a full-stack robotics company everCapital will drive serial production to multi-million robots by 2030 and support the global rollout of NEURA Gyms, the world’s first real-world training environments for cognitive robots and Physical AI NEURA Robotics (“NEURA”), the pioneer in cognitive robotics and creator of the Neuraverse, today announced a landmark Series C financing with a total round size of up to $1.4 billion to accelerate its mission of building the world’s leading Physical AI platform. The financing brings together global leaders across AI, robotics, compute, manufacturing and industrial infrastruct

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye