Business Wire

QUECTEL-WIRELESS

12.6.2024 11:06:35 CEST | Business Wire | Press release

Share
Quectel Revolutionizes Short-Range Communication Adding Five New Wi-Fi and Bluetooth Modules to Its Portfolio

Introducing the latest innovation in short-range communication technology, Quectel Wireless Solutions, a global IoT solutions provider, today unveils five modules, designed to transform IoT through seamless Wi-Fi and Bluetooth connectivity and offering unparalleled performance, reliability, and versatility, catering to the diverse needs of IoT worldwide.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240612636711/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

Quectel revolutionizes short-range communication adding five new Wi-Fi and Bluetooth modules to its portfolio (Photo: Business Wire)

“We’re aiming to redefine the landscape of short-range communication technology with this range of five different modules,” commented Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “From lightning-fast Wi-Fi to robust Bluetooth connectivity, our latest innovations promise unparalleled performance, reliability, and versatility. With compact designs tailored to meet the demands of size-sensitive applications, these modules empower IoT solutions worldwide to reach new heights of connectivity and efficiency."

The FCS866R and FCE863R are high performance Wi-Fi 6 and Bluetooth 5.2 modules boasting 2T2R capabilities packaged in an LCC format. Both modules are ideal for WLAN and Bluetooth connections, delivering lightning-fast data rates of up to 1201Mbps. At just 15.0mm × 13.0mm × 2.0mm for the FCS866R and 15.0 mm × 13.0 mm × 2.2 mm for the FCE863R, both modules optimize size and cost for end-products, catering perfectly to size-sensitive applications.

The FCS866R is designed with a reliable SDIO 3.0 interface to provide WLAN capability, the module achieves low-power and high-speed data transmission, while the FCE863R uses the reliable PCIe 1.1 interface to achieve high-speed and low-power WLAN wireless transmission. The FCE863R can support industrial operating temperatures of -40 to around +85°C.

The FGS061N is another Wi-Fi 6 and Bluetooth 5.2 module, this time housed in an LGA package. Operating under the IEEE 802.11ax standard protocol, it supports MCS 0–MCS 11 rates within an 80 MHz bandwidth, with 1024QAM support. Boasting a reliable SDIO 3.0 interface, it ensures seamless WLAN capability.

The FC906A is a robust Wi-Fi 5 and Bluetooth 5.2 module packaged in LCC format. Designed for establishing both WLAN and Bluetooth connections, it operates under IEEE 802.11ac mode, supporting rates from MCS 0–MCS 8 in 20 MHz channels and MCS 0–MCS 9 in 40 MHz and 80 MHz channels. With 256QAM support, it achieves a maximum data rate of up to 433.3 Mbps, while also ensuring compatibility with all rates specified in IEEE 802.11a/b/g/n standards.

Equipped with a reliable SDIO 3.0 interface for WLAN capability, the FC906A includes 2.4 GHz and 5 GHz transmit power amplifiers and low noise amplifiers. On the Bluetooth front, it complies with Bluetooth 5.2 standards, featuring a Class 1 power amplifier for extended range. Plus, it supports Extended Synchronous Connection Oriented link (eSCO) for enhanced voice quality and Adaptive Frequency Hopping (AFH) to minimize radio frequency interference.

Finally, the FCS945R is a dual band Wi-Fi 4 and Bluetooth 5.2 module designed for WLAN and Bluetooth connections. Operating under IEEE 802.11n mode, it achieves a maximum data rate of up to 150 Mbps. With its LCC form factor and ultra-compact package size of just 12.0mm × 12.0mm × 2.15mm, the FCS945R is optimized for size and cost, perfectly meeting the requirements of size-sensitive applications, and can support industrial operating temperatures of -40 to +85°C.

The five modules are available in either LCC or LGA package and the surface-mount technology (SMT), alongside the low profile and small size ensure that all five modules can be easily embedded into size-constrained applications to provide reliable connectivity.

Quectel’s IoT modules are developed with security at the core. From product architecture to firmware/software development, Quectel incorporates leading industry practices and standards, mitigating potential vulnerabilities with third party independent test houses and have incorporated security practices like generating SBOMs and VEX files as well as performing firmware binary analysis into the entire software development lifecycle.

More information on the short-range module range can be found on the Quectel website.

About Quectel

Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of 5,900 professionals sets the pace for innovation in cellular, GNSS, Wi-Fi and Bluetooth modules as well as antennas and services.

With regional offices and support across the globe, our international leadership is devoted to advancing IoT and helping build a smarter world.

For more information, please visit: www.quectel.com, LinkedIn, Facebook, and X.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240612636711/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Airship Announces Results Guarantee; Releases Commissioned Study Finding 476% ROI for Composite Organization22.7.2026 17:00:00 CEST | Press release

Airship stands behind results with new guarantee offer*; also launches a commissioned study quantifying how a composite organization moved past vanity metrics to drive $7.3M in value Airship, the mobile-first customer experience platform leader, today announced its Airship Results Guarantee, a corporate commitment to achieve predetermined business outcomes for new customers. Concurrently, the company released the results of a separate, commissioned Total Economic Impact™ (TEI) study conducted by Forrester Consulting on behalf of Airship, July 2026. The study found that a composite organization based on interviewed customers achieved a 476% Return on Investment (ROI) with a payback period of less than six months. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260722832535/en/ Airship has launched a new results guarantee offer to stand behind its value. Alongside this offer, the team shared the results of a new Total Economic

Arrakis Comes out of Stealth With $38M to Help Industrial Enterprises Compete in the AI Era22.7.2026 15:56:00 CEST | Press release

Funding led by Blossom Capital with participation from Accel, GFC, MainObject, and Rerail, bringing total raised to around $38 million in just six months. Arrakis helps industrial companies deploy AI agents into mission-critical operations, tackling the "last mile" challenge that prevents most AI projects reaching production. The funding will enable office openings in New York and the Middle East, platform development and AI deployment in the world's most operationally complex industries. Arrakis, the AI deployment company helping industrial companies install AI agents for mission-critical operations, today announced a $30 million Series A led by Blossom Capital, with participation from existing investor Accel, which also led the company's $7.5 million seed round. The round brings total funding to around $38 million and includes backing from prominent technology leaders, including Olivier Pomel, founder and chief executive of Datadog, Olivier Godement, OpenAI’s Head of business product

Vultr and AMD Support the University of Cambridge's TESSERA AI Project to Accelerate Global Environmental Monitoring22.7.2026 15:00:00 CEST | Press release

Cambridge University's Energy & Environment Group Deploys Planetary-Scale Foundation Model on Vultr Cloud GPU Infrastructure Powered by AMD Instinct™ MI325X GPUs Vultr, the world’s largest privately-held cloud infrastructure company, and AMD, a leader in high-performance and AI computing, have announced their support for the University of Cambridge's Energy & Environment Group in developing TESSERA, a groundbreaking AI foundation model designed to monitor environmental change internationally at unprecedented scale. Vultr is providing the computational infrastructure, based on AMD Instinct MI325X accelerators, necessary to generate global embeddings covering Earth's land surface from 2017 to 2025, enabling applications in agriculture, biodiversity conservation, and renewable energy infrastructure monitoring. The collaboration represents a significant advancement in applying artificial intelligence to planetary conservation challenges. TESSERA processes data from European Space Agency Se

StructureCraft Scales Data-Driven Design on NetApp22.7.2026 14:00:00 CEST | Press release

Structural engineering firm modernizes data infrastructure to support global collaboration NetApp® (NASDAQ: NTAP), the Intelligent Data Infrastructure company, today announced that StructureCraft, an award-winning global structural engineering and construction firm known for complex timber and hybrid builds, is now using NetApp to modernize and create an AI-ready data infrastructure. The new infrastructure enables the company’s employees to collaborate globally, store and manage large-scale design workloads, and take advantage of AI-driven tools on a scalable, centralized platform. StructureCraft specializes in innovative timber engineering, structural design, and sustainable building solutions for large-scale architectural projects worldwide. Its globally distributed team delivers complex projects across North America, Europe, and Asia, guided by a core purpose to engineer and build beautiful, efficient structures. The StructureCraft team regularly takes on complex projects such as de

OneSpan Introduces DigipassONE, Bringing a Unified Platform Approach to Authentication Modernization22.7.2026 14:00:00 CEST | Press release

A new authentication platform helps financial institutions support diverse customer authentication preferences while modernizing at their own pace Organizations are under increasing pressure to modernize authentication while supporting existing infrastructure, meeting evolving regulatory requirements, deploying emerging technologies, and reducing operational complexity. For financial institutions in particular, authentication modernization must balance security, compliance, and operational efficiency while meeting the evolving expectations and preferences of their customers. Yet the journey to modern authentication is rarely a single technology transition. Organizations must continue supporting multiple authentication methods while gradually adopting new technologies, making it essential to modernize without disrupting existing environments, user experiences, or business operations. To help organizations navigate this transition, OneSpan Inc. (NASDAQ: OSPN) today announced DigipassONE™

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye