Business Wire

QUECTEL-WIRELESS

12.6.2024 11:06:35 CEST | Business Wire | Press release

Share
Quectel Revolutionizes Short-Range Communication Adding Five New Wi-Fi and Bluetooth Modules to Its Portfolio

Introducing the latest innovation in short-range communication technology, Quectel Wireless Solutions, a global IoT solutions provider, today unveils five modules, designed to transform IoT through seamless Wi-Fi and Bluetooth connectivity and offering unparalleled performance, reliability, and versatility, catering to the diverse needs of IoT worldwide.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240612636711/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

Quectel revolutionizes short-range communication adding five new Wi-Fi and Bluetooth modules to its portfolio (Photo: Business Wire)

“We’re aiming to redefine the landscape of short-range communication technology with this range of five different modules,” commented Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “From lightning-fast Wi-Fi to robust Bluetooth connectivity, our latest innovations promise unparalleled performance, reliability, and versatility. With compact designs tailored to meet the demands of size-sensitive applications, these modules empower IoT solutions worldwide to reach new heights of connectivity and efficiency."

The FCS866R and FCE863R are high performance Wi-Fi 6 and Bluetooth 5.2 modules boasting 2T2R capabilities packaged in an LCC format. Both modules are ideal for WLAN and Bluetooth connections, delivering lightning-fast data rates of up to 1201Mbps. At just 15.0mm × 13.0mm × 2.0mm for the FCS866R and 15.0 mm × 13.0 mm × 2.2 mm for the FCE863R, both modules optimize size and cost for end-products, catering perfectly to size-sensitive applications.

The FCS866R is designed with a reliable SDIO 3.0 interface to provide WLAN capability, the module achieves low-power and high-speed data transmission, while the FCE863R uses the reliable PCIe 1.1 interface to achieve high-speed and low-power WLAN wireless transmission. The FCE863R can support industrial operating temperatures of -40 to around +85°C.

The FGS061N is another Wi-Fi 6 and Bluetooth 5.2 module, this time housed in an LGA package. Operating under the IEEE 802.11ax standard protocol, it supports MCS 0–MCS 11 rates within an 80 MHz bandwidth, with 1024QAM support. Boasting a reliable SDIO 3.0 interface, it ensures seamless WLAN capability.

The FC906A is a robust Wi-Fi 5 and Bluetooth 5.2 module packaged in LCC format. Designed for establishing both WLAN and Bluetooth connections, it operates under IEEE 802.11ac mode, supporting rates from MCS 0–MCS 8 in 20 MHz channels and MCS 0–MCS 9 in 40 MHz and 80 MHz channels. With 256QAM support, it achieves a maximum data rate of up to 433.3 Mbps, while also ensuring compatibility with all rates specified in IEEE 802.11a/b/g/n standards.

Equipped with a reliable SDIO 3.0 interface for WLAN capability, the FC906A includes 2.4 GHz and 5 GHz transmit power amplifiers and low noise amplifiers. On the Bluetooth front, it complies with Bluetooth 5.2 standards, featuring a Class 1 power amplifier for extended range. Plus, it supports Extended Synchronous Connection Oriented link (eSCO) for enhanced voice quality and Adaptive Frequency Hopping (AFH) to minimize radio frequency interference.

Finally, the FCS945R is a dual band Wi-Fi 4 and Bluetooth 5.2 module designed for WLAN and Bluetooth connections. Operating under IEEE 802.11n mode, it achieves a maximum data rate of up to 150 Mbps. With its LCC form factor and ultra-compact package size of just 12.0mm × 12.0mm × 2.15mm, the FCS945R is optimized for size and cost, perfectly meeting the requirements of size-sensitive applications, and can support industrial operating temperatures of -40 to +85°C.

The five modules are available in either LCC or LGA package and the surface-mount technology (SMT), alongside the low profile and small size ensure that all five modules can be easily embedded into size-constrained applications to provide reliable connectivity.

Quectel’s IoT modules are developed with security at the core. From product architecture to firmware/software development, Quectel incorporates leading industry practices and standards, mitigating potential vulnerabilities with third party independent test houses and have incorporated security practices like generating SBOMs and VEX files as well as performing firmware binary analysis into the entire software development lifecycle.

More information on the short-range module range can be found on the Quectel website.

About Quectel

Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of 5,900 professionals sets the pace for innovation in cellular, GNSS, Wi-Fi and Bluetooth modules as well as antennas and services.

With regional offices and support across the globe, our international leadership is devoted to advancing IoT and helping build a smarter world.

For more information, please visit: www.quectel.com, LinkedIn, Facebook, and X.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240612636711/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Agileo Automation Launches Agil'EDA to Accelerate SEMI EDA Adoption for Semiconductor Equipment OEMs25.3.2026 07:00:00 CET | Press release

High-performance connectivity software delivers structured, high-volume equipment data required by tier-one fabs and advanced packaging facilities ahead of expected mid-2026 SEMI standards update Agileo Automation, a leading global provider of control and connectivity solutions for semiconductor manufacturing, today unveils Agil'EDA, a new software implementing Equipment Data Acquisition (EDA/Interface A). This solution enables semiconductor equipment manufacturers to meet the evolving high-performance connectivity requirements of tier-one fabs and advanced packaging facilities. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260323881880/en/ Agileo Automation unveils Agil'EDA, a new software solution implementing Equipment Data Acquisition (EDA), a set of SEMI standards also known as Interface A, to enable semiconductor equipment manufacturers to meet the evolving high-performance connectivity requirements of tier-one fabs a

RSA Announces Expanded Partnership with Microsoft, Enhances Leadership in Passwordless Identity Security24.3.2026 17:00:00 CET | Press release

Innovative partnership ushers in new era of secure, AI-powered workforce authentication RSA today announced expanded support for the new Microsoft 365 E7: The Frontier Suite solution at RSAC Conference 2026. This new support joins additional passwordless capabilities that provide organizations with enhanced security, seamless experience, and resilient operations as they embrace the future of AI-driven productivity. By integrating RSA® ID Plus for Microsoft with Microsoft 365 E7, enterprises can ensure trusted authentication for both human users and AI agents, while safeguarding sensitive data and privileged operations across hybrid, cloud, and on-premises environments. This deployment follows RSA joining the Microsoft Intelligent Security Association (MISA), launching RSA Advisor for Admin Threats in Microsoft Security Copilot, and deploying RSA ID Plus Admin Logs Connector, further strengthening the ongoing collaboration between RSA and Microsoft. “The rise of AI agents in the enterpr

Lexon × Jeff Koons Unveil the Chromatic Collection: a Colorful New Chapter for the Acclaimed Balloon Dog Lamp and Balloon Dog Speaker24.3.2026 15:10:00 CET | Press release

Eight new models introduce vibrant color variations, expanding the collection’s appeal to new and existing collectors alike. Following the success of its 2025 inaugural edition, the Lexon × Jeff Koons collaboration enters a bold new era with the launch of the Chromatic Collection—a colorful evolution of its Balloon Dog Lamp and Balloon Dog Speaker. Pre-orders will be available starting March 24, 2026, exclusively on lexon-design.com as part of a time-limited edition. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260324498068/en/ Lexon x Jeff Koons — new Chromatic Collection Retaining the signature translucent body that reveals the technology within, the Chromatic Collection introduces eight models: Balloon Dog Lamps in Gold, Blue, Red, and Platinum, and Balloon Dog Speakers in Gold, Blue, Red, and White, reinforcing the collectible nature of the series, offering new audiences an entry point while giving existing collectors

iQmetrix Joins TM Forum as ODA Component Directory Partner, Giving Telecom Operators a Faster, Cleaner Path to Modern Commerce24.3.2026 15:00:00 CET | Press release

Platform’s Standards-Based Architecture Reduces Integration Risk and Accelerates Transformation for CSPs Worldwide iQmetrix, the global provider of Interconnected Commerce solutions purpose-built for telecom retail, today announced it has joined TM Forum and earned recognition as an Open Digital Architecture (ODA) Component Directory Partner. The achievement validates that iQmetrix aligns with the ODA vision and that its platform is built around standardized open APIs, modular cloud-native components, and interoperable architecture aligned with how leading operators are building their digital futures. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260324562860/en/ iQmetrix partners with TM Forum’s ODA Component Directory to accelerate open, future‑ready telecom transformation The recognition comes as communications service providers (CSPs) accelerate AI adoption and move away from integration-heavy legacy environments. For o

Miro Acquires Reforge to Help Organizations Navigate the Transition to AI24.3.2026 14:00:00 CET | Press release

Together, Reforge and Miro will provide a powerful and highly differentiated solution for teams that blends the tools and knowledge needed to innovate in the AI era Miro®, the AI Innovation Workspace for teams, today announced that it has acquired (subject to customary closing conditions) Reforge, an AI platform for product teams. The deal includes Reforge's team, learning platform, and AI-powered product development tools. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260324623461/en/ Organizations are grappling with how to leverage AI to its full potential. In many cases, the problem is not how to code faster, but deciding what to build. That's the bottleneck slowing companies down today. Miro and Reforge are both solving this challenge for customers – tackling the need to build both at speed and with clear strategic direction. Miro brings a collaborative AI workflows platform that brings teams and AI together to plan, co

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye