OR-UALINK
30.5.2024 14:01:28 CEST | Business Wire | Press release
AMD, Broadcom, Cisco, Google, Hewlett Packard Enterprise (HPE), Intel, Meta and Microsoft today announced they have aligned to develop a new industry standard dedicated to advancing high-speed and low latency communication for scale-up AI systems linking in Data Centers.
Called the Ultra Accelerator Link (UALink), this initial group will define and establish an open industry standard that will enable AI accelerators to communicate more effectively. By creating an interconnect based upon open standards, UALink will enable system OEMs, IT professionals and system integrators to create a pathway for easier integration, greater flexibility and scalability of their AI-connected data centers.
The Promoter Group companies bring extensive experience creating large-scale AI and HPC solutions based on open standards, efficiency and robust ecosystem support.
Driving Scale-Up for AI Workloads
As the demand for AI compute grows, it is critical to have a robust, low-latency and efficient scale-up network that can easily add computing resources to a single instance. Creating an open, industry standard specification for scale-up capabilities will help to establish an open and high-performance environment for AI workloads, providing the highest performance possible.
This is where UALink and an industry specification becomes critical to standardize the interface for AI and Machine Learning, HPC, and Cloud applications for the next generation of AI data centers and implementations. The group will develop a specification to define a high-speed, low-latency interconnect for scale-up communications between accelerators and switches in AI computing pods.
The 1.0 specification will enable the connection of up to 1,024 accelerators within an AI computing pod and allow for direct loads and stores between the memory attached to accelerators, such as GPUs, in the pod. The UALink Promoter Group has formed the UALink Consortium and expects it to be incorporated in Q3 of 2024. The 1.0 specification is expected to be available in Q3 of 2024 and made available to companies that join the Ultra Accelerator Link (UALink) Consortium.
About Ultra Accelerator Link
Ultra Accelerator Link (UALink) is a high-speed accelerator interconnect technology that advances next-generation AI/ML cluster performance. AMD, Broadcom, Cisco, Google, HPE, Intel, Meta and Microsoft are forming an open industry standard body to develop technical specifications that facilitate breakthrough performance for emerging usage models while supporting an open ecosystem for data center accelerators.
Supporting Quotes
“The work being done by the companies in UALink to create an open, high performance and scalable accelerator fabric is critical for the future of AI. Together, we bring extensive experience in creating large scale AI and high-performance computing solutions that are based on open-standards, efficiency and robust ecosystem support. AMD is committed to contributing our expertise, technologies and capabilities to the group as well as other open industry efforts to advance all aspects of AI technology and solidify an open AI ecosystem.” – Forrest Norrod, executive vice president and general manager, Data Center Solutions Group, AMD
"Broadcom is proud to be one of the founding members of the UALink Consortium, building upon our long-term commitment to increase large-scale AI technology implementation into data centers. It is critical to support an open ecosystem collaboration to enable scale-up networks with a variety of high-speed and low-latency solutions.” – Jas Tremblay, vice president and general manager of the Data Center Solutions Group, Broadcom
“Ultra-high performance interconnects are becoming increasingly important as AI workloads continue to grow in size and scope. Together, we are committed to developing the UALink which will be a scalable and open solution available to help overcome some of the challenges with building AI supercomputers.” – Martin Lund, Executive Vice President, Common Hardware Group, Cisco
“Open standards are important to HPE as we innovate in supercomputing and increase access to systems. As a founding member of the UALink industry consortium, we look forward to contributing our expertise in high performance networking and systems, and collaborating to develop a new open standard for accelerator interconnects for the next generation of supercomputing.” – Trish Damkroger, senior vice president and general manager, HPC & AI Infrastructure Solutions, HPE
“UALink is an important milestone for the advancement of Artificial Intelligence computing. Intel is proud to co-lead this new technology and bring our expertise in creating an open, dynamic AI ecosystem. As a founding member of this new consortium, we look forward to a new wave of industry innovation and customer value delivered though the UALink standard. This initiative extends Intel’s commitment to AI connectivity innovation that includes leadership roles in the Ultra Ethernet Consortium and other standards bodies.” – Sachin Katti, SVP & GM, Network and Edge Group, Intel Corporation
“In a very short period of time, the technology industry has embraced challenges that AI and HPC have uncovered. Interconnecting accelerators like GPUs requires a holistic perspective when seeking to improve efficiencies and performance. At UEC, we believe that UALink’s scale-up approach to solving pod cluster issues complements our own scale-out protocol, and we are looking forward to collaborating together on creating an open, ecosystem-friendly, industry-wide solution that addresses both kinds of needs in the future.” – J Metz, Ph.D., Chair, Ultra Ethernet Consortium
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240530653602/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Americhem Appoints Kilian Lamprecht as Vice President of Mergers & Acquisitions to Accelerate Strategic Growth18.3.2026 12:00:00 CET | Press release
Americhem, a global leader in polymer solutions, today announced that Kilian Lamprecht has joined the company as Vice President of Mergers & Acquisitions. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260317304976/en/ Kilian Lamprecht, Vice President of Mergers & Acquisitions, Americhem Lamprecht brings extensive experience in corporate development and integration within global industrial and technology organizations. He will work closely with Americhem’s executive leadership team and investment partner PPC to identify and execute strategic acquisitions, partnerships and portfolio investments that expand the company’s capabilities, product portfolio and geographic reach. “Americhem has a long history of disciplined growth and innovation in materials science,” said John Richard, CEO of Americhem. “With the support of PPC, we are expanding our ability to pursue strategic acquisitions that strengthen our technology platform, b
Reply Announces a Partnership With Mistral AI to Develop Sovereign and Enterprise-grade Artificial Intelligence Solutions18.3.2026 09:00:00 CET | Press release
Reply [EXM, STAR: REY] today announced a new partnership agreementwithAI leader Mistral AI aimed at accelerating the adoption of local, customisable, secure and enterprise-grade generative AI solutions at scale. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260318232777/en/ Through this collaboration, Reply and Mistral AI provide a trusted and secure environment on European infrastructures, accelerating the adoption of advanced AI solutions while enabling organizations with stringent regulatory, privacy and data protection requirements to fully leverage generative AI. At the core of the collaboration is a shared vision of frontier AI, designed to enable organizations to adopt AI solutions while ensuring data control, protection of sensitive information, compliance with regulatory requirements and deployment on European infrastructures. By combining Mistral AI’s high-performance AI models with Reply’s expertise in designing
Samsung Bioepis Enters into Partnership Agreement with Sandoz for Up to Five Next-Generation Biosimilar Candidates18.3.2026 08:30:00 CET | Press release
The agreement covers up to five assets, including SB36, a biosimilar candidate referencing Entyvio (vedolizumab), for collaboration of development and commercialization in global markets excluding China, Hong Kong, Taiwan, Macau, and Republic of KoreaSamsung Bioepis continues to pave the way for access to life-changing medicines by advancing a biosimilar pipeline across immunology and oncology Samsung Bioepis Co., Ltd. announced today that the company has entered into a global license, development and commercialization agreement (DCA) with Sandoz for up to five biosimilar candidates under development by Samsung Bioepis, including SB36, a biosimilar candidate referencing Entyvio1 (vedolizumab). The other terms of the agreement remain confidential. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260318826412/en/ Samsung Bioepis office in Songdo, Incheon, Republic of Korea Under the terms of the agreement, Samsung Bioepis will b
Epassi Appoints Three Senior Leaders to Accelerate European Growth18.3.2026 08:00:00 CET | Press release
Epassi Group, a leading European multi-benefits technology platform, today announced the appointments of Phil Jones as Chief Revenue Officer (CRO), Ross Seychell as Chief People Officer (CPeO), and Cho Hwang as Chief Technology Officer (CTO), strengthening its leadership team as the company enters its next phase of expansion. Cho Hwang joined Epassi on December 1, 2025. He brings extensive global technology leadership experience from companies including HelloFresh, Coupang, and Nordstrom. At Epassi, Cho leads the company’s technology strategy and engineering organisation as the platform continues to scale across Europe. His experience will support Epassi’s ambition to further expand its multi-benefits ecosystem for employers, employees, and partners. Phil Jones joined Epassi on March 2. He brings extensive experience across HR technology and the full Human Capital Management lifecycle, having held senior leadership roles across Sales, Revenue Operations, and Customer Success at global
AiDEN Are Collaborating With Volvo Group Through the Innovation Hub CampX in a Proof-of-Value Project Solving Real Customer Needs18.3.2026 05:00:00 CET | Press release
In December 2024, a new regulatory requirement was introduced in Poland related to SENT (System for Electronic Transport Supervision) for tracking high-risk goods transported within the country. In regard to this, a project to validate one of AiDEN's services/products within the platform was initiated. This was done in a project with Volvo Trucks through CampX, Volvo Group’s global innovation arena for technology and business transformation. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260317838896/en/ AiDEN’s SENT GEO compliance service displayed within a Volvo truck’s in-vehicle infotainment system, enabling automated geolocation reporting for Poland’s System for Electronic Transport Supervision (SENT). Developed through a collaboration between AiDEN Automotive and Volvo Group’s CampX innovation hub, the integrated solution allows fleets to meet SENT requirements without external GPS hardware or aftermarket installations
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
