CO-SPATIAL-CORP
23.5.2024 18:01:32 CEST | Business Wire | Press release
Spatial Corp, the leading software development toolkit provider for design, manufacturing and engineering solutions and a subsidiary of Dassault Systèmes, announced today that it has added HOOPS Communicator, developed by Tech Soft 3D, to complement and extend its portfolio of component technologies. With the addition of HOOPS Communicator to Spatial’s 3D components portfolio, Spatial now enables web-based visualization of and interaction with 3D data for a diverse range of design, engineering and manufacturing workflows.
Adding HOOPS Communicator to Spatial’s product portfolio allows its customers to expand their applications to the web while reusing their IP from traditional desktop applications. As a result, Spatial’s customers can leverage many new opportunities on the web, including extended customer-reach, more access control, and less costly distributions, updates and maintenance.
“We are excited to enhance our portfolio by adding HOOPS Communicator. This addition enables Spatial customers to seamlessly implement powerful web applications for various engineering workflows, building on robust 3D modeling kernel and 3D InterOp components for data conversion, preparation and reuse,” said Jean-Marc Guillard, CEO, Spatial Corp.
One of Spatial’s newest customers is a vivid example of the tight integration of HOOPS Communicator with the 3D modelers CGM and ACIS as well as 3D InterOp. The customer plans to release a new web-based application for architectural, engineering and construction (AEC) workflows, which allows users to digitally create, review and finalize designs for homes, buildings and plants – all before costly construction begins – in collaboration with stakeholders across globally distributed sites.
Additional examples of web-based workflows enabled by HOOPS Communicator used in conjunction with Spatial’s 3D modelers CGM and ACIS and 3D InterOp include:
- Virtual twin applications for numerous manufacturing processes such as sheet metal fabrication, 3D printing and multi-axis milling, as well as a wide range of robotic systems
- Collaborative inspection applications for parts and assemblies with both geometry and product manufacturing information (PMI)
- On-demand catalogs for 3D parts and assemblies for diverse kinds of industrial applications
Like HOOPS Visualize for developing native applications, which Spatial has integrated with its SDKs and resold since 2012, HOOPS Communicator provides comprehensive out-of-the-box API functionality for a variety of engineering workflows on the web. Such functionality avoids having to recreate the same functionality in WebGL or with open-source frameworks. Furthermore, unlike OEM solutions, HOOPS Communicator allows custom interaction with 3D data.
Contact Spatial today to learn more about how HOOPS Communicator can unlock the power of the web for 3D workflows.
About Spatial
Spatial Corp, a Dassault Systèmes subsidiary, is a provider of 3D software development toolkits for technical applications across a broad range of industries. Spatial 3D modeling, 3D visualization, and CAD translation software development toolkits help application developers deliver market-leading products, maintain focus on core competencies, and reduce time-to-market. For over 35 years, Spatial’s 3D software development toolkits have been adopted by many of the world’s most recognized software developers, manufacturers, research institutes, and universities. Headquartered in Broomfield, Colorado, Spatial has offices in the USA, France, Germany, Japan, China, and the United Kingdom. For more information, visit www.spatial.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240528574696/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Lattice Delivers Industry-First PQC-Enabled Platform Firmware Resilience for AI Infrastructure with Lattice Sentry Solution Stack12.10.2026 22:00:00 CEST | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced the latest version of its Lattice Sentry™ solution stack (v5.0), the industry’s first post-quantum cryptography (PQC)-enabled Platform Firmware Resilience (PFR) and attestation solution. Extending Lattice's post-quantum cryptography leadership from silicon to a complete platform security stack, Lattice Sentry now delivers CNSA 2.0-aligned, NIST-compliant protection across AI data centers, and critical infrastructure, giving system designers a validated, production-ready path to quantum-resistant security. Lattice Sentry extends the company’s PQC leadership, combining the industry's first CNSA 2.0-compliant FPGA portfolio with AMI's platform management software to deliver a complete, integrated platform security solution. “AI infrastructure and the threat landscape are evolving rapidly. Platform firmware has become a primary attack vector, and the quantum era will upend decades
Cooler Master Expands End-to-End Cooling Solutions for AI Infrastructure12.10.2026 19:00:00 CEST | Press release
2,500 kW CDU anchors a portfolio spanning facility cooling, coolant distribution, rack-level thermal management and deployment equipment for high-density AI infrastructure Cooler Master, a global leader in digital infrastructure cooling solutions, has outlined its end-to-end cooling portfolio for AI infrastructure, designed to support high-density computing deployments in new data centers and existing facilities expanding AI capacity. Anchored by a 2,500 kW Liquid-to-Liquid In-Row Coolant Distribution Unit (CDU), the portfolio spans facility-level heat transfer, rack and server cooling, and the equipment used to prepare liquid cooling systems for operation. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012102572/en/ “Customers need choices that bring fast time-to-market, flexibility, and scalability for the deployment of their facilities,” said Thomas Chen, CEO at Cooler Master Corporation. “We aim to help them put liqui
GigaDevice Deepens Ecosystem Collaboration with LVGL to Advance GD32’s Global Open-Source GUI Ecosystem12.10.2026 15:00:00 CEST | Press release
GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, is deepening its ecosystem collaboration with LVGL. LVGL's Open graphics library is one of the world’s most widely‑adopted open‑source embedded frameworks. Eight GD32 MCU product families have now been officially included in the LVGL ecosystem, providing developers worldwide with more convenient and efficient support for embedded graphics development. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012320702/en/ Eight GD32 product series supported on LVGL website LVGL is an open-source graphical user interface framework designed for embedded devices, commercially supported by LVGL Ltd., a technology company based in Cambridge, UK. Lightweight, efficient, and cross-platform, it can be widely used in applications such as smart home devices, industrial control systems, consumer electronics, a
W. L. Gore & Associates Launches GORE® Battery Vents – MultiVent Series at the Battery Show12.10.2026 14:00:00 CEST | Press release
The integrated battery vent combines pressure equalization, moisture protection, and resealable thermal-runaway evacuation in a single part, with one opening in the pack wall. Today, W. L. Gore & Associates (Gore) introduced GORE® Battery Vents – MultiVent Series at The Battery Show North America 2026, a new integrated venting architecture that combines all three functions into a single device. Designed for lithium-ion battery packs in electric vehicles and energy storage systems, GORE® MultiVent is an integrated battery vent: one device that equalizes pressure, protects against moisture and evacuates gas during thermal runaway, then reseals. It gives pack designers an alternative to combining dual-stage vents, separate evacuation valves and desiccants. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012625188/en/ GORE® MultiVent GORE MultiVent builds on technology Gore acquired from Vernay Laboratories in 2026 and combine
Echodyne and ACS Sign Strategic Collaboration Agreement to Advance Counter-UAS Capabilities Worldwide12.10.2026 14:00:00 CEST | Press release
Successful integration of EchoShield® radar with ACS’s Bullfrog™ autonomousweapon station delivers precise tracking and affordable kinetic defeat across land and maritime missions. Echodyne, the radar platform company, and ACS, a precision robotics company for defense, today announced the signing of a Strategic Collaboration Agreement to accelerate the development, demonstration, and deployment of integrated counter-unmanned aircraft system (C-UAS) solutions. The agreement establishes collaboration across Echodyne’s high-performance commercial counter-UAS radar hardware and software roadmaps and ACS’s Bullfrog robotic weapon station capabilities, and follows the recent announcement of each company’s award from Joint Interagency Task Force 401 for Domestic Shield, the JIATF-401 C-UAS Marketplace, and other critical counter-drone requirements. Bullfrog combines computer vision, autonomous control, and precision robotics with existing weapon systems to detect, track, identify, and engage
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
