OR-LATTICE-SEMICONDUCTOR
22.5.2024 22:01:30 CEST | Business Wire | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a new 3D sensor fusion reference design to accelerate advanced autonomous application development. Combining a low power, low latency, deterministic Lattice Avant™-E FPGA with Lumotive’s Light Control Metasurface (LCM™) programmable optical beamforming technology, the reference design enables enhanced perception, robust reliability, and simplified autonomous decision making in complex environments including Industrial robotics, Automotive, and Smart City Infrastructure.
“How we perceive and develop Automotive, robotics, and factory automation is constantly evolving as the industry is shifting rapidly with autonomous technology,” said Matt Dobrodziej, Corporate Vice President of Segment Marketing and Business Development at Lattice Semiconductor. “Lattice’s low power, low latency FPGA solutions are ideal for this transformation by addressing computational challenges at the edge. And, when paired with advanced 3D sensing technologies, Lattice’s sensor fusion solutions enable even more ways for our customers to design cutting-edge applications that redefine mobility and safety.”
Key features of the new sensor fusion reference design include:
- Class-leading perception utilizing low power edge AI inferencing based on Lattice FPGA solutions enabling sensor fusion processing and synchronization for all sensors, combining LiDAR, radar, and camera sensors.
- Advanced solid-state LiDAR with beam steering powered by Lumotive’s LCM technology, delivering superior 3D sensing.
“Lumotive’s LCM beam steering chips with AI-driven scanning capabilities transform solid-state LiDAR to reach new levels of performance and flexibility in a compact, modular, and scalable 3D sensing solution,” added Dr. Kevin Camera, Vice President of Product at Lumotive. “Lattice FPGAs, capable of performing complex sensor fusion efficiently with absolute minimum latency, amplify these strengths to deliver autonomous applications which can intelligently adapt to any use case and situation.”
See Live Demonstrations at Embedded Vision Summit 2024
The new 3D sensor fusion reference design will be demonstrated at Embedded Vision Summit 2024 from May 22-23, 2024, in Santa Clara, California. Visit Lattice’s exhibit at Booth #418 to experience the innovative low power FPGA solutions enabling Industrial, Automotive, and Security applications at the Edge.
About Lattice Semiconductor
Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing Communications, Computing, Industrial, Automotive, and Consumer markets. Our technology, long-standing relationships, and commitment to world-class support let our customers quickly and easily unleash their innovation to create a smart, secure, and connected world.
For more information about Lattice, please visit www.latticesemi.com. You can also follow us via LinkedIn, Twitter, Facebook, YouTube, WeChat, or Weibo.
Lattice Semiconductor Corporation, Lattice Semiconductor (& design), and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries. The use of the word “partner” does not imply a legal partnership between Lattice and any other entity.
GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240522412985/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
BOCHK and Ant International Forge Strategic Partnership to Enhance Cross-border Payment Connectivity and Innovative Corporate Financial Service Solutions Through Fintech20.8.2026 09:00:00 CEST | Press release
Ant International and Bank of China (Hong Kong) (“BOCHK”) announced that the two parties have forged a strategic partnership. Leveraging BOCHK’s banking strengths and Ant International’s leading fintech and AI technologies, the two parties seek to explore the frontier of AI-driven innovative financial services, empower real-time treasury management and cross-border payments, deliver efficient and intelligent liquidity management and financial service solutions for global enterprises, while continuously enhancing financial services for small and medium-sized enterprises (“SMEs”). This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260820387312/en/ From left to right: Kelvin Li, General Manager of Platform Tech and Senior Vice President of Ant International, Eric Jing, Chairman of Ant International, Sun Yu, Vice Chairman and Chief Executive of BOCHK, and Wang Huabin, Deputy Chief Executive of BOCHK Sun Yu, Vice Chairman and Chief E
BOCHK and Ant International Forge Strategic Partnership to Enhance Cross-border Payment Connectivity and Innovative Corporate Financial Service Solutions Through Fintech20.8.2026 08:00:00 CEST | Press release
Ant International and Bank of China (Hong Kong) (“BOCHK”) announced that the two parties have forged a strategic partnership. Leveraging BOCHK’s banking strengths and Ant International’s leading fintech and AI technologies, the two parties seek to explore the frontier of AI-driven innovative financial services, empower real-time treasury management and cross-border payments, deliver efficient and intelligent liquidity management and financial service solutions for global enterprises, while continuously enhancing financial services for small and medium-sized enterprises (“SMEs”). This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819555366/en/ From left to right: Kelvin Li, General Manager of Platform Tech and Senior Vice President of Ant International, Eric Jing, Chairman of Ant International, Sun Yu, Vice Chairman and Chief Executive of BOCHK, and Wang Huabin, Deputy Chief Executive of BOCHK Sun Yu, Vice Chairman and Chief E
Ant International’s FalconTST Model 2.0 Achieves SOTA, Elevating Predictive AI Application in Finance to New Levels20.8.2026 03:55:00 CEST | Press release
FalconTST 2.0 has achieved state-of-the-art performance on MASE metricon top global benchmark.Banks use FalconTST 2.0 to better forecast liquidity exposure with Barclays, Citi, Deutsche Bank and Standard Chartered having integrated FalconTST 2.0 for cashflow forecasting and FX management.FalconTST 2.0 has achieved >93% forecast accuracy rate consistently and is ready for broader industry application, including logistics, aviation, e-commerce, besides financial sector. Ant International has introduced Falcon Time-Series Transformer (TST) AI Model 2.0, its most advanced TST model so far designed to deliver more accurate forecasting in real-world FX risk management of cross-border payments, with more industry applications to come, such as demand forecasting for supply chain management for e-commerce platforms, and predictive operations management for aviation industry. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819055561
Grid Dynamics Earns MACH Alliance's 2026 Agent Ready Award for Production-Scale Agentic AI19.8.2026 22:05:00 CEST | Press release
Key Takeaways: Grid Dynamics is named to MACH Alliance's inaugural 2026 Agent Ready cohort. Grid Dynamics won the award for its agentic AI capabilities and for programs delivered at a global food and beverage company and a global payments company. Grid Dynamics delivered the qualifying work through its Grid Dynamics AI Native (GAIN) platforms and Forward Deployed Engineer delivery model. Grid Dynamics Holdings, Inc. (Nasdaq: GDYN) (“Grid Dynamics”), a premier AI transformation partner for the Fortune 1000, today announced it has earned MACH Alliance's 2026 Agent Ready Award, becoming one of 35 companies named in the program's inaugural cohort. Agent Ready is an advanced certification that builds upon MACH Certification, the MACH Alliance's baseline standard for open, composable, and connected technology. The honor recognizes certified members that have moved agentic AI from pilots and demos into production, at scale, with the guardrails enterprise deployment requires. Every award is in
Xsolla Announces Multi-Year Strategic Partnership With the Good Game Club Podcast to Amplify Positive Stories From the Global Games Industry19.8.2026 18:10:00 CEST | Press release
Collaboration Brings Co-Created Episodes, Live Recordings At gamescom And GDC, And Stories From Studios, With Episodes Recorded Across the Globe Xsolla, a global video game commerce company, today announced a multi-year strategic partnership with Good Game Club, the independent, global podcast dedicated to sharing positive stories from the gaming ecosystem. The partnership builds on a broader effort to support the developers, publishers, and creators shaping the future of the games industry in a positive way by supporting good stories from the human side of video game businesses. The partnership spans the global events calendar, with joint podcast recordings planned each year at gamescom in Cologne and the Game Developers Conference (GDC) in San Francisco. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819127662/en/ Graphic: Xsolla Xsolla and Good Game Club will collaborate on recurring editorial segments and deep-dive ep
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
