Business Wire

SAMSUNG-ELECTRONICS

14.5.2024 10:01:29 CEST | Business Wire | Press release

Share
SiPearl: Partnership with Samsung Electronics for built-in HBM in Rhea

SiPearl, the company building the high-performance low-power European microprocessor for HPC and AI inference, has signed a partnership with Samsung Electronics Co. Ltd., a world leader in advanced memory technology, to equip its Rhea series with Samsung’s advanced memory solution ideal for HPC and AI applications.

After an extensive market survey, SiPearl has selected the global leading technology company Samsung, and its High-Bandwidth Memory (HBM) for its outstanding speed and energy-efficiency combined with a reduced thermal resistance.

This collaboration will enable SiPearl to leverage Rhea family best-in-class performance and energy-efficiency for HPC and AI inference workloads.

We are excited to contribute to the expansion of SiPearl’s unique supercomputer/AI ecosystem with Samsung’s advanced HBM technology,” said Yongcheol Bae, Executive Vice President and Head of Memory Product Planning at Samsung Electronics. “As the HPC and AI market grows and diverse requirements increase, high-performance, high-bandwidth, low-power solutions are key to support development of the Rhea series in the future. We are committed to delivering memory solutions that can bring superior performance and efficiency for future HPC and AI applications in a close collaboration with SiPearl.”

At SiPearl, we are thrilled to be a European pioneer in the use of HBM technology in conjunction with Samsung Electronics. Combining our high-performance, low-power microprocessor technologies with built-in HBM is key to meet all the requirements of supercomputing and AI inference workloads. On the fast-growing AI inference market, we think that our product will be a market leading solution for inference Large Language Model (LLM) tasks providing among other things high flexibility to model changes relative to solutions currently in use ”, concluded Philippe Notton, CEO and founder of SiPearl.

About… SiPearl

SiPearl is building the European high-performance low-power microprocessor dedicated to supercomputing and AI inference. This new generation of microprocessors will first target EuroHPC Joint Undertaking ecosystem, which is deploying world-class supercomputing infrastructures in Europe for solving major challenges in medical research, security, energy management and climate with a reduced environmental footprint.

SiPearl is working in close collaboration with its 30 partners from the European Processor Initiative (EPI) consortium - leading names from the scientific community, supercomputing centres and industry - which are its stakeholders, future clients and end-users.

SiPearl employs more than 190 people in France (Maisons-Laffitte, Grenoble, Massy, Sophia Antipolis), Germany (Duisburg), Italy (Bologna) and Spain (Barcelona).

About Samsung Electronics Co., Ltd.

Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry, and LED solutions.

For the latest news, please visit the Samsung Newsroom at news.samsung.com.

(1) HPC : High Performance Computing

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240514089129/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

BOCHK and Ant International Forge Strategic Partnership to Enhance Cross-border Payment Connectivity and Innovative Corporate Financial Service Solutions Through Fintech20.8.2026 08:00:00 CEST | Press release

Ant International and Bank of China (Hong Kong) (“BOCHK”) announced that the two parties have forged a strategic partnership. Leveraging BOCHK’s banking strengths and Ant International’s leading fintech and AI technologies, the two parties seek to explore the frontier of AI-driven innovative financial services, empower real-time treasury management and cross-border payments, deliver efficient and intelligent liquidity management and financial service solutions for global enterprises, while continuously enhancing financial services for small and medium-sized enterprises (“SMEs”). This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819555366/en/ From left to right: Kelvin Li, General Manager of Platform Tech and Senior Vice President of Ant International, Eric Jing, Chairman of Ant International, Sun Yu, Vice Chairman and Chief Executive of BOCHK, and Wang Huabin, Deputy Chief Executive of BOCHK Sun Yu, Vice Chairman and Chief E

Ant International’s FalconTST Model 2.0 Achieves SOTA, Elevating Predictive AI Application in Finance to New Levels20.8.2026 03:55:00 CEST | Press release

FalconTST 2.0 has achieved state-of-the-art performance on MASE metricon top global benchmark.Banks use FalconTST 2.0 to better forecast liquidity exposure with Barclays, Citi, Deutsche Bank and Standard Chartered having integrated FalconTST 2.0 for cashflow forecasting and FX management.FalconTST 2.0 has achieved >93% forecast accuracy rate consistently and is ready for broader industry application, including logistics, aviation, e-commerce, besides financial sector. Ant International has introduced Falcon Time-Series Transformer (TST) AI Model 2.0, its most advanced TST model so far designed to deliver more accurate forecasting in real-world FX risk management of cross-border payments, with more industry applications to come, such as demand forecasting for supply chain management for e-commerce platforms, and predictive operations management for aviation industry. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819055561

Grid Dynamics Earns MACH Alliance's 2026 Agent Ready Award for Production-Scale Agentic AI19.8.2026 22:05:00 CEST | Press release

Key Takeaways: Grid Dynamics is named to MACH Alliance's inaugural 2026 Agent Ready cohort. Grid Dynamics won the award for its agentic AI capabilities and for programs delivered at a global food and beverage company and a global payments company. Grid Dynamics delivered the qualifying work through its Grid Dynamics AI Native (GAIN) platforms and Forward Deployed Engineer delivery model. Grid Dynamics Holdings, Inc. (Nasdaq: GDYN) (“Grid Dynamics”), a premier AI transformation partner for the Fortune 1000, today announced it has earned MACH Alliance's 2026 Agent Ready Award, becoming one of 35 companies named in the program's inaugural cohort. Agent Ready is an advanced certification that builds upon MACH Certification, the MACH Alliance's baseline standard for open, composable, and connected technology. The honor recognizes certified members that have moved agentic AI from pilots and demos into production, at scale, with the guardrails enterprise deployment requires. Every award is in

Xsolla Announces Multi-Year Strategic Partnership With the Good Game Club Podcast to Amplify Positive Stories From the Global Games Industry19.8.2026 18:10:00 CEST | Press release

Collaboration Brings Co-Created Episodes, Live Recordings At gamescom And GDC, And Stories From Studios, With Episodes Recorded Across the Globe Xsolla, a global video game commerce company, today announced a multi-year strategic partnership with Good Game Club, the independent, global podcast dedicated to sharing positive stories from the gaming ecosystem. The partnership builds on a broader effort to support the developers, publishers, and creators shaping the future of the games industry in a positive way by supporting good stories from the human side of video game businesses. The partnership spans the global events calendar, with joint podcast recordings planned each year at gamescom in Cologne and the Game Developers Conference (GDC) in San Francisco. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819127662/en/ Graphic: Xsolla Xsolla and Good Game Club will collaborate on recurring editorial segments and deep-dive ep

KAGA FEI Expands Its Software-Embedded Bluetooth Low Energy Module Lineup with ES4L15MA1 and EC4L15MA119.8.2026 16:00:00 CEST | Press release

KAGA FEI Co., Ltd., a global provider of advanced short-range wireless modules, announced today the development of the ES4L15MA1 and EC4L15MA1 Bluetooth Low Energy modules with embedded software for wireless communication. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260802953307/en/ ES4L15MA1 (left) and EC4L15MA1 (right) sample modules These products are versions of KAGA FEI’s ES4L15BA1 and EC4L15BA1 wireless modules with embedded software, which use Nordic Semiconductor’s nRF54L15. Because the modules include the functions required for Bluetooth Low Energy communication, device manufacturers can develop products in a shorter period without having to develop wireless communication software from scratch. The modules help reduce software development workloads, shorten product development cycles, and lower development costs for a wide range of IoT devices. The need for wireless connectivity in IoT applications is growing acr

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye