1GLOBAL
7.5.2024 11:01:34 CEST | Business Wire | Press release
Germany's largest independent mobile service provider, freenet, has partnered with the global telecommunications network 1GLOBAL to power their new offering, freenet Travel.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240506185419/en/
1GLOBAL provides roaming services to 7.5 million freenet customers. (Graphic: Business Wire)
This new product creates immediate added value for freenet customers who plan on visiting other countries. Whether travelling for business or leisure, calculating roaming costs and data usage abroad can often be complex. 1GLOBAL eSIMs offer millions of freenet customers a crucial advantage, enabling seamless mobile internet usage in countries outside the EU while avoiding high roaming charges.
"We are among the few providers worldwide capable of supplying and configuring eSIMs ourselves. Through this partnership, millions of freenet customers can now book various data packages for countries outside the EU, allowing them to communicate cost-effectively during their travels."
- Hakan Koç, founder and CEO of 1GLOBAL
1GLOBAL eSIMs: worry-free travel and minimal roaming charges for freenet users
All freenet customers with eSIM-compatible devices now have access to the service. To install the eSIM on their phone, they simply scan a QR code and follow the onscreen prompts. Once downloaded, a 1GLOBAL eSIM can be used as many times as needed in any of the countries supported by the secure high-speed network.
Users can choose from a variety of tariffs and instantly book a data plan for their desired destination, even if they have no internet connection. They will also benefit from 1GLOBAL’s high-speed 4G/5G network. 1GLOBAL has developed a complete eSIM ecosystem including Remote SIM Provisioning (RSP) and Entitlement Servers, ensuring the highest quality throughout the eSIM deployment lifecycle. Their fully integrable API can be customised and adapted to deliver an outstanding client experience across a wide range of telco products.
"By using 1GLOBAL eSIM capabilities, we are embracing a future-proof, modern technology. This enables us to further expand our positioning around digital lifestyle offerings."
- Salome Andrade Pohl, Head of Digital Lifestyle at freenet
About 1GLOBAL
1GLOBAL provides quick and secure mobile network connectivity in over 160 countries worldwide. 1GLOBAL eSIM technology seamlessly integrates into third-party apps and products, and can be installed on any eSIM-compatible mobile device in less than a minute.
Founded in 2022, 1GLOBAL is the new startup of Hakan Koç, co-founder and former co-CEO of AUTO1 Group. 1GLOBAL acquired a group of telco assets operational since 2006, including an internationally recognised, GSMA-accredited global mobile network. Headquartered in London, with an R&D hub in Lisbon, they have now grown to include over 400 employees across 12 countries and have been granted fully regulated MVNO (mobile virtual network operators) status in nine of them.
About freenet
Freenet offers a comprehensive portfolio of mobile communications, internet, and TV entertainment services. Customers can find the ideal products for their digital life in approximately 500 freenet stores and online at www.freenet-mobilfunk.de.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240506185419/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom