CO-SPATIAL-CORP
Spatial Corp, the leading software development toolkit provider for design, manufacturing, and engineering solutions and Dassault Systèmes subsidiary, announces the production release of 2024 1.0.1.
Data Prep Is Officially Released
Open New Horizons in Data Import
After launching the alpha version, Data Prep, Spatial’s newest add-on product for 3D InterOp, is officially released to all customers. Supported strategies include filtering small bodies from a model, removing small holes and fillets, and generating an assembly structure from a part with duplicate bodies.
Over the past three months, customer interest confirms the market need for tools to simplify and optimize data during import. Spatial plans to invest further in Data Prep strategies. Functionality releasing soon includes:
- Capabilities to reduce data to manage while preserving relevant features - to shorten model preparation times for multi-physics and process simulation workflows.
- Ability to convert polyline data to continuous curves during file restore - to decrease memory consumption and allow for successful import.
- Option to avoid model shrinkage due to Data Prep strategies like feature removal - to ensure accuracy of collision detection analyses.
Users interested in defining future strategies for Data Prep should contact their account manager.
3D InterOp Extends Support for BIM and Manufacturing
New Support for Navisworks and Writing DXF/DWG Drawing Sheets
The latest release allows BIM customers to read Navisworks files and write drawing sheets in a DXF/DWG format. Additionally, 3D InterOp offers expanded support for the Linux platform in Parasolid-based 3D InterOp.
Point and Table Patterns from Creo Files
Manufacturing relies on hole pattern metadata for automated machining processes such as drilling, milling, cutting, or punching. The latest release of 3D InterOp supports Point and Table type hole patterns in Creo Reader.
Enabling Support of More Formats through External Partners
Extensible 3D InterOp enables partners to create readers and writers for unsupported file formats. These external implementations integrate with existing formats to seamlessly exchange BREP and Visualization data. Customers wishing to develop custom readers and writers can reach out to their account manager for assistance.
Package Size Optimization
For customers not needing support for all bundled formats, ACIS-based 3D InterOp offers guidance on configuring a minimal library set for popular CAD and exchange formats. This minimizes the libraries shipped with their application, saving end-user disk space. For example, supporting only IGES + STEP formats reduces installed library size by 70%.
3D ACIS Modeler Improves Polyhedral Modeling
Polyhedral Sheet Thickening
Additive manufacturing or EDA workflows often start with input that is a 2D representation of a thin part to be processed. When printing or simulating the part, generating a realistic 3D model representing the object with its actual thickness is helpful. This release delivers an API to generate a thickened body from polyhedral sheets.
New Polyhedral Boolean Operations
ACIS now provides functionality to compute the intersection graph between two polyhedral bodies. It also allows combining disjointed polyhedral bodies into a single body, increasing the efficiency of downstream operations.
CGM Provides More Manufacturing Automation and Simulation Tools
Enhancements to Feature Recognition and Removal
Users can now specify an industry context to customize the behavior of feature recognition. Setting the industry context tailors feature recognition to provide intuitive results for applications as diverse as Body-in-White, Micro-Mechanics, and Civil Engineering. This release also offers functionality to remove chamfers.
Improved Polyhedral Modeling for Additive Manufacturing
This release provides various robustness and performance enhancements targeting polyhedral healing and offset. For both types of operations, options are now available to tune the performance for specific configurations.
New Medial Axis Extraction Operator
Simulation engineers need tools to simplify the geometry of parts to reduce analysis computation time. This release features the beta version of the Neutral Fiber Operator, which reduces radially symmetric 3D bodies to a one-dimensional line.
CSM/CVM: Improvements to Cartesian Core Workflows
CVM generates Cartesian elements for interior meshing, resulting in accurate triangular surface meshes and predominantly hexahedral volume meshes. Users can now control the size of these elements, which were previously determined automatically based on surface mesh element size.
About Spatial Corp.
Spatial Corp, a Dassault Systèmes subsidiary, is the leading provider of 3D software development toolkits for technical applications across a broad range of industries. Spatial 3D modeling, 3D visualization, and CAD translation software development toolkits help application developers deliver market-leading products, maintain focus on core competencies, and reduce time-to-market. For over 35 years, Spatial’s 3D software development toolkits have been adopted by many of the world’s most recognized software developers, manufacturers, research institutes, and universities. Headquartered in Broomfield, Colorado, Spatial has offices in the USA, Germany, Japan, China, and the United Kingdom. For more information, visit www.spatial.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240430297301/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Deciphera Announces Oral Presentation of Positive Topline Results from Phase 2a Study of Sapablursen in Polycythemia Vera at the 67th American Society of Hematology (ASH) Annual Meeting6.12.2025 15:30:00 CET | Press release
Results from Phase 2a IMPRSSION study demonstrate sapablursen significantly reduced phlebotomy rate, controlled hematocrit and increased serum hepcidin Sapablursen was generally safe and well tolerated Results support further development of sapablursen in a Phase 3 study Deciphera Pharmaceuticals, a member of Ono Pharmaceutical Co., Ltd. (Headquarters: Osaka, Japan; President and COO: Toichi Takino; “Ono”), today announced the oral presentation of positive results from the Phase 2a IMPRSSION study of sapablursen in patients with polycythemia vera (PV) at the 67th American Society of Hematology (ASH) Annual Meeting, taking place December 6-9, 2025, in Orlando, FL. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251206361611/en/ The results were presented by Ionis Pharmaceuticals, who discovered and developed sapablursen and conducted the IMPRSSION study. In March 2025, Ionis and Ono entered into a license agreement in which On
Protagonist and Takeda Present Longer-Term Data at ASH 2025 Showing Rusfertide Delivers Durable Response and Hematocrit Control in Polycythemia Vera6.12.2025 15:30:00 CET | Press release
52-Week Results from the Phase 3 VERIFY Study of Rusfertide Demonstrated Sustained Hematocrit Control and Response, Defined by Absence of Phlebotomy Eligibility, with No New Safety SignalsThese Data Build on Positive 32-Week Primary Analysis from VERIFY, Which Met its Primary Efficacy Endpoint and All Four Key Secondary EndpointsPatients Crossing Over from Placebo to Rusfertide at 32 Weeks Achieved a Similar Response Rate to Those Initially Randomized to Rusfertide, with 77.9% Achieving Absence of Phlebotomy Eligibility Between Weeks 40-52Four-Year Results from the Combined REVIVE and Long-Term Extension THRIVE Study Demonstrated a 13-Fold Reduction in Annual Rate of Phlebotomies from Baseline Protagonist Therapeutics, Inc. (“Protagonist”) (NASDAQ:PTGX) and Takeda (TSE:4502/NYSE:TAK) announce that new 52-week results from the pivotal Phase 3 VERIFY study evaluating rusfertide in patients with polycythemia vera (PV) will be presented in an oral presentation at the 67th American Society
Vertex Presents New Data on CASGEVY®, Including First-Ever Data in Children Ages 5-11 Years, at the American Society of Hematology Annual Meeting and Announces Plan for Global Regulatory Submissions6.12.2025 13:01:00 CET | Press release
- Data from pivotal studies of CASGEVY in children ages 5-11 years with severe sickle cell disease or transfusion-dependent beta thalassemia demonstrates the transformative potential of the therapy in younger patients -- Efficacy and safety data in children 5-11 years are consistent with the durable and positive benefit/risk profile established from clinical studies in patients 12 years of age and older -- Vertex expects to initiate global regulatory submissions for CASGEVY in children 5-11 years in 1H 2026 - Vertex Pharmaceuticals Incorporated (Nasdaq: VRTX) today announced data from multiple studies demonstrating the clinical benefits of CASGEVY® (exagamglogene autotemcel) in people ages 5 years and older living with severe sickle cell disease (SCD) or transfusion-dependent beta thalassemia (TDT). The results, including the first presentation of clinical data from pivotal studies in children ages 5-11 years, and longer-term data from the pivotal studies of people with severe SCD and
Leading Global Scientists Gather at Tengchong Scientists Forum to Explore Innovative Pathways in Frontier Technologies6.12.2025 12:31:00 CET | Press release
The 2025 Tengchong Scientists Forum opened on Saturday in southwest China’s Yunnan Province, convening leading scientists and academic figures to examine innovation across frontier fields including artificial intelligence, biodiversity and quantum technology. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251205499197/en/ Opening ceremony of Tengchong Scientists Forum on 6th December, 2025 Notable participants include Nobel Physics laureate Konstantin Novoselov, Fields Medalist Efim Zelmanov and Turing Award winner Andrew Chi-Chih Yao, who join 127 academicians, 77 university presidents from China and abroad, over 400 scholars and more than 600 entrepreneurs and financiers. The gathering aims to deepen collaboration between cutting-edge research and industrial development. Under the theme “Science · AI changing the World,” the forum features ten sub-forums, academic sessions and thematic events supporting major cooperation p
Lattice Wins 2025 Global Semiconductor Alliance Award6.12.2025 00:49:00 CET | Press release
‒ Named Most Respected Public Semiconductor Company Achieving $100 Million to $500 Million in Annual Sales ‒ Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced that it was selected as ‘Most Respected Public Semiconductor Company’ at the 2025 Global Semiconductor Alliance (GSA) Awards. The GSA awards recognize companies that have demonstrated excellence through their success, vision, strategy, and future opportunities in the industry as determined by votes from GSA members. “We are honored to be recognized by the Global Semiconductor Alliance and our peers as one of 2025’s most respected public semiconductor companies. This recognition reflects the dedication of the Lattice team and the trust of our customers, partners, suppliers, and investors. Looking ahead, we remain laser-focused on driving innovation and strengthening our role as the trusted low power programmable leader for semiconductor and system solutions,” said Ford Tamer, Chief Executive
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom