CA-TSMC
24.4.2024 21:31:27 CEST | Business Wire | Press release
TSMC (TWSE: 2330, NYSE: TSM) today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium. TSMC debuted the TSMC A16TM technology, featuring leading nanosheet transistors with innovative backside power rail solution for production in 2026, bringing greatly improved logic density and performance. TSMC also introduced its System-on-Wafer (TSMC-SoW™) technology, an innovative solution to bring revolutionary performance to the wafer level in addressing the future AI requirements for hyperscaler datacenters.
This year marks the 30th anniversary of TSMC’s North America Technology Symposium, and more than 2,000 attended the event, growing from less than 100 attendees 30 years ago. The North America Technology Symposium in Santa Clara, California kicks off TSMC Technology Symposiums around the world in the coming months. The symposium also features an “Innovation Zone,” designed to highlight the technology achievements of our emerging start-up customers.
“We are entering an AI-empowered world, where artificial intelligence not only runs in data centers, but PCs, mobile devices, automobiles, and even the Internet of Things,” said TSMC CEO Dr. C.C. Wei. “At TSMC, we are offering our customers the most comprehensive set of technologies to realize their visions for AI, from the world’s most advanced silicon, to the broadest portfolio of advanced packaging and 3D IC platforms, to specialty technologies that integrate the digital world with the real world.”
New technologies introduced at the symposium include:
TSMC A16TM Technology: With TSMC’s industry-leading N3E technology now in production, and N2 on track for production in the second half of 2025, TSMC debuted A16, the next technology on its roadmap. A16 will combine TSMC’s Super Power Rail architecture with its nanosheet transistors for planned production in 2026. It improves logic density and performance by dedicating front-side routing resources to signals, making A16 ideal for HPC products with complex signal routes and dense power delivery networks. Compared to TSMC’s N2P process, A16 will provide 8-10% speed improvement at the same Vdd (positive power supply voltage), 15-20% power reduction at the same speed, and up to 1.10X chip density improvement for data center products.
TSMC NanoFlexTM Innovation for Nanosheet Transistors: TSMC’s upcoming N2 technology will come with TSMC NanoFlex, the company’s next breakthrough in design-technology co-optimization. TSMC NanoFlex provides designers with flexibility in N2 standard cells, the basic building blocks of chip design, with short cells emphasizing small area and greater power efficiency, and tall cells maximizing performance. Customers are able to optimize the combination of short and tall cells within the same design block, tuning their designs to reach the optimal power, performance, and area tradeoffs for their application.
N4C Technology: Bringing TSMC’s advanced technology to a broader range of of applications, TSMC announced N4C, an extension of N4P technology with up to 8.5% die cost reduction and low adoption effort, scheduled for volume production in 2025. N4C offers area-efficient foundation IP and design rules that are fully compatible with the widely-adopted N4P, with better yield from die size reduction, providing a cost-effective option for value-tier products to migrate to the next advanced technology node from TSMC.
CoWoS®, SoIC, and System-on-Wafer (TSMC-SoW™ ): TSMC’s Chip on Wafer on Substrate (CoWoS®) has been a key enabler for the AI revolution by allowing customers to pack more processor cores and high-bandwidth memory (HBM) stacks side by side on one interposer. At the same time, our System on Integrated Chips (SoIC) has established itself as the leading solution for 3D chip stacking, and customers are increasingly pairing CoWoS with SoIC and other components for the ultimate system-in-package (SiP) integration.
With System-on-Wafer, TSMC is providing a revolutionary new option to enable a large array of dies on a 300mm wafer, offering more compute power while occupying far less data center space and boosting performance per watt by orders of magnitude. TSMC’s first SoW offering, a logic-only wafer based on Integrated Fan-Out (InFO) technology, is already in production. A chip-on-wafer version leveraging CoWoS technology is scheduled to be ready in 2027, enabling integration of SoIC, HBM and other components to create a powerful wafer-level system with computing power comparable to a data center server rack, or even an entire server.
Silicon Photonics Integration: TSMC is developing Compact Universal Photonic Engine (COUPE™ ) technology to support the explosive growth in data transmission that comes with the AI boom. COUPE uses SoIC-X chip stacking technology to stack an electrical die on top of a photonic die, offering the lowest impedance at the die-to-die interface and higher energy efficiency than conventional stacking methods. TSMC plans to qualify COUPE for small form factor pluggables in 2025, followed by integration into CoWoS packaging as co-packaged optics (CPO) in 2026, bringing optical connections directly into the package.
Automotive Advanced Packaging: After introducing the N3AE “Auto Early” process in 2023, TSMC continues to serve our automotive customers’ needs for greater computing power that meets the safety and quality demands of the highway by integrating advanced silicon with advanced packaging. TSMC is developing InFO-oS and CoWoS-R solutions for applications such as advanced driver assistance systems (ADAS), vehicle control, and vehicle central computers, targeting AEC-Q100 Grade 2 qualification by fourth quarter of 2025.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,895 products for 528 customers in 2023 by providing broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240424036229/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Andersen Consulting tilføjer samarbejdspartneren Milestone Technologies19.3.2026 19:02:00 CET | Pressemeddelelse
Andersen Consulting fortsætter med at styrke sin platform for digital transformation med tilføjelsen af samarbejdspartneren Milestone Technologies, der er en veletableret global leverandør af it-services og digitale løsninger med base i USA. Milestone Technologies blev grundlagt i 1997 og leverer omfattende teknologi- og outsourcingløsninger, der spænder over digitale arbejdspladstjenester, cloud- og infrastrukturstyring, data, AI og automatisering, apps og digital engineering, business process outsourcing samt implementering af platforme som ServiceNow og Salesforce. Med hovedkontor i Fremont, Californien, opererer Milestone i 35 lande på globalt plan og samarbejder med nogle af verdens største virksomheder. Virksomhedens integrerede leveringsmodel gør det muligt for kunder at transformere deres it-drift, øge serviceeffektiviteten og skalere teknologiske økosystemer gnidningsfrit over hele verden. "Milestone Technologies er en medarbejderfokuseret organisation, der leverer målbare for
Klarna Card reaches 5 million active customers19.3.2026 15:31:00 CET | Press release
Klarna, the global digital bank and payments provider, today announced that the Klarna Card has reached 5 million active customers globally, underscoring rapid adoption as consumers shift towards new forms of payment which provide more control over day-to-day money management. The card draws from the customer's own funds for everyday spending, with the option to spread the cost of a specific purchase, like a large appliance or a flight, when it makes sense to do so. The result is a card that offers genuine spending control without the long-term debt obligations that come with traditional credit cards. The card’s growth is reinforced by Klarna’s membership program. The program offers premium perks such as airport lounge access, travel insurance, and lifestyle subscriptions — without requiring users to take on debt, meet spending thresholds, or revolve balances. By separating everyday spending from rewards, Klarna is challenging the strings-attached model legacy banks have long relied on
Stonebranch Releases 2026 Global State of IT Automation Report, Revealing Orchestration as the Missing Link for AI Adoption and Trust19.3.2026 14:30:00 CET | Press release
New research shows hybrid IT orchestration, automation-as-a-service, and WLA investments are accelerating as AI workflow deployment scales across the enterprise. Stonebranch, a leading provider of service orchestration and automation solutions, today released its annual 2026 Global State of IT Automation Report, the company’s most comprehensive research study to date. Based on responses from 402 IT automation professionals spanning C-suite executives to individual contributors across North America, EMEA, Latin America, and APAC, the report provides a detailed, data-driven portrait of how enterprises are investing in, deploying, and deriving value from IT automation in 2026. “This year’s findings highlight an important shift in how organizations approach automation,” said Giuseppe Damiani, CEO of Stonebranch. “Organizations are now building automation as strategic infrastructure — a governed, scalable foundation that spans hybrid environments, operationalizes AI, and delivers automation
Perma-Pipe Accelerates Growth with New U.S. Northeast Facility Investment to serve Artificial Intelligence Data Center customers, Provides Middle East Operations’ Update and Concludes the Board’s Review of Strategic Alternatives19.3.2026 14:00:00 CET | Press release
Perma-Pipe International Holdings, Inc. (the “Company”) today announced a strategic expansion initiative focused on accelerating growth through entry into the high-demand U.S. Northeast region. The Company is positioning itself to capitalize on the rapidly expanding Artificial Intelligence (“AI”)-driven data center market in both the United States and international markets while continuing to reinforce its leadership in critical infrastructure solutions. As part of this growth strategy, Perma-Pipe will prioritize investments aimed at expanding its presence in the rapidly evolving AI data center sector. The initiative reflects the Company’s long-term commitment to supporting next-generation technology infrastructure and strengthening its position in the global energy, industrial, and infrastructure markets. Expansion in the U.S. Northeast President & Chief Executive Officer, Saleh Sagr said, “We are excited to announce the expansion of our operations with a new facility in the Northeast
Armis Launches First-of-Its-Kind Benchmark Report Warning of Critical Security Gaps in AI-Native Development19.3.2026 13:00:00 CET | Press release
Research reveals 100% of leading generative AI models fail to generate secure code for critical development scenarios Armis, the cyber exposure management & security company, is warning that the rapid enterprise adoption of AI-native development is outpacing critical security safeguards, leaving organizations exposed to systemic vulnerabilities. New research from Armis Labs’ Trusted Vibing Benchmark Report, which evaluates 18 leading generative AI models across 31 test scenarios, reveals a 100% failure rate in generating secure code. These vulnerabilities are most prevalent in high-risk areas like memory buffer overflows, design file uploads and authentication systems. Therefore, organizations should immediately implement AI-native application security controls to reduce risk. “The era of vibe coding is here, but speed should not come at the cost of security,” said Nadir Izrael, CTO and Co-Founder of Armis. “Our research finds that the worst offenders are the same ones selling security
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom