CA-TSMC
24.4.2024 21:31:27 CEST | Business Wire | Press release
TSMC (TWSE: 2330, NYSE: TSM) today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium. TSMC debuted the TSMC A16TM technology, featuring leading nanosheet transistors with innovative backside power rail solution for production in 2026, bringing greatly improved logic density and performance. TSMC also introduced its System-on-Wafer (TSMC-SoW™) technology, an innovative solution to bring revolutionary performance to the wafer level in addressing the future AI requirements for hyperscaler datacenters.
This year marks the 30th anniversary of TSMC’s North America Technology Symposium, and more than 2,000 attended the event, growing from less than 100 attendees 30 years ago. The North America Technology Symposium in Santa Clara, California kicks off TSMC Technology Symposiums around the world in the coming months. The symposium also features an “Innovation Zone,” designed to highlight the technology achievements of our emerging start-up customers.
“We are entering an AI-empowered world, where artificial intelligence not only runs in data centers, but PCs, mobile devices, automobiles, and even the Internet of Things,” said TSMC CEO Dr. C.C. Wei. “At TSMC, we are offering our customers the most comprehensive set of technologies to realize their visions for AI, from the world’s most advanced silicon, to the broadest portfolio of advanced packaging and 3D IC platforms, to specialty technologies that integrate the digital world with the real world.”
New technologies introduced at the symposium include:
TSMC A16TM Technology: With TSMC’s industry-leading N3E technology now in production, and N2 on track for production in the second half of 2025, TSMC debuted A16, the next technology on its roadmap. A16 will combine TSMC’s Super Power Rail architecture with its nanosheet transistors for planned production in 2026. It improves logic density and performance by dedicating front-side routing resources to signals, making A16 ideal for HPC products with complex signal routes and dense power delivery networks. Compared to TSMC’s N2P process, A16 will provide 8-10% speed improvement at the same Vdd (positive power supply voltage), 15-20% power reduction at the same speed, and up to 1.10X chip density improvement for data center products.
TSMC NanoFlexTM Innovation for Nanosheet Transistors: TSMC’s upcoming N2 technology will come with TSMC NanoFlex, the company’s next breakthrough in design-technology co-optimization. TSMC NanoFlex provides designers with flexibility in N2 standard cells, the basic building blocks of chip design, with short cells emphasizing small area and greater power efficiency, and tall cells maximizing performance. Customers are able to optimize the combination of short and tall cells within the same design block, tuning their designs to reach the optimal power, performance, and area tradeoffs for their application.
N4C Technology: Bringing TSMC’s advanced technology to a broader range of of applications, TSMC announced N4C, an extension of N4P technology with up to 8.5% die cost reduction and low adoption effort, scheduled for volume production in 2025. N4C offers area-efficient foundation IP and design rules that are fully compatible with the widely-adopted N4P, with better yield from die size reduction, providing a cost-effective option for value-tier products to migrate to the next advanced technology node from TSMC.
CoWoS®, SoIC, and System-on-Wafer (TSMC-SoW™ ): TSMC’s Chip on Wafer on Substrate (CoWoS®) has been a key enabler for the AI revolution by allowing customers to pack more processor cores and high-bandwidth memory (HBM) stacks side by side on one interposer. At the same time, our System on Integrated Chips (SoIC) has established itself as the leading solution for 3D chip stacking, and customers are increasingly pairing CoWoS with SoIC and other components for the ultimate system-in-package (SiP) integration.
With System-on-Wafer, TSMC is providing a revolutionary new option to enable a large array of dies on a 300mm wafer, offering more compute power while occupying far less data center space and boosting performance per watt by orders of magnitude. TSMC’s first SoW offering, a logic-only wafer based on Integrated Fan-Out (InFO) technology, is already in production. A chip-on-wafer version leveraging CoWoS technology is scheduled to be ready in 2027, enabling integration of SoIC, HBM and other components to create a powerful wafer-level system with computing power comparable to a data center server rack, or even an entire server.
Silicon Photonics Integration: TSMC is developing Compact Universal Photonic Engine (COUPE™ ) technology to support the explosive growth in data transmission that comes with the AI boom. COUPE uses SoIC-X chip stacking technology to stack an electrical die on top of a photonic die, offering the lowest impedance at the die-to-die interface and higher energy efficiency than conventional stacking methods. TSMC plans to qualify COUPE for small form factor pluggables in 2025, followed by integration into CoWoS packaging as co-packaged optics (CPO) in 2026, bringing optical connections directly into the package.
Automotive Advanced Packaging: After introducing the N3AE “Auto Early” process in 2023, TSMC continues to serve our automotive customers’ needs for greater computing power that meets the safety and quality demands of the highway by integrating advanced silicon with advanced packaging. TSMC is developing InFO-oS and CoWoS-R solutions for applications such as advanced driver assistance systems (ADAS), vehicle control, and vehicle central computers, targeting AEC-Q100 Grade 2 qualification by fourth quarter of 2025.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,895 products for 528 customers in 2023 by providing broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240424036229/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Philip Morris International’s Moira Gilchrist Positions Human Judgment as a Critical Leadership Advantage Amid Rapid AI Adoption at Wall Street Journal Forum8.5.2026 10:00:00 CEST | Press release
PMI’s Chief Global Communications Officer says companies that safeguard human judgment will gain a competitive edge as AI automates routine knowledge work Philip Morris International’s (PMI) (NYSE:PM) Chief Global Communications Officer, Moira Gilchrist, joined global thought leaders at The Wall Street Journal’s Future of Everything conference in New York to examine why human cognition—judgment, context, creativity, and ethical reasoning—is becoming the most valuable asset in an age of artificial intelligence. “The AI boom is putting a premium on distinctly human capabilities,” said Gilchrist, who took part in the session “Cognition: The New Currency – Why Human Judgment Matters More Than Ever.” Speaking to attendees, she emphasized that, “As knowledge is getting democratized, human judgment, intuition, and creativity become the true differentiators that leaders need to nurture across all levels of their organizations.” Philip Morris International is today a different company, built wi
Fortegra Appoints Iwan Röpcke as Chief Executive Officer, Belgium8.5.2026 09:30:00 CEST | Press release
The Fortegra Group, Inc., a global specialty insurer, today announced the appointment of Iwan Röpcke as Chief Executive Officer, Belgium. Mr. Röpcke brings more than 25 years of insurance industry experience to the role, spanning broking, commercial leadership, and executive management across the Benelux and broader European markets. He joins Fortegra from Lloyd’s Insurance Company S.A., where he served as Country Manager for Belgium and the Netherlands, building out the operation from its early stages and overseeing both business strategy and development. Prior to Lloyd's, Mr. Röpcke held senior leadership positions at Willis Towers Watson (via Gras Savoye), where he served as Head of Sales and Head of the Competence Center. His career also includes roles at Inter Partner Assistance (AXA Assistance) as Commercial Director Benelux, Winterthur Europe Assurances, AIG Europe, Aon Belgium, and Marsh. Mr. Röpcke’s industry expertise spans a range of specialty risk areas, with deep relations
KAYTUS Launches All-QLC Flash Storage at AI EXPO 2026 for 10,000-GPU Clusters8.5.2026 09:02:00 CEST | Press release
KAYTUS’s next-generation all-QLC flash solution delivers fully linear performance scaling for massive GPU clusters, while reducing TCO by 70%, enabling ultra-large-scale computing for the era of agentic AI. At AI EXPO KOREA 2026, KAYTUS officially launched its All-QLC Flash Storage Solution, engineered to deliver high performance, massive scalability, and cost efficiency for 10,000-GPU clusters. The solution addresses data-delivery bottlenecks in ultra-large-scale AI training, helping maximize GPU resource utilization. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260508313130/en/ Based on the KR2280 and KR1180 server platforms, the solution is deeply integrated with industry-leading AI-native parallel file systems to eliminate data silos inherent in traditional tiered storage. Purpose-built for read-intensive AI workloads, it overcomes the horizontal scaling limitations of massive clusters. Verified test-data shows that, a
Beneq Appoints Dr. Jason Harrison as Chief Executive Officer8.5.2026 09:00:00 CEST | Press release
Semiconductor industry leader takes the helm to accelerate Beneq’s next phase of growth in atomic layer deposition Beneq Oy, the home of atomic layer deposition (ALD), today announced the appointment of Dr. Jason Harrison as Chief Executive Officer. Dr. Harrison succeeds Dr. Tommi Vainio and will lead Beneq into its next phase of growth across semiconductor, optical, and emerging technology markets. A Strategic Leadership Transition Beneq enters its next phase of growth from a position of strong commercial momentum. Recent milestones include the qualification of the Beneq Transform® cluster tool for volume production of GaN power and RF filter devices; the introduction of Beneq Transmute™ and Beneq Transform® XP, both engineered for high-volume manufacturing (HVM) of specialty semiconductors; growing adoption of the P-Series for coating critical chamber parts in advanced node devices; and selection of the C2R™ for AR waveguide production in next-generation XR optics. Against this backd
World Employment Confederation’s 59th Annual Conference to Address Critical Global Labour Market Concerns8.5.2026 07:12:00 CEST | Press release
Senior leaders from policy, business and international institutions are set to discuss critical labour market concerns at the World Employment Confederation’s Annual Conference, during an era of global transformation and disruption never-before-seen. Taking place on 12-13 May in Toronto and entitled ‘Grow With Talent’, this year’s World Employment Conference – co-organised with ACSESS – arrives at a time of profound economic uncertainty. This gathering of leaders and experts will help define the path forward for the global labour market and set the stage for discussions at the 114th Session of the International Labour Conference (ILC) in June. Bettina Schaller, President of World Employment Confederation (WEC) says: “The question at the heart of this year’s World Employment Conference is: how will we mobilise the world’s talent to drive growth in an era of disruption?At a time of accelerating AI adoption, rapid demographic change and an uncertain global economic outlook, pressure on la
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom