CA-TSMC
TSMC (TWSE: 2330, NYSE: TSM) today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium. TSMC debuted the TSMC A16TM technology, featuring leading nanosheet transistors with innovative backside power rail solution for production in 2026, bringing greatly improved logic density and performance. TSMC also introduced its System-on-Wafer (TSMC-SoW™) technology, an innovative solution to bring revolutionary performance to the wafer level in addressing the future AI requirements for hyperscaler datacenters.
This year marks the 30th anniversary of TSMC’s North America Technology Symposium, and more than 2,000 attended the event, growing from less than 100 attendees 30 years ago. The North America Technology Symposium in Santa Clara, California kicks off TSMC Technology Symposiums around the world in the coming months. The symposium also features an “Innovation Zone,” designed to highlight the technology achievements of our emerging start-up customers.
“We are entering an AI-empowered world, where artificial intelligence not only runs in data centers, but PCs, mobile devices, automobiles, and even the Internet of Things,” said TSMC CEO Dr. C.C. Wei. “At TSMC, we are offering our customers the most comprehensive set of technologies to realize their visions for AI, from the world’s most advanced silicon, to the broadest portfolio of advanced packaging and 3D IC platforms, to specialty technologies that integrate the digital world with the real world.”
New technologies introduced at the symposium include:
TSMC A16TM Technology: With TSMC’s industry-leading N3E technology now in production, and N2 on track for production in the second half of 2025, TSMC debuted A16, the next technology on its roadmap. A16 will combine TSMC’s Super Power Rail architecture with its nanosheet transistors for planned production in 2026. It improves logic density and performance by dedicating front-side routing resources to signals, making A16 ideal for HPC products with complex signal routes and dense power delivery networks. Compared to TSMC’s N2P process, A16 will provide 8-10% speed improvement at the same Vdd (positive power supply voltage), 15-20% power reduction at the same speed, and up to 1.10X chip density improvement for data center products.
TSMC NanoFlexTM Innovation for Nanosheet Transistors: TSMC’s upcoming N2 technology will come with TSMC NanoFlex, the company’s next breakthrough in design-technology co-optimization. TSMC NanoFlex provides designers with flexibility in N2 standard cells, the basic building blocks of chip design, with short cells emphasizing small area and greater power efficiency, and tall cells maximizing performance. Customers are able to optimize the combination of short and tall cells within the same design block, tuning their designs to reach the optimal power, performance, and area tradeoffs for their application.
N4C Technology: Bringing TSMC’s advanced technology to a broader range of of applications, TSMC announced N4C, an extension of N4P technology with up to 8.5% die cost reduction and low adoption effort, scheduled for volume production in 2025. N4C offers area-efficient foundation IP and design rules that are fully compatible with the widely-adopted N4P, with better yield from die size reduction, providing a cost-effective option for value-tier products to migrate to the next advanced technology node from TSMC.
CoWoS®, SoIC, and System-on-Wafer (TSMC-SoW™ ): TSMC’s Chip on Wafer on Substrate (CoWoS®) has been a key enabler for the AI revolution by allowing customers to pack more processor cores and high-bandwidth memory (HBM) stacks side by side on one interposer. At the same time, our System on Integrated Chips (SoIC) has established itself as the leading solution for 3D chip stacking, and customers are increasingly pairing CoWoS with SoIC and other components for the ultimate system-in-package (SiP) integration.
With System-on-Wafer, TSMC is providing a revolutionary new option to enable a large array of dies on a 300mm wafer, offering more compute power while occupying far less data center space and boosting performance per watt by orders of magnitude. TSMC’s first SoW offering, a logic-only wafer based on Integrated Fan-Out (InFO) technology, is already in production. A chip-on-wafer version leveraging CoWoS technology is scheduled to be ready in 2027, enabling integration of SoIC, HBM and other components to create a powerful wafer-level system with computing power comparable to a data center server rack, or even an entire server.
Silicon Photonics Integration: TSMC is developing Compact Universal Photonic Engine (COUPE™ ) technology to support the explosive growth in data transmission that comes with the AI boom. COUPE uses SoIC-X chip stacking technology to stack an electrical die on top of a photonic die, offering the lowest impedance at the die-to-die interface and higher energy efficiency than conventional stacking methods. TSMC plans to qualify COUPE for small form factor pluggables in 2025, followed by integration into CoWoS packaging as co-packaged optics (CPO) in 2026, bringing optical connections directly into the package.
Automotive Advanced Packaging: After introducing the N3AE “Auto Early” process in 2023, TSMC continues to serve our automotive customers’ needs for greater computing power that meets the safety and quality demands of the highway by integrating advanced silicon with advanced packaging. TSMC is developing InFO-oS and CoWoS-R solutions for applications such as advanced driver assistance systems (ADAS), vehicle control, and vehicle central computers, targeting AEC-Q100 Grade 2 qualification by fourth quarter of 2025.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,895 products for 528 customers in 2023 by providing broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240424036229/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Venture Global Files FERC Application for Plaquemines Expansion Project18.11.2025 00:02:00 CET | Press release
Today, Venture Global, Inc. (NYSE: VG) filed with the Federal Energy Regulatory Commission (FERC) its application for the permitting and approval of the Plaquemines LNG brownfield expansion project. In addition, Venture Global has filed with the U.S. Department of Energy (DOE) for the export authorizations associated with this expansion. The Plaquemines Expansion was announced earlier this year with U.S. Secretary of Energy Chris Wright, U.S. Secretary of the Interior Doug Burgum, and Louisiana Governor Jeff Landry. Venture Global has since increased the expected output from this project by nearly 40% from the previously announced plans due to the continued optimization of our liquefaction trains and strong market demand. This bolt-on expansion will be built incrementally in three phases and consist of 32 modular liquefaction trains, adding in total over 30.0MTPA in peak production capacity. This will bring the total peak production capacity across the entire Plaquemines complex to ove
Global EV Alliance Releases EV Driver Survey Results: Myths Are Slowing EV Market17.11.2025 19:19:00 CET | Press release
In a groundbreaking survey of more than 26,000 EV drivers across 30 countries, an overwhelming 77% say persistent myths about electric cars are the single biggest obstacle to EV adoption in their nations. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251118388193/en/ There are still significant differences in the EV market across countries, and not everyone has a wide range of car brands to choose from. Photo: Markus Rotevatn/Norwegian EV Association. 83% say they believe policy measures are needed to increase EV sales in their country. “Misinformation about EVs is a serious challenge. It can make policymakers less confident that electric vehicles are a viable solution to climate change and local air pollution,” says Joel Levin, chair of GEVA and Director of Plug in America. One common myth in many countries is that electric cars are a fire hazard. 88% of the EV drivers in the survey say they aren’t worried about their EV b
Dilawer Farazi Returns to Loomis Sayles as Co-Head and Portfolio Manager on the Emerging Markets Debt Team17.11.2025 16:59:00 CET | Press release
Loomis, Sayles & Company is pleased to announce that Dilawer Farazi, ACA, has rejoined the firm as Co-Head and Portfolio Manager of the Emerging Markets Debt (EMD) Team. Dilawer becomes the firm’s first London-based portfolio manager. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251117681347/en/ Dilawer Farazi, ACA, has rejoined Loomis Sayles as Co-Head and Portfolio Manager of the Emerging Markets Debt Team Dilawer brings over two decades of experience in emerging markets credit, having previously served as a Senior Credit Research Analyst at Loomis Sayles from 2018 to 2020. He rejoins the firm from Royal London Asset Management (RLAM), where he led the Emerging Markets Credit team and managed approximately USD $1 billion in assets across EM credit. At RLAM, he launched the firm’s first dedicated emerging markets funds, including an emerging markets corporate bond fund and an emerging markets short duration credit fund. I
Duravant Announces Retirement of CEO Mike Kachmer, Names Jill Evanko Successor17.11.2025 16:13:00 CET | Press release
Mike Kachmer to retire following a distinguished 43-year career, including nearly 12 years as Chairman & CEO of Duravant Jill Evanko to succeed Mr. Kachmer as Duravant’s Chief Executive Officer Duravant LLC (“Duravant”), a global leader in advanced automation solutions, announced today that Mike Kachmer will retire from his role as Chief Executive Officer after a highly successful tenure with the company. Duravant’s Board of Directors has named Jill Evanko as CEO, joining the company on January 5, 2026. To ensure a seamless transition, Mr. Kachmer will continue to serve as Chairman of Duravant. Mr. Kachmer will also continue to serve on the Board of Directors for Northwestern Memorial Healthcare and The London Clinic. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251117036720/en/ Mike Kachmer “It has been a true honor and a humbling experience to lead this incredible company,” said Mr. Kachmer. “I am profoundly grateful to
Wolters Kluwer Enablon Control of Work Solution Now Available as Private Offer in AWS Marketplace17.11.2025 15:00:00 CET | Press release
Wolters Kluwer today announced that its Enablon Control of Work solution is now available in AWS Marketplace as a private offer. This purchasing model empowers customers to negotiate and receive tailored pricing, terms, and licensing agreements, while streamlining procurement and leveraging existing Amazon Web Services (AWS) billing workflows to accelerate deployment and optimize cloud budgets. Wolters Kluwer’s Enablon Control of Work solution consolidates permit-to-work, isolation management and risk assessments into an integrated system. Trusted by frontline workers and contractors in high-risk environments including oil & gas, pharmaceuticals, data center and manufacturing industries, the software helps streamline operations, minimize unplanned downtime and prevent serious injuries and fatalities. Richard Pulliam, SVP & General Manager of EHS & ESG for Wolters Kluwer, said: “Making Enablon's Control of Work solution available in AWS Marketplace is another step in our mission to help
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom