Business Wire

2024-ASC-STUDENT

23.4.2024 09:03:33 CEST | Business Wire | Press release

Share
Peking University Emerges Victorious in 2024 ASC Student Supercomputer Challenge Finals

On April 13, 2024, the 2024 ASC Student Supercomputer Challenge (ASC24) Finals drew to a close at Shanghai University after five days of intense competition. Peking University emerged as the undisputed overall champion, securing their place in ASC Student Supercomputer Challenge history.

After ASC24 registration opened on November 16, 2023, over 300 teams from universities participated in the intense preliminary contests. As a result, the absolute best 25 teams ascended to the finals hosted at Shanghai University from April 9 to 13, 2024. This marked a groundbreaking moment in ASC history, with the highest number of teams ever qualifying for onsite finals since the competition's inception in 2012.

During the finals, teams showcased their skills by designing and building cluster systems capped at a maximum power consumption of 3,000 W. They tackled a lineup of cutting-edge scientific and engineering applications, including HPL and HPCG benchmarks, Large Language Model (LLM), OpenCAEPoro, GoMars, and WannierTools. ASC24 featured again a group competition in which 25 teams, divided into 5 groups, explored the real-world application of ParaSeis. They simulated seismic wave propagation and refined algorithms through collaborative communication.

The competition reached its pinnacle when Peking University ultimately seized the coveted Champion title. Their performance not only impressed everyone but also demonstrated exceptional proficiency across various tasks such as GoMars, LLM, and WannierTools. This showed their expertise and unequaled mastery of comprehensive supercomputing systems, applications, and top-tier optimization skills.

The National Tsing Hua University team achieved significant results with the OpenCAEPoro task. They maximized the use of computing resources, executed large-scale parallel optimization of OpenCAEPoro while navigating power consumption constraints, and achieved the shortest run time, securing them the prestigious e Prize.

A collaborative effort led by Shanghai University, in partnership with the Southern University of Science and Technology, Qilu University of Technology, Southwest Petroleum University, and Hong Kong Polytechnic University, achieved remarkable optimization of ParaSeis. Their commendable teamwork and dedication were duly recognized with the prestigious Group Competition Award.

Additionally, the Zhejiang University team secured the Highest LINPACK Award, showcasing their exceptional computational prowess. Meanwhile, the outstanding performances of Shanxi University and Shanghai Jiao Tong University were properly honored with the coveted Application Innovation Award, recognizing their innovative contributions to the field.

Jack Dongarra, a distinguished member of the US National Academy of Engineering and recipient of the prestigious Turing Award, as well as a Distinguished Professor at both Oak Ridge National Laboratory and the University of Tennessee, and Chair of the ASC Advisory Committee, shared his insights during the closing ceremony of the ASC24 Finals: "ASC challenges and inspires the next generation of HPC scientists and engineers to deliver innovative solutions using the most cutting-edge technologies. The competition has been described as the world’s largest supercomputing hackathon, striving to foster the next generation of young talents to inspire exploration, innovation, and collaboration in Supercomputing and AI."

About ASC

The ASC Student Supercomputer Challenge stands as the globe's premier student supercomputer competition, with the generous support of experts and institutions spanning Asia, Europe, and America. ASC boasts a noble mission: to foster the exchange and cultivation of young supercomputing talent across borders, enhance supercomputing applications and research and development capabilities, propel the advancement of supercomputing technologies, and stimulate technical and industrial innovation. Since its inception in 2012, the ASC Student Supercomputer Challenge has grown every year, attracting over 10,000 undergraduates from every corner of the planet. To discover more about this impactful endeavor, visit the website.

http://www.asc-events.net/StudentChallenge/index.html

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240423424820/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

HAZAMA ANDO Becomes an Official Partner in Helical Fusion’s Commercial Fusion Initiative and Signs MoU Toward Construction of the Fusion Pilot Plant6.7.2026 08:40:00 CEST | Press release

A long-established Japanese general contractor will contribute construction expertise to advance Fusion Pilot Plant development toward commercially viable fusion power. Helical Fusion Co., Ltd. (“Helical Fusion”), a Japan-based fusion energy startup developing fusion power plants, and HAZAMA ANDO CORPORATION (“HAZAMA ANDO”), a long-established Japanese general contractor, today announced that HAZAMA ANDO has become an Official Partner in the Helix Program, Helical Fusion’s commercial fusion initiative. The two companies have also signed a memorandum of understanding (“MoU”) to collaborate toward the construction of Helix KANATA, Helical Fusion’s Fusion Pilot Plant targeted for the 2030s. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260706176052/en/ (L-R) Kazuhiko Kuniya (Representative Director and President, HAZAMA ANDO CORPORATION) and Takaya Taguchi (Co-Founder and CEO, Helical Fusion Co., Ltd.) at a press conference in

Sofinnova Partners Announces Myricx Bio Agrees to Be Acquired by Novartis6.7.2026 07:15:00 CEST | Press release

Sofinnova Partners co-led the seed investment in 2019 and has supported the company from founding through to exitThe proposed acquisition combines the oncology expertise of Novartis with Myricx Bio’s novel ADC assets and platform having broad potential across multiple solid tumor typesMyricx Bio's first-in-class NMTi payload platform is designed to improve the therapeutic index of ADCs, offering the potential for more effective and better-tolerated treatment options for cancer patientsThe transaction valued at up to $1.5 billion including $1.1 billion cash upfront Sofinnova Partners, a leading European life sciences venture capital firm, today announced that its portfolio company Myricx Bio (“Myricx”) has reached agreement to be acquired by Novartis, for up to $1.5 billion including $1.1 billion cash upfront plus potential milestone payments. This marks Sofinnova Partners' seventh exit in three years. Myricx Bio is a UK-headquartered transatlantic biotech company focused on the discove

Global New Material International Wins Technology Innovation Best Practice Award at Sino-European ESG Conference6.7.2026 05:59:00 CEST | Press release

Global New Material International Holdings Ltd. has received the Technology Innovation Best Practice Award at the Third Sino-European Corporate ESG Best Practice Conference recently in Mainz, Germany, in recognition of its efforts to advance sustainable development through material innovation. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260705533555/en/ Thorsten Giehler (L), Director of the Economic, Social Development and Employment Division of The German Society for International Cooperation (GIZ), delivered the award to Zhou Fangchao, Executive Director and Vice President of Global New Material International. The annual conference, initiated by the Chinese Consulate General in Frankfurt and jointly organized with Chinese and European partners, recognizes corporate best practices in environmental, social and governance (ESG) performance. This year's event brought together government officials, business leaders and exper

Access Advance Welcomes Samsung and Sharp to the VVC Advance Patent Pool6.7.2026 02:00:00 CEST | Press release

Access Advance LLC today announced significant additions to the VVC Advance Patent Pool, including Samsung Electronics and Sharp Corporation joining as both Licensors and Licensees. The additions strengthen Access Advance's position in VVC licensing, bringing two of the world's largest video codec patent holders into the program on both sides of the license. "The growth we are seeing in VVC Advance reflects the broad range of industries and companies that are moving toward VVC as the next standard for video delivery," said Peter Moller, CEO of Access Advance. "Samsung and Sharp joining as both Licensors and Licensees is significant, but so is the participation of leading smartphone brands and the range of consumer electronics and technology companies now executing licenses. We are building a program that reflects where the video market is actually heading." The following companies have joined the VVC Advance Patent Pool as Licensees since the beginning of 2026: American Future Technolo

Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products atKitakami Plant Fab23.7.2026 12:19:00 CEST | Press release

Companies Showcase Ongoing Buildout of Manufacturing Infrastructure at K2 to Address Growing Demand for NAND Flash Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today announced the start of production for their 10th-generation 3D Flash memory technology at Fab2 (K2) at the Kitakami Plant in Iwate Prefecture in Japan. The milestone comes as the companies continue to drive meaningful, multi-year bit growth to address the strong demand for their innovative flash memory technology. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702296115/en/ Unveiling ceremony for the K2 facility In conjunction with the start of production, the companies held an unveiling ceremony for the K2 facility. Opening in September 2025, the facility has produced the companies’ 8th-generation 3D flash memory products and will begin to scale production with the introduction of their

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye