Business Wire

HKTDC

9.4.2024 10:55:30 CEST | Business Wire | Press release

Share
Hong Kong Gifts & PrintPack Fairs Open in April

Hong Kong Trade Development Council:

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240408808037/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

HKTDC Hong Kong Gifts & Premium Fair, Hong Kong International Printing & Packaging Fair & DeLuxe PrintPack Hong Kong will be held on 27-30 April (Photo: Business Wire)

HKTDC Hong Kong Gifts & Premium Fair

Featuring a curated selection of gift and premium products from around 4000 exhibitors from 21 countries and regions, the fair will be held at the Hong Kong Convention and Exhibition Centre from 27-30 April, with the online matching services “Click2Match” available from 20 April to 7 May. It offers an ideal platform for exhibitors to showcase their latest products, and foster networking and collaboration among industry professionals.

The Hall of Fine Designs will return as a convergence of reputed global brands, including Red A (Hong Kong), Tiny Memory (Hong Kong), YASHICA (Japan) and more. The pavilion formed by Hong Kong Exporters' Association will showcase the design skills and branding excellence of local product designers. Winning works from the Hong Kong Smart Design Awards will also be displayed to highlight the creativity and flair of Hong Kong brands to global industry players.

The anticipated Cultural & Creative Corner will captivate visitors with its vibrant showcase of designer brands and products with unique styles. Catering to the latest trends, the brand-new Outdoor & Sporting Goods zone will showcase a series of products including camping gear, dance shoes, and sporting goods.

To keep visitors abreast of the latest market information and encourage networking, there will be seminars hosted by industry players and associations to share insights on areas crucial to the sector’s development such as consumer market trends, sustainability and silver economy.

Hong Kong International Printing & Packaging Fair & DeLuxe PrintPack Hong Kong

Jointly organised by the Hong Kong Trade Development Council and CIEC Exhibition Company (HK) Limited, the two printpack Fairs will be held from 27-30 April at AsiaWorld-Expo, with the online matching services “Click2Match” available from 20 April to 7 May.

The Printing & Packaging Fair is a premier marketplace to source printing and packaging equipment, products and services. As global demand for luxury packaging grows, the acclaimed World of DeLuxe PrintPack Zone at the Fair will spin off and launch as DeLuxe PrintPack Hong Kong this year. Together, the two Fairs will host around 500 exhibitors, offering a comprehensive showcase of industry-leading solutions.

Highlighted Zones:

  • Green Printing & Packaging: bio-degradable materials, upcycled products and innovative green solutions
  • Food & Beverage Packaging: functional solutions designed for fresh, chilled, and processed food
  • E-commerce Packaging: creative solutions for enterprises to capture e-tailing opportunities

The debut DeLuxe PrintPack will present an array of printing and packaging solutions tailored for luxury goods including jewellery, watches, cosmetics, gourmet food, and wine.

Forums and networking activities will be held share industry trends, sustainable designs and the impact of deluxe packaging on brand identity. Award-winning entries from the Hong Kong Print Awards, the Hong Kong Digital Printing Award and the GAAHK x PolyU Design - Packaging Design will be presented to showcase innovations in printpack design and production.

Register Now: https://tinyurl.com/2jrph7z2

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240408808037/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Motive Powers Latin America’s Next Wave of Mobile Innovation1.6.2026 17:00:00 CEST | Press release

Motive Entitlement Server enabling satellite connectivity in the Andes to fraud-free authentication in Brazil Motive, a global leader in entitlement and connected device & service management, joined operators and industry leaders at M360 LATAM in Mexico City, showcasing live deployments across the region's most consequential use cases: Satellite Direct-to-Device connectivity for unreachable geographies, end-to-end eSIM provisioning and visibility at scale, and SIM-based silent authentication replacing fraud-exposed SMS OTP. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260531906729/en/ Across landmark deployments with multiple Claro, Vivo, and Entel operations, Motive’s Entitlement Server (Motive ES) has moved from infrastructure component to regional growth engine. These deployments are citing measurable commercial growth, enabling streamlined eSIM provisioning, improved device onboarding experiences, and new revenue oppor

Interactive Brokers Integrates AI into Client Portfolios – Informed by Agentic Technology, Controlled by the Client1.6.2026 16:00:00 CEST | Press release

Clients Can Research Stocks, Analyze Performance, and Generate Trade Instructions in Claude. The Client Approves Every Trade. Interactive Brokers (Nasdaq: IBKR), an automated global broker, today announced agentic trading through direct integration with Claude, one of the world's leading AI platforms. Available through the AI platform’s certified connector marketplace, the integration lets clients manage their accounts and access more than 170 global markets. "Interactive Brokers has used technology for over four decades to help investors make more informed decisions and interact more efficiently with markets," said Milan Galik, Chief Executive Officer of Interactive Brokers. "Investors are increasingly using artificial intelligence to research markets, analyze information and generate ideas. We believe the next logical step is to allow clients to securely connect AI tools directly to their brokerage accounts — whether they want a simple conversational interface, deeper portfolio analy

AIM Expands Life Sciences Supply Chain Capabilities and Hires New Partner, Thomas Ebel1.6.2026 15:01:00 CEST | Press release

AIM today announced the appointment of veteran pharma supply chain expert Thomas Ebel as Partner, effective June 15. Mr. Ebel brings more than 25 years of supply chain consulting experience at leading firms including CAMELOT, McKinsey, and Accenture, and will anchor a broader initiative to expand AIM’s end-to-end supply chain capabilities. According to Richard de Bakker, Statutory Director and Founder at AIM, the firm is significantly expanding its capabilities around “end-to-end” supply chain needs. “AIM is well known as a leader in supply chain development for launch, as well as optimization of existing supply chains — supporting clients in getting their finished products to patients,” said Mr. de Bakker. “We are now adding new capabilities in supply chain diagnostics and strategy, end-to-end planning optimization, supply reliability, and working capital optimization, among others. Combined with AIM’s established supply chain expertise, this expanded offering gives clients true ‘end-

Seoul Semiconductor's World-First 'HV Opto-Semiconductor' Powers Up Global Top 4 Automakers1.6.2026 15:00:00 CEST | Press release

Seoul Semiconductor Co., Ltd. (KOSDAQ: 046890), a global opto-semiconductor technology company, announced that its world's first High Voltage (HV) opto-semiconductor technology has entered mass production with four of the world's top automotive brands across the Americas, Europe, and Asia, with plans to expand supply to 10 models by the end of the year. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601232986/en/ Comparison: Conventional 3V LED vs. Seoul Semiconductor 12V 'HV Opto-Semiconductor' (Figure: Seoul Semiconductor) The technology combines micro-scaled opto-semiconductor chips capable of 12V single-chip operation — as opposed to conventional 3V LEDs — with a high-voltage (HV) driver technology. This enables a reduction of more than 10% in the number of driver-related components used in hybrid and electric vehicles, while lowering power consumption by approximately 10%, contributing to cost reduction and simplific

Oscilloquartz delivers assured timing for mission-critical harsh environments with ruggedSync™ Series OSA 55101.6.2026 14:00:00 CEST | Press release

News summary: Defense operations require resilient timing architectures that maintain synchronization in contested and GNSS-denied environments ruggedSync™ Series OSA 5510 delivers assured timing and extended holdover in a MIL-qualified platform for tactical, deployable operations Zero-trust resiliency with diversified cPNT sources, including M-Code, PRS and STL, strengthens operational continuity for defense communications, navigation and mission-critical infrastructure Oscilloquartz today launched its ruggedSync™ Series OSA 5510, a ruggedized timing and synchronization platform engineered for defense and other harsh, mission-critical environments. Designed for deployment in tactical communications networks, mobile command centers (MCCs), aviation systems and other highly demanding operational environments, the OSA 5510 combines PTP grandmaster and NTP server functionality with synchronization assurance and resilient holdover in a compact MIL-qualified platform. Multi-band GNSS suppor

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye