QUECTEL-WIRELESS
9.4.2024 09:01:58 CEST | Business Wire | Press release
Embedded World – Quectel Wireless Solutions, a global IoT solutions provider, is pleased to announce the launch of the HCM511S high-performance MCU Bluetooth module for compact connected devices such as digital keys, portable devices and battery-operated motion sensors. Utilizing Bluetooth Low Energy 5.4, the module accommodates an ARM Cortex-M33 processor and features built-in 32KB RAM and either 352KB or 512KB flash memory to deliver efficient performance.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240409992885/en/
Quectel unveils its HCM511S high performance MCU Bluetooth module to power Low Energy compact connected devices (Graphic: Business Wire)
The HCM511S module features excellent receiver sensitivity, a maximum transmit power of +6 dBm to achieve long distance transmission and has been designed to enable compact, low-power devices to connect cost effectively. Measuring just 16.6mm x 11.2mm x 2.1mm, the HCM511S is in the ultra-compact LCC form factor in order to optimize size and cost for end-products. Ideal applications for the HCM511S include sports & fitness devices, PC peripherals and accessories, healthcare applications including blood pressure and glucose metering, indoor navigation, digital key, connected lighting control and smart home and smart building applications.
“We’re delighted to bring the compact, high-performance HCM511S Bluetooth Low Energy MCU module to the market,” says Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “Everything from digital keys to barbecue thermometers, heart rate monitors and smart locks can be supported by the HCM511S. For battery-powered devices such as Bluetooth remote controls or electronic shelf labels, the high-power efficiency of the module will be an added benefit.”
Critically, the HCM511S module offers the option of support for Bluetooth mesh network low-power nodes. This enables increased network scalability and node counts over mesh topology, enabling greater device density to be enabled. The module offers up to 18 GPIOs which can be multiplexed for various interfaces including ADC, USART, I2C, I2S, SPI and PWM to maximize developer design options.
Connecting via a PCB Bluetooth antenna, the high-performance product operates in industrial grade operating temperature ranges of -40 °C to +85 °C and weighs just 0.57g. The HCM511S is certified for use in Europe, America, Canada, China, Australia and New Zealand and is also a certified Bluetooth product by the Bluetooth Special Interest Group.
The module also supports Secure Vault®, an enhanced secure engine for a higher level of IoT security. Quectel’s IoT modules are developed with security at the core. From product architecture to firmware/software development, Quectel incorporates leading industry practices and standards, mitigating potential vulnerabilities with third party independent test houses and have incorporated security practices like generating SBOMs and VEX files as well as performing firmware binary analysis into the entire software development lifecycle.
Engineering samples of the module are currently available, and interested customers can learn more about it at the Embedded World show in Nuremberg, taking place from April 9th to April 14th. Visit Quectel's booth at stand 3-318 for further information.
About Quectel
Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of 5,900 professionals sets the pace for innovation in cellular, GNSS, Wi-Fi and Bluetooth modules as well as antennas and services.
With regional offices and support across the globe, our international leadership is devoted to advancing IoT and helping build a smarter world.
For more information, please visit: www.quectel.com, LinkedIn, Facebook, and X.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240409992885/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
IQM and Real Asset Acquisition Corp. to Host Conference Call/Webcast to Discuss Proposed Transaction27.2.2026 13:00:00 CET | Press release
IQM Finland Oy, a global leader in full-stack superconducting quantum computers (“IQM”, “IQM Quantum Computers” or the “Company”), and Real Asset Acquisition Corp. (Nasdaq: RAAQ), a special purpose acquisition company (“RAAQ”), announced that they will host a conference call to discuss their recently announced business combination, including certain transaction highlights. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260227472716/en/ IQM Radiance quantum computer As previously disclosed, on February 23, 2026, IQM and RAAQ announced they have entered into a definitive business combination agreement, which will result in IQM becoming a public company and listing American Depositary Shares on one of the two leading U.S. stock exchanges. The transaction provides funding with the aim to accelerate IQM’s technology and commercial development towards fault-tolerance quantum computing, further advancing its position as a leading p
HighRadius Launches $0 Implementation Fee, $0 Subscription Fee via Outcome Based Pricing for oCFO Software27.2.2026 12:00:00 CET | Press release
HighRadius launches Office of the CFO first Outcome Based Pricing with $0 Implementation fee and $0 Subscription until Go-Live. Customers only pay a fraction of realized gains based on P&L impact. Chapter 1: Outcome Based Pricing (OBP)Introduction of OBP: HighRadius, a provider of 190+ AI agents for Order-to-Cash, Accounts Payable, Record-to-Report, and Treasury introduces Outcome Based Pricing (OBP). Three Components of OBP: Customers pay a) $0 in Implementation fees, b) $0 in Subscription fees until Go Live, c) HighRadius earns a fraction of the actual savings realized by the client. Chapter 2: US GAAP & ASC 606 ConstraintsNot Designed for Innovation: The traditional ASC 606 model requires companies to standardize and recognize revenue based on contractual obligations. For a traditional SaaS subscription, the obligation is access to software over time. AI agents are designed to deliver quantifiable, real-time Business Outcomes that do not fit the traditional accounting framework. Cha
Kioxia Appoints Yoshihiko Kawamura as Chief Financial Officer27.2.2026 09:15:00 CET | Press release
Kioxia Holdings Corporation (TOKYO:285A), a world leader in memory solutions, today announced the appointment of Yoshihiko Kawamura as Chief Financial Officer (CFO), effective April 1, 2026. Mr. Kawamura brings extensive international experience to Kioxia, having held assignments at Mitsubishi Corporation’s U.S. headquarters, served as General Manager of its Chicago office, and completed a tenure at the World Bank. At Hitachi, Ltd., he held senior leadership positions, including Chief Strategy Officer (CSO), Chief Financial Officer (CFO), and Chief Risk Management Officer (CRMO), where he was instrumental in leading the company’s management reforms. Since joining Kioxia as Executive Vice President in June 2025, Mr. Kawamura has worked closely with the executive team to advance the business through strategic capital and financial planning. Following its initial public offering on the Prime Market of the Tokyo Stock Exchange in December 2024, Kioxia is entering a new phase of growth char
DNP Invests in Rapidus to Support the Establishment of Mass Production for Next-Generation Semiconductors27.2.2026 08:18:00 CET | Press release
Will accelerate the development and mass production of EUV lithography photomasks Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) today announced that it has participated in Rapidus Corporation’s funding round as one of the round investors. This strategic funding initiative supports Rapidus’ plan to steadily progress from its current R&D phase to mass production of 2nm (10⁻⁹ meters) logic semiconductors by 2027. Through this initiative, DNP will advance the development and mass production of EUV lithography photomasks and support Rapidus as it establishes a mass production system for 2nm & next-generation semiconductors. Background In recent years, the rise in energy consumption, in line with increased data generation, has become a challenge, driving demand for next-generation semiconductors capable of improving device performance and reducing power consumption. Next-generation semiconductors manufactured using EUV lithography enable the formation of finer patterns on silicon wafers co
EdgeConneX Looks to Enter Swedish Market as Part of European Data Center Expansion Strategy27.2.2026 08:05:00 CET | Press release
Planned data center campus in Skellefteå would support future AI and cloud infrastructure needs EdgeConneX®, an EQT portfolio company with an extensive Pan-European data center footprint, looks to expand its presence with a new site located in Skellefteå, Sweden. The data center site will be acquired from Lyten, a global company that specializes in lithium-sulfur batteries and energy storage. The site would support EdgeConneX broader strategy to expand digital infrastructure capacity across the Nordics. Subject to the completion of applicable administrative and regulatory processes, EdgeConneX will look to develop a data center campus with potential capacity of up to one gigawatt in support of future AI and cloud computing workloads. Upon completion, the data center campus would be one of the largest facilities in Europe that would be primarily powered by renewable energy. “Sweden represents an attractive long‑term market for digital infrastructure investment. The country’s access to r
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom