MN-DIGI-INTERNATIONAL
Digi International (NASDAQ: DGII, www.digi.com), a leading global provider of Internet of Things (IoT) connectivity products and services, is poised to introduce the wireless and highly power-efficient Digi ConnectCore® MP25 system-on-module (SOM) at Embedded World 2024. Featuring AI and machine learning capabilities, with an integrated neural processing unit and image signal processor, Digi ConnectCore MP25 is designed for next-generation computer vision applications in critical sectors such as industrial, medical, energy and transportation. The module provides highly reliable wireless connectivity and time-sensitive networking (TSN) making it perfect for smart portable devices and Industry 4.0.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240404695178/en/
Digi International to unveil the new Digi ConnectCore® MP25 System-on-Module for next-gen computer vision applications at Embedded World 2024. Versatile, wireless and secure system-on-module based on the STMicroelectronics STM32MP25 processor improves efficiency, reduces costs and enables edge processing for innovative new devices. (Graphic: Business Wire)
Based on STMicroelectronics’ STM32MP25 MPU processor, Digi ConnectCore MP25 is engineered to streamline application development under demanding requirements to improve efficiency, reduce costs, boost innovation and improve end-customer satisfaction.
“The STM32MP25 MPU is an industrial-grade 64-bit MPU for secure Industry 4.0 and advanced edge computing applications that require high-end multimedia capabilities,” said Stéphane Henry, General-Purpose Microprocessors Division General Manager, STMicroelectronics. “Digi, a member of the ST Partner Program, is actively collaborating with STMicroelectronics. They integrated this high-performance processor into their family of Digi ConnectCore system-on-modules solutions as soon as it was available, and we are thrilled they are one of the first to release a module to the developer community. This extends their ConnectCore MP1 family available now with a higher performance option.”
“The introduction of Digi ConnectCore MP25 marks a pivotal moment in addressing the evolving needs of industries all over the world,” said Andreas Burghart, Senior Product Manager at Digi International. “With its robust design, vast connectivity options and innovative features including advanced security, the ConnectCore MP25 exemplifies our dedication to providing solutions that both simplify application development and enhance operational efficiency and customer satisfaction in an always-changing landscape.”
With an innovative architecture, Digi ConnectCore MP25 features two Cortex-A35 cores operating at 1.5GHz supplemented by a Cortex-M33 core and a Cortex-M0+. Enhanced with an AI/ML neural processing unit (NPU) delivering 1.35 TOPS and an image signal processor (ISP), the SOM provides accelerated machine learning capabilities for advanced applications. Its comprehensive connectivity options include 802.11ac Wi-Fi 5 and Bluetooth 5.2 wireless technologies, along with seamless cellular integration for expanded possibilities. The ultra-compact Digi SMTplus form-factor (30 x 30 mm) and industrial temperature ranges (-40 to +85 °C) ensure reliability in the harshest environments, making it an excellent choice for a wide variety of IoT applications.
“As the IoT landscape continues to evolve, Digi remains committed to delivering solutions that not only meet the demands of today but also anticipate the needs of tomorrow,” Burghart continued. “With Digi ConnectCore MP25, we’re empowering device developers with the ready-to-use edge intelligence, security features and other future-proof tools and technologies needed to drive forward-thinking innovation and deliver exceptional value to their customers.”
Built to handle the most demanding applications, Digi ConnectCore MP25 embodies a 10-year+ longevity program, ensuring sustained performance and reliability for extended product lifecycles. Additionally, its implementation of Time-Sensitive Networking (TSN) and support for up to 3 Gigabit Ethernet ports, complemented by PCIe Gen2, USB 3.0, and 3 x CAN-FD interfaces, underscores its versatility and adaptability. Backed by a 3-year warranty and global technical support, this SOM not only exceeds expectations but sets a new standard for innovation and reliability in the IoT landscape.
Visit Digi International at booth 4A-131 during Embedded World 2024, taking place from April 9 to 11, in Nuremberg, Germany.
For more information about Digi ConnectCore MP25, including a comprehensive list of features, please visit https://www.digi.com/connectcore-mp2.
About Digi International
Digi International (NASDAQ: DGII) is a leading global provider of IoT connectivity products, services, and solutions. It helps companies create next-generation connected products and deploy and manage critical communications infrastructures in demanding environments with high levels of security and reliability. Founded in 1985, Digi has helped customers connect more than 100 million things and counting. For more information, visit https://www.digi.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240404695178/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
IFF to Release Fourth Quarter & Full Year 2025 Results on Feb. 11, 2026; IFF to Present at 2026 CAGNY Conference on Feb. 19, 202621.1.2026 22:15:00 CET | Press release
IFF (NYSE:IFF) today announced that it will release its fourth quarter and full year 2025 earnings results following the market close on Wednesday, Feb. 11, 2026. The management team will host a live webcast on Thursday, Feb. 12, 2026, at 9:00 a.m. ET to discuss results and outlook with the investor community. IFF also announced today that the Company’s management will speak at the Consumer Analyst Group of New York (CAGNY) conference on Thursday, Feb. 19, 2026 at 1:00 PM ET. Investors may access the live webcast and accompanying slide presentation on the Company's website at ir.iff.com. For those unable to listen to the live webcast, a recorded version will be made available for replay. Welcome to IFF At IFF (NYSE: IFF), we make joy through science, creativity and heart. As the global leader in flavors, fragrances, food ingredients, health and biosciences, we deliver groundbreaking, sustainable innovations that elevate everyday products—advancing wellness, delighting the senses and en
UAE Research Program for Rain Enhancement Science Announces Awardees of 6th Cycle Grants21.1.2026 21:17:00 CET | Press release
The UAE Research Program for Rain Enhancement Science (UAEREP), managed by the National Center of Meteorology (NCM), announced the awardees of its Sixth Cycle research grants. Each recipient will receive up to US$1.5 million over three years, with a maximum annual allocation of US$550,000. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260121231610/en/ UAE Research Program for Rain Enhancement Science Announces Awardees of 6th Cycle Grants (Photo: AETOSWire) The Sixth Cycle awardees are Dr. Dixon Michael, Principal Radar Meteorologist and Software Engineer at Echo Science Works, USA, for “Advancing Cloud Seeding Science with Dual-Polarization Radar Signatures and AI”; Prof. Linda Zou, Adjunct Professor at Victoria University, Australia, for “AI-assisted Development and Optimization of Glaciogenic Cloud Seeding Materials”; and Dr. Oliver Branch, Senior Scientist at the University of Hohenheim, Germany, for “Rainfall Enhanceme
Logical Intelligence Introduces First Energy-Based Reasoning AI Model, Signals Early Steps Toward AGI, Adds Yann LeCun and Patrick Hillmann to Leadership21.1.2026 19:21:00 CET | Press release
Logical Intelligence, an artificial intelligence company developing energy-based (EBM) reasoning systems, today announced that Kona 1.0, its pioneering EBM for reasoning, will enter pilot programs with select partners in the energy, advanced manufacturing, and semiconductor industries later this quarter. Logical Intelligence also released a live demonstration of Kona 1.0 on its website, beginning with head-to-head sudoku challenges against leading large language models. Additional demonstrations, including chess and Go, are planned. The company said the goal is to give researchers and the public a clear view into how energy-based reasoning differs from probabilistic systems. “Kona learns by recognizing and correcting its own mistakes, rather than guessing the most likely answer,” said Eve Bodnia, founder and CEO of Logical Intelligence. “If general intelligence means the ability to reason across domains, learn from error, and improve without being retrained for each task, then we are s
Galderma Provides Update on Arbitration Case Regarding Neuromodulator Research and Development Partnership21.1.2026 17:35:00 CET | Press release
Galderma (SIX:GALD), the pure-play dermatology category leader, today announced that an International Chamber of Commerce arbitral tribunal issued an award confirming the termination of a 2014 neuromodulator research & development partnership with Ipsen. The partnership was limited to the rights and obligations relating to the companies’ early-stage neuromodulator pipeline for aesthetic indications. Galderma welcomes the clarity provided by the arbitral tribunal. This decision has no impact on the commercialization of Galderma’s neuromodulator portfolio. Galderma will continue to commercialize and supply Dysport®/Azzalure®, Alluzience®, and RelfydessTM in all territories where it has regulatory approval and in accordance with our existing agreements with our partner Ipsen. Progressing on our path towards becoming the undisputed dermatology powerhouse Galderma remains focused on its ambition to become the world’s undisputed dermatology powerhouse across the full spectrum of a fast-growi
ThetaRay Appoints Financial Markets Technology Leader Brad Levy as Chief Executive Officer21.1.2026 17:00:00 CET | Press release
Former Symphony CEO to lead ThetaRay’s next phase of AI-driven category leadership in transaction monitoring and due diligence ThetaRay, a global leader in Cognitive AI financial crime compliance, today announced the appointment of Brad Levy as Chief Executive Officer. Levy, a leading financial markets infrastructure executive and former CEO of Symphony, will lead ThetaRay’s next phase of growth as the company continues to scale its Cognitive AI platform, now emerging as the leading AI strategy and technology for transaction monitoring and transaction due diligence, across banks and fintechs worldwide. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260121002476/en/ ThetaRay Appoints Brad Levy as CEO Levy brings decades of experience building and leading mission-critical financial infrastructure at scale. Most recently, he served as CEO of Symphony, the financial markets infrastructure and technology platform established by a
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom