MN-DIGI-INTERNATIONAL
4.4.2024 15:01:34 CEST | Business Wire | Press release
Digi International (NASDAQ: DGII, www.digi.com), a leading global provider of Internet of Things (IoT) connectivity products and services, is poised to introduce the wireless and highly power-efficient Digi ConnectCore® MP25 system-on-module (SOM) at Embedded World 2024. Featuring AI and machine learning capabilities, with an integrated neural processing unit and image signal processor, Digi ConnectCore MP25 is designed for next-generation computer vision applications in critical sectors such as industrial, medical, energy and transportation. The module provides highly reliable wireless connectivity and time-sensitive networking (TSN) making it perfect for smart portable devices and Industry 4.0.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240404695178/en/
Digi International to unveil the new Digi ConnectCore® MP25 System-on-Module for next-gen computer vision applications at Embedded World 2024. Versatile, wireless and secure system-on-module based on the STMicroelectronics STM32MP25 processor improves efficiency, reduces costs and enables edge processing for innovative new devices. (Graphic: Business Wire)
Based on STMicroelectronics’ STM32MP25 MPU processor, Digi ConnectCore MP25 is engineered to streamline application development under demanding requirements to improve efficiency, reduce costs, boost innovation and improve end-customer satisfaction.
“The STM32MP25 MPU is an industrial-grade 64-bit MPU for secure Industry 4.0 and advanced edge computing applications that require high-end multimedia capabilities,” said Stéphane Henry, General-Purpose Microprocessors Division General Manager, STMicroelectronics. “Digi, a member of the ST Partner Program, is actively collaborating with STMicroelectronics. They integrated this high-performance processor into their family of Digi ConnectCore system-on-modules solutions as soon as it was available, and we are thrilled they are one of the first to release a module to the developer community. This extends their ConnectCore MP1 family available now with a higher performance option.”
“The introduction of Digi ConnectCore MP25 marks a pivotal moment in addressing the evolving needs of industries all over the world,” said Andreas Burghart, Senior Product Manager at Digi International. “With its robust design, vast connectivity options and innovative features including advanced security, the ConnectCore MP25 exemplifies our dedication to providing solutions that both simplify application development and enhance operational efficiency and customer satisfaction in an always-changing landscape.”
With an innovative architecture, Digi ConnectCore MP25 features two Cortex-A35 cores operating at 1.5GHz supplemented by a Cortex-M33 core and a Cortex-M0+. Enhanced with an AI/ML neural processing unit (NPU) delivering 1.35 TOPS and an image signal processor (ISP), the SOM provides accelerated machine learning capabilities for advanced applications. Its comprehensive connectivity options include 802.11ac Wi-Fi 5 and Bluetooth 5.2 wireless technologies, along with seamless cellular integration for expanded possibilities. The ultra-compact Digi SMTplus form-factor (30 x 30 mm) and industrial temperature ranges (-40 to +85 °C) ensure reliability in the harshest environments, making it an excellent choice for a wide variety of IoT applications.
“As the IoT landscape continues to evolve, Digi remains committed to delivering solutions that not only meet the demands of today but also anticipate the needs of tomorrow,” Burghart continued. “With Digi ConnectCore MP25, we’re empowering device developers with the ready-to-use edge intelligence, security features and other future-proof tools and technologies needed to drive forward-thinking innovation and deliver exceptional value to their customers.”
Built to handle the most demanding applications, Digi ConnectCore MP25 embodies a 10-year+ longevity program, ensuring sustained performance and reliability for extended product lifecycles. Additionally, its implementation of Time-Sensitive Networking (TSN) and support for up to 3 Gigabit Ethernet ports, complemented by PCIe Gen2, USB 3.0, and 3 x CAN-FD interfaces, underscores its versatility and adaptability. Backed by a 3-year warranty and global technical support, this SOM not only exceeds expectations but sets a new standard for innovation and reliability in the IoT landscape.
Visit Digi International at booth 4A-131 during Embedded World 2024, taking place from April 9 to 11, in Nuremberg, Germany.
For more information about Digi ConnectCore MP25, including a comprehensive list of features, please visit https://www.digi.com/connectcore-mp2.
About Digi International
Digi International (NASDAQ: DGII) is a leading global provider of IoT connectivity products, services, and solutions. It helps companies create next-generation connected products and deploy and manage critical communications infrastructures in demanding environments with high levels of security and reliability. Founded in 1985, Digi has helped customers connect more than 100 million things and counting. For more information, visit https://www.digi.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240404695178/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Lattice to Showcase Advanced Edge AI Solutions at the FPGA-forum 202628.1.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced its exhibition plan for the upcoming FPGA-forum 2026 taking place February 11 – 12, 2026 in Trondheim, Norway. As part of the event, Lattice Corporate Vice President of Software Solutions and Applications Engineering Eleena Ong will deliver a keynote presentation exploring how rapidly maturing AI technologies can turn FPGA platforms into innovation canvases for a much broader range of developers, sparking new application possibilities. Lattice will also deliver a technical presentation and host a demo showcase focused on how its low power FPGA solutions are advancing connectivity and edge AI applications. Who: Lattice Semiconductor What / When (GMT+1): Lattice Demo Showcase (Table #3), Feb 11-12 Keynote Feb. 11, 9:30 a.m. “Unlocking the Next Wave of FPGA Innovators with Generative and Agentic AI” Technical Presentation Feb. 12, 10 a.m. “Smaller. Cooler. Smarter: Lattice FPGAs’ Path to Uncompromised
Egon Zehnder Elects German Herrera as New Chair28.1.2026 20:01:00 CET | Press release
Herrera succeeds Michael Ensser, who will remain an active member of the Firm after his term in a planned transition. Egon Zehnder, the world’s premier leadership advisory firm, today announced that, in accordance with its established governance and three-year election cycle, German Herrera has been elected as the Firm’s next Chair by its worldwide partnership. Herrera will assume the role effective March 1, 2026. He will succeed Michael Ensser, who has held the position since 2022, in a planned succession at the conclusion of his regular term. Herrera joined the Firm in 1998 in Bogotá and has helped shape the Firm’s global presence, taking on a broad range of leadership roles, from co-leading the Global Family Business Advisory Practice to serving on the Executive Committee and the Market Council. Most recently, Herrera has guided Egon Zehnder’s U.S. market through a period of impressive growth and transformation, which today includes 15 offices and more than 150 consultants. As the f
De' Longhi Group - Record Preliminary 2025 Revenues of €3.8 Billion, up 10.4% at Constant Exchange Rates28.1.2026 19:25:00 CET | Press release
The Group closed 2025 with brilliant results and solid growth at constant currency across both divisions throughout the year, further confirmed by an organic expansion of 8.2% in Q4 Below are the preliminary 2025 revenues for the De’ Longhi S.p.A. Group: This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260128191504/en/12 months, revenues at € 3,801.5 million, growing at 8.7% (+10.4% at constant currency); fourth quarter, revenues at € 1,340.0 million, growing at 5.7% (+8.2% at constant currency). Fabio de' Longhi, CEO of the Group, stated: "The Group achieved solid growth at constant currency of 10.4% in 2025, characterized by consistent results throughout the year. We are particularly pleased with the excellent performance achieved in the fourth quarter, which successfully overcame the challenges posed by the current market environment. The household division consolidated its recent growth momentum during the quarter, with or
Organon Completes Divestiture of JADA® System to Laborie28.1.2026 18:45:00 CET | Press release
Organon (NYSE: OGN), a global healthcare company with a mission to deliver impactful medicines and solutions for a healthier every day, announced today the successful closing of the sale of its JADA® System to Laborie Medical Technologies Corp. Please see our prior announcement for a summary of the transaction terms. Indications for Use The JADA® System is intended to provide control and treatment of abnormal postpartum uterine bleeding or hemorrhage when conservative management is warranted. Contraindications Ongoing intrauterine pregnancy Untreated uterine rupture Unresolved uterine inversion Current cervical cancer Known uterine anomaly Current purulent infection of vagina, cervix, or uterus For C-sections: Cervix <3 cm dilated before use of JADA Warnings Avoid excessive force when inserting JADA into the uterus or trauma to uterine wall may occur, including perforation. The safety and effectiveness of the JADA System in delivery at a gestational age <34 weeks or, if multiples, uter
Laserfiche Expands AI Data Capture with Auto-Classification to Transform Data into Business Intelligence28.1.2026 16:00:00 CET | Press release
New intelligent features automatically organize and classify documents, transforming how organizations manage information at scale. Laserfiche — the leading SaaS provider of intelligent content management — today announced major enhancements to its AI-powered data extraction tool, Smart Fields. The update introduces automated document classification and tagging, allowing organizations to move from unstructured content to informed decisions in seconds. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260128228490/en/ Using natural language prompts instead of rigid, ruled-based OCR, Smart Fields can now identify document type — such as invoices, taxpayer identification forms, or student transcripts — and automatically apply the correct metadata template using AI. Users can also use Smart Fields to automatically add informational and security tags to files that meet certain criteria, defined using a natural language prompt. Users
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom