MN-DIGI-INTERNATIONAL
4.4.2024 15:01:34 CEST | Business Wire | Press release
Digi International (NASDAQ: DGII, www.digi.com), a leading global provider of Internet of Things (IoT) connectivity products and services, is poised to introduce the wireless and highly power-efficient Digi ConnectCore® MP25 system-on-module (SOM) at Embedded World 2024. Featuring AI and machine learning capabilities, with an integrated neural processing unit and image signal processor, Digi ConnectCore MP25 is designed for next-generation computer vision applications in critical sectors such as industrial, medical, energy and transportation. The module provides highly reliable wireless connectivity and time-sensitive networking (TSN) making it perfect for smart portable devices and Industry 4.0.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240404695178/en/
Digi International to unveil the new Digi ConnectCore® MP25 System-on-Module for next-gen computer vision applications at Embedded World 2024. Versatile, wireless and secure system-on-module based on the STMicroelectronics STM32MP25 processor improves efficiency, reduces costs and enables edge processing for innovative new devices. (Graphic: Business Wire)
Based on STMicroelectronics’ STM32MP25 MPU processor, Digi ConnectCore MP25 is engineered to streamline application development under demanding requirements to improve efficiency, reduce costs, boost innovation and improve end-customer satisfaction.
“The STM32MP25 MPU is an industrial-grade 64-bit MPU for secure Industry 4.0 and advanced edge computing applications that require high-end multimedia capabilities,” said Stéphane Henry, General-Purpose Microprocessors Division General Manager, STMicroelectronics. “Digi, a member of the ST Partner Program, is actively collaborating with STMicroelectronics. They integrated this high-performance processor into their family of Digi ConnectCore system-on-modules solutions as soon as it was available, and we are thrilled they are one of the first to release a module to the developer community. This extends their ConnectCore MP1 family available now with a higher performance option.”
“The introduction of Digi ConnectCore MP25 marks a pivotal moment in addressing the evolving needs of industries all over the world,” said Andreas Burghart, Senior Product Manager at Digi International. “With its robust design, vast connectivity options and innovative features including advanced security, the ConnectCore MP25 exemplifies our dedication to providing solutions that both simplify application development and enhance operational efficiency and customer satisfaction in an always-changing landscape.”
With an innovative architecture, Digi ConnectCore MP25 features two Cortex-A35 cores operating at 1.5GHz supplemented by a Cortex-M33 core and a Cortex-M0+. Enhanced with an AI/ML neural processing unit (NPU) delivering 1.35 TOPS and an image signal processor (ISP), the SOM provides accelerated machine learning capabilities for advanced applications. Its comprehensive connectivity options include 802.11ac Wi-Fi 5 and Bluetooth 5.2 wireless technologies, along with seamless cellular integration for expanded possibilities. The ultra-compact Digi SMTplus form-factor (30 x 30 mm) and industrial temperature ranges (-40 to +85 °C) ensure reliability in the harshest environments, making it an excellent choice for a wide variety of IoT applications.
“As the IoT landscape continues to evolve, Digi remains committed to delivering solutions that not only meet the demands of today but also anticipate the needs of tomorrow,” Burghart continued. “With Digi ConnectCore MP25, we’re empowering device developers with the ready-to-use edge intelligence, security features and other future-proof tools and technologies needed to drive forward-thinking innovation and deliver exceptional value to their customers.”
Built to handle the most demanding applications, Digi ConnectCore MP25 embodies a 10-year+ longevity program, ensuring sustained performance and reliability for extended product lifecycles. Additionally, its implementation of Time-Sensitive Networking (TSN) and support for up to 3 Gigabit Ethernet ports, complemented by PCIe Gen2, USB 3.0, and 3 x CAN-FD interfaces, underscores its versatility and adaptability. Backed by a 3-year warranty and global technical support, this SOM not only exceeds expectations but sets a new standard for innovation and reliability in the IoT landscape.
Visit Digi International at booth 4A-131 during Embedded World 2024, taking place from April 9 to 11, in Nuremberg, Germany.
For more information about Digi ConnectCore MP25, including a comprehensive list of features, please visit https://www.digi.com/connectcore-mp2.
About Digi International
Digi International (NASDAQ: DGII) is a leading global provider of IoT connectivity products, services, and solutions. It helps companies create next-generation connected products and deploy and manage critical communications infrastructures in demanding environments with high levels of security and reliability. Founded in 1985, Digi has helped customers connect more than 100 million things and counting. For more information, visit https://www.digi.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240404695178/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
SMBC and Toshiba Jointly Develop New Equity Indices Using Advanced Quantum-Driven Technologies28.5.2026 03:00:00 CEST | Press release
Sumitomo Mitsui Banking Corporation (“SMBC”) and Toshiba Corporation (“Toshiba”) today announced the joint development of the SMBC/TOSHIBA Quantum Driven Diversified Japan Equity Index and the SMBC/TOSHIBA Quantum Driven Diversified U.S. Equity Index, new equity indices realized with advanced quantum-driven technologies. Collectively, the indices are referred to as “SMBC/TOSHIBA Quantum Diversified” (the “Indices”). This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260519448161/en/ Toshiba’s Simulated Bifurcation Machine 1. Background and Objectives Equity investment is central to asset management, but it also carries the ever-present risk of abrupt and substantial market fluctuations driven by geopolitical developments, changes in economic policy, and other external factors. In uncertain markets, investors are constantly seeking innovations in risk diversification that can protect their assets from unexpected market shocks. SM
BeOne Medicines Announces Phase 3 HERIZON-GEA Data Published in NEJM and Presented at ASCO 202627.5.2026 23:00:00 CEST | Press release
TEVIMBRA plus ZIIHERA and chemotherapy demonstrated statistically significant overall survival benefit with an unprecedented seven-month improvement in first-line HER2+ GEAOral presentation at ASCO highlights benefit regardless of PD-L1 status, including in PD-L1 <1% BeOne Medicines Ltd. (Nasdaq: ONC; HKEX: 06160; SSE: 688235), a global oncology company, today announced that data from HERIZON-GEA-01 were published in The New England Journal of Medicine and will be presented in an oral presentation (Rapid Oral Abstract: 4010) at the American Society of Clinical Oncology (ASCO) Annual Meeting on June 1, 2026, in Chicago.The HERIZON-GEA-01 clinical trial evaluated ZIIHERA® (zanidatamab) plus chemotherapy, with and without TEVIMBRA® (tislelizumab), compared with the control arm of trastuzumab plus chemotherapy as first-line treatment for advanced/metastatic HER2+ gastroesophageal adenocarcinoma (GEA). Dr. Sun Young Rha, Professor of Medical Oncology at the Yonsei Cancer Center, Yonsei Univ
Stallergenes Greer Foundation Celebrates Excellence in Allergy Innovation With 2025 Awards27.5.2026 17:22:00 CEST | Press release
The Stallergenes Greer Foundation, dedicated to advancing allergy research, fostering innovation and addressing environmental factors which impact allergies, is delighted to announce the recipients of the 2025 edition of its prestigious Science Awards for Allergy. Building on the success of the previous edition, this year’s awards recognise outstanding contributions to allergy research and patient engagement and allocate a total of €100,000 to support these initiatives. Four researchers have been selected by the Board as award recipients, each receiving €25,000 across two categories: Innovation In Treatment Awards Assoc. Professor Alexander Eggel, PhD, Department for Biomedical Research, University of Bern, and Department of Rheumatology and Immunology, University Hospital Bern, Switzerland, recognised for his research: “Improving diagnostic and therapeutic options for allergic patients”; Dr Janice A. Layhadi, PhD, Research Associate, National Heart and Lung Institute, Imperial College
Capchase Secures $200M+, as Demand for Vendor Financing in Enterprise Tech Deals Accelerates27.5.2026 16:00:00 CEST | Press release
As buyers face tighter budgets, Capchase helps technology companies close more deals faster with AI-enabled instant financing Capchase, the leading vendor financing platform for enterprise tech, today announced $200M+ in incremental funding to scale its embedded financing infrastructure globally and deploy more AI-enabled features. The funding, a mix of debt warehouse facilities and equity backed by institutional investors, reflects market validation that vendor financing has become essential infrastructure for enterprise technology companies to sell hardware and software products. As global B2B buyers face tighter budgets and greater scrutiny over large, up-front purchases, financing demand is growing. The Market Shift: Financing as a Growth Lever for B2B Tech Companies The $1.3 trillion vendor financing market has been traditionally dominated by banks and other lenders that utilize multi-thread email chains to manual doc review for underwriting. Capchase replaces those bottlenecks wi
ClickHouse Tops $250M ARR and 4,000 Customers, Launches Claude-Powered Agents at Open House 202627.5.2026 15:00:00 CEST | Press release
Annual run-rate revenue more than tripled year-over-year; new CostBench benchmark shows ClickHouse Cloud at 23x better cost-performance than the nearest cloud data warehouse ClickHouse today opened Open House 2026, its second annual user conference, with a set of announcements that mark one of the company's most active quarters since founding. ClickHouse’s serverless cloud offering has crossed over $250 million in annual run-rate revenue — more than triple a year ago — and added more than 1,000 net new customers since January, bringing its total to 4,000. To meet the demands of AI-era workloads, the company also launched ClickHouse Agents, a fully managed agentic analytics service powered by Anthropic's Claude; published CostBench, an open benchmark comparing the major cloud data warehouses on cost-performance; and introduced House Mates, its first formal partner program. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260527
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom