VERISILICON
28.3.2024 01:01:35 CET | Business Wire | Press release
VeriSilicon (688521.SH) today announced its complete Bluetooth Low Energy (BLE) IP solution has achieved full compliance with LE Audio specification, including certifications for the LE Audio protocol stack and Low Complexity Communications Codec (LC3). This solution is applicable to mobile phones, Bluetooth earphones including True Wireless Stereo (TWS) earphones, speakers, and other extensive audio application scenarios. The declaration details can be accessed on Bluetooth SIG’s website by searching for its Qualified Design ID (QDID: 206187).
LE Audio is the new Bluetooth audio technology standard introduced by Bluetooth SIG based on Bluetooth 5.2 and above specifications, aiming to deliver a higher quality audio experience. VeriSilicon’s complete BLE IP solution includes RF IP, baseband IP, software protocol stack, and has already passed the Bluetooth 5.3 certification. This solution leverages BLE technology, offering lower power consumption, and employs Isochronous Channels transmission technology for lower audio transmission latency and improved signal quality. Moreover, the solution also supports innovative Bluetooth capabilities of LE Audio such as Auracast™ broadcast audio and Multi-Stream Audio.
VeriSilicon’s complete BLE IP solution integrates its self-developed LC3 to deliver real-time, low-power, and low-distortion audio processing. It supports various calculation precisions including 16-bit, 32-bit fixed-point processing, and 32-bit floating-point processing, while also accommodating all audio profiles of LE Audio, thus catering to diverse application scenarios. It has been deeply optimized for VeriSilicon’s ZSP Digital Signal Processor (DSP) and mainstream processors like Arm Cortex-M and RISC-V, minimizing memory and CPU resource usage, and can be easily ported to other MCUs and DSPs. VeriSilicon’s LC3 can be licensed independently for flexible integration. When seamlessly integrated with VeriSilicon’s BLE controller and protocol stack, it can also provide customers with a complete LE Audio hardware and software solution, streamlining the development process for high-performance audio products.
“Through years of dedicated work in Bluetooth technology, we have developed hardware reference designs and application software solutions tailored to different market demands based on our proprietary IPs and IoT embedded software platforms. Obtaining full LE Audio certification will further empower our customers to develop next-generation audio products more efficiently with reduced power consumption and costs, thus expediting product launches,” said Wiseway Wang, Senior Vice President and General Manager of Custom Silicon Platform Division at VeriSilicon. “Moving forward, VeriSilicon will explore new LE Audio application scenarios, bringing more comprehensive solutions to customers. We also look forward to seeing our customers launch more innovative LE Audio products by leveraging VeriSilicon’s solutions to jointly propel the advancement of Bluetooth audio technology and market.”
About VeriSilicon
VeriSilicon is committed to providing customers with platform-based, all-around, one-stop custom silicon services and semiconductor IP licensing services leveraging its in-house semiconductor IP. For more information, please visit: www.verisilicon.com
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240325961067/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Americhem Expands Aircraft Interior Portfolio with PFAS-Free Thermoplastic Platform Meeting 55/55 OSU, Low Smoke, and Low Toxicity Requirements4.3.2026 13:00:00 CET | Press release
Americhem is expanding its aircraft interior materials portfolio with ColorFast® SFT5500, a PFAS-free high-performance thermoplastic engineered to meet FAA 14 CFR 25.853, Appendix F, Part IV, 55/55 OSU heat release requirements while delivering low smoke and low toxicity characteristics for aircraft interior applications. PFAS-free thermoplastic systems capable of achieving 55/55 OSU performance while maintaining low smoke and low toxicity characteristics remain limited in the aerospace market. ColorFast® SFT5500 addresses this need with demonstrated 55/55 OSU heat release performance, low smoke emission characteristics, and low flaming-mode toxicity performance in a high-performance thermoplastic platform designed specifically for injection-molded interior components. Aircraft interior thermoplastics must meet stringent fire standards while maintaining durability, thermal stability, and process consistency. As legacy fluorinated material systems face increasing regulatory scrutiny, ma
NETSCOUT Reveals Qualitative Shifts in DDoS Attack Sophistication, Infrastructure Capacity, and Threat Actor Capabilities4.3.2026 12:05:00 CET | Press release
AI Adoption, coordinated botnets, and persistent hacktivists groups drove millions of attacks NETSCOUT® SYSTEMS, INC. (NASDAQ: NTCT), today released its second half of the year 2025 Distributed Denial-of-Service (DDoS) Threat Intelligence Report, revealing sophisticated attacker collaboration, resilient botnets, and compromised IoT infrastructure that drove more than eight million DDoS attacks worldwide – some as large as 30 terabits per second (Tbps) – marking a new era of hyper-scale, coordinated threat activity that continues to outpace global takedown efforts. Meanwhile, the accelerating growth of DDoS-for-hire services is empowering a broader range of threat actors, intensifying operational risk to digitally connected organizations and enterprises. Implications for security professionals extend far beyond volumetric concerns and include reconnaissance and adaptive evasion which challenge traditional defense paradigms. Organizations must match adversarial innovation with intelligen
WHOOP Announces 2026 Hiring Surge, Adding More Than 600 Roles as It Scales Wearable Health Platform Globally4.3.2026 12:00:00 CET | Press release
Expansion Signals Acceleration in AI, Clinical Innovation, and International Growth WHOOP, the human performance company, today announced plans to add more than 600 new roles across Software, Research & Design, Hardware, Product, and Marketing as the company continues to scale globally. The hiring expansion reflects a clear strategic priority: bolstering a team that will define the future of human performance and health technology. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260304866977/en/ WHOOP Announces 2026 Hiring Surge, Adding More Than 600 Roles as It Scales Wearable Health Platform Globally “Right now, companies are debating whether to hire more people or just invest in AI,” said Will Ahmed, Founder and CEO of WHOOP. “We are doing both. We are doubling down on exceptional talent and doubling down on world-class AI tools because the combination is what wins. Health monitoring is becoming one of the most important p
Radian Arc, VNPT and Blacknut Launch GPU Infrastructure in Vietnam, Enabling Cloud Gaming and AI Services4.3.2026 11:00:00 CET | Press release
Radian Arc, part of inferX, Submer’s AI cloud and GPU infrastructure platform has partnered with VNPT, and COMIT, to launch Cloud Gaming powered by Radian Arc’s GPU Edge Platform and Blacknut’s global cloud gaming service. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260303986657/en/ Radian Arc, VNPT and Blacknut Launch GPU infrastructure in Vietnam, enabling cloud gaming and AI services This deployment expands Radian Arc and Blacknut’s global cloud gaming partnership into the Vietnam market with VNPT and lays the foundation for future AI-native services and sovereign infrastructure together with COMIT. The deployment represents a commercial proof point of Radian Arc’s carrier-embedded GPU model, combining monetizable consumer services today with scalable AI infrastructure that can support sovereign AI workloads. “With VNPT’s market reach and Blacknut’s premium gaming catalog we’re bringing the next generation of interacti
Hermes Reply Partners with Lavazza to Develop a New Digital and Efficient Manufacturing Model4.3.2026 10:45:00 CET | Press release
An integrated, data-driven platform powered by AI and Computer Vision to enhance quality, efficiency and traceability across production processes Hermes Reply, the Reply Group company specialising in digital transformation for manufacturing and supply chain, has partnered with Lavazza Group in the design and implementation of a new digital and efficient manufacturing model, aimed at strengthening operational capabilities, ensuring high quality standards and supporting the company’s industrial development strategy. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260304639969/en/ Artificial Intelligence and Computer Vision technologies play a key role in making quality controls and production process analysis along packaging lines more intelligent and flexible. Through advanced image analysis and anomaly detection systems, overall process quality becomes more efficient and adaptable. The initiative, entitled “A new digital and
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
