DAI-NIPPON-PRINTING
27.3.2024 01:24:32 CET | Business Wire | Press release
Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has begun development of a photomask manufacturing for 2-nanometer (10-9 meter) generation logic semiconductors that support Extreme Ultra-Violet (EUV) lithography, the cutting-edge process for semiconductor manufacturing.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240319148117/en/
Image of EUV lithography with pellicle, a protective film for the photomask (Photo: Business Wire)
DNP will also act as a subcontractor and provide the newly developed technology to Tokyo-based Rapidus Corporation (Rapidus). Rapidus is participating in the Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems instigated by the New Energy and Industrial Technology Development Organization (NEDO).
[Background]
We have strengthened our ability to manufacture cutting-edge semiconductors with high productivity and quality. And in 2016, DNP was the world's first merchant photomask manufacturer to introduce the multi-beam mask writing tool (MBMW).
In 2023, we completed the development of a photomask manufacturing process for 3-nm generation EUV lithography, and commenced development of 2-nm generation technology. In response to the need for further miniaturization, we will begin full-scale development of a photomask manufacturing process for 2-nm generation EUV lithography, including the operation of second and third multi-electron beam mask lithography systems in FY 2024.
DNP plans to bring online its second and third MBMW mask lithography systems in FY 2024, accelerating the development of photomasks for 2-nm generation EUV lithography.
DNP will act as a subcontractor on Development of Advanced Semiconductor Manufacturing Technology (Commissioned) by Rapidus as part of the NEDO’s previously mentioned R&D project.
[Going Forward]
By FY 2025, DNP will complete the development of a manufacturing process for photomasks for 2-nm generation logic semiconductors that support EUV lithography. From FY 2026 onwards, we will push ahead with the establishment of production technology with a view to commencing mass production in FY 2027.
We have also begun development with an eye toward the 2-nm generation and beyond, and have signed an agreement with imec, a cutting-edge international research organization headquartered in Leuven, Belgium, to jointly develop next-generation EUV photomasks. DNP will continue to contribute to the growth of Japan's semiconductor industry by promoting development in collaboration with various partners within the framework of the international semiconductor industry.
About DNP
DNP was established in 1876, and has become a leading global company that leverages print-based solutions to engineer fresh business opportunities while protecting the environment and creating a more vibrant world for all. We capitalize on core competencies in microfabrication and precision coating technology to provide products for the display, electronic device, and optical film markets. We have also developed new products, such as vapor chamber and reflect array that offer next-generation communication solutions for more people-friendly information society.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240319148117/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Access Advance Welcomes Meta Platforms, Inc. and Alibaba Group to the Video Distribution Patent Pool3.7.2026 01:00:00 CEST | Press release
Access Advance LLC today announced that Meta Platforms, Inc., one of the world's largest distributors of video content across its Facebook, Instagram, Threads, and WhatsApp services, has joined the Video Distribution Patent Pool (VDP Pool) as a Licensee. Meta also joined both the HEVC Advance and VVC Advance pools as a Licensee. Alibaba Group, whose video infrastructure spans a wide range of video-based services across e-commerce, entertainment, and digital media platforms, was also announced as a VDP Pool Licensee this week. Meta and Alibaba joining the VDP Pool further reinforces the program’s market leading position in resolving the licensing issues around the use of modern video codecs, including VP9, AV1, HEVC and VVC, across all the diverse business models of internet video streaming. "A significant U.S.-based company like Meta joining as a Licensee is a milestone moment for the content distribution business and the VDP Pool," said Peter Moller, CEO of Access Advance. "Meta reach
Kioxia Commences Sample Shipments of 10th-Generation BiCS FLASH™ Devices Delivering High Performance, High Capacity and Low Power Consumption3.7.2026 01:00:00 CEST | Press release
Production planned at Fab2 of Kitakami Plant Kioxia Corporation, a world leader in memory solutions, today announced that it has commenced sample shipments of 1Tb (terabit) Triple-Level-Cell (TLC) memory devices utilizing its 10th-generation BiCS FLASH™ 3D flash memory technology.1 These will be primarily integrated into the company’s enterprise and data center SSDs, strengthening Kioxia’s lineup to meet the growing demand for AI storage, which requires higher performance, higher capacity, and lower power consumption. These new products will be manufactured using state-of-the-art equipment at Kioxia’s Kitakami Plant Fab2 facility in Iwate Prefecture, Japan. By leveraging innovative CMOS directly Bonded to Array (CBA) technology2 and On-Pitch Select Gate Drain (OPS) technology,3 both adopted since the 8th-generation BiCS FLASH™, the 10th-generation technology achieves a NAND interface speed of 4.8 Gb/s,4 a 33% improvement over the 8th generation. Bit density has increased by 59% by stac
Bending Spoons S.p.A. announces closing of initial public offering2.7.2026 20:35:00 CEST | Press release
Bending Spoons S.p.A. (“Bending Spoons”), a leading technology company, today announces the closing of its initial public offering of an aggregate of 57,971,015 of its ordinary shares, at an initial public offering price of $29.00 per share. The offering consisted of 34,398,640 shares sold by Bending Spoons and 23,572,375 shares sold by certain selling shareholders (the “Selling Shareholders”). The gross proceeds from the offering to Bending Spoons, before deducting underwriting discounts and commissions and other offering expenses, was approximately $953,917,285.50. Bending Spoons did not receive any proceeds from the sale of shares by the Selling Shareholders. Bending Spoons’ ordinary shares began trading on the Nasdaq Global Select Market on July 1, 2026 under the ticker symbol “BSP”. Goldman Sachs International, J.P. Morgan, and Allen & Company LLC are acting as joint lead book-running managers for the offering. Wells Fargo Securities, BofA Securities, Jefferies, Evercore ISI, BNP
Strategic Partnership Between Record Asset Management and Admicasa2.7.2026 19:00:00 CEST | Press release
RAM Swiss Holding AG announces a strategic partnership with Admicasa Holding AG (Admicasa). RAM Swiss Holding AG is a subsidiary of LSE-listed Record Financial Group (Record) and part of the Record Asset Management (RAM) group of companies. The partnership is a milestone in the growth of Admicasa and marks an important step in the continued expansion of Record’s private markets platform. Subject to regulatory approval, the agreement, signed on 1st July 2026, provides RAM Swiss Holding AG with a 50% participation in the Admicasa Fondsleitung AG, part of Admicasa, and establishes a long-term partnership to develop investment opportunities in the Swiss and Global real estate market with a plan to expand into other asset classes in the medium term. RAM is the European asset management arm of Record, the LSE-listed specialist investment group managing USD 115 billion of assets on behalf of institutional clients worldwide. Record's client base comprises pension funds, foundations, sovereign
IQM Quantum Computers Becomes First European Quantum Computing Company Listed on a Major U.S. Exchange2.7.2026 16:47:00 CEST | Press release
IQM begins trading on Nasdaq Global Select Market under the ticker symbol “IQMX” Company enters next phase of growth as a publicly traded leader in full-stack superconducting quantum computing IQM maintains a strong pro forma cash position of EUR 337 million IQM Quantum Computers (Nasdaq: IQMX) (“IQM”, “IQM Quantum Computers” or the “Company”), a global leader in full-stack superconducting quantum computers, today became a publicly traded company following the completion of its business combination with Real Asset Acquisition Corp. (“RAAQ”). This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702960460/en/ IQM Quantum Computers Becomes First European Quantum Computing Company Listed on a Major U.S. Exchange The company’s American Depositary Shares begin trading today on the Nasdaq Global Select Market under the ticker symbol “IQMX”. The listing marks a major milestone for IQM establishing the company as the first European quan
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
