VERISILICON
14.3.2024 01:01:27 CET | Business Wire | Press release
VeriSilicon (688521.SH) today announced the integration of its Image Signal Processor (ISP) IP ISP8000, DeWarp Processor IP DW200, and 2.5D Graphics Processor Unit (GPU) IP GCNanoV into Canaan’s K230 chip, the world’s first commercial mass production edge AIoT chip supporting the RISC-V Vector 1.0 standard. This collaboration marks a significant advancement in the high-precision, low-latency edge AIoT solutions for a wide range of intelligent products, such as large-model and multimodal input edge terminals, 3D-structured light perception modules, interactive robots, open-source hardwares, as well as hardwares for smart manufacturing, smart home solutions and AI education.
VeriSilicon’s ISP8000 IP is capable of real-time processing of three or more streams of high-definition video. Its 20-bit depth pipeline architecture supports advanced image processing algorithms such as triple-exposure High Dynamic Range (HDR) and 3D Noise Reduction (3DNR). ISP8000’s optimized software collaborates seamlessly with the RISC-V processors to efficiently manage and schedule system resources. On the K230 chip, leveraging the RT-Thread real-time operating system and the performance and power advantages of the RISC-V processors, ISP8000 can perform real-time scheduling and efficiently run software under a dual-core processor architecture. It is perfectly compatible with the K230 Software Development Kit (SDK), supporting RTOS and Linux dual operating systems, achieving an optimal balance between real-time and non-real-time operations.
VeriSilicon’s DW200 IP not only precisely corrects distortions in wide-angle or fisheye lens, but also supports multi-channel downscaling output through low-bandwidth direct link mode, enriching user application scenarios, and is particularly suited for AI applications with diverse spatial output requirements. For MCU/MPU devices, VeriSilicon’s low-power 2.5D GPU IP delivers high-performance and high-quality vector graphics processing capabilities along with superior image output.
Hong-Gang Wang, VP of research and development at Canaan said, “Leveraging VeriSilicon’s advanced pixel processing IP portfolio, our RISC-V based K230 achieved leading performance and image quality compared with other edge AIoT SoCs in its class. This enables more edge device vendors to develop innovative products with broader market applications. VeriSilicon’s ISP is one of the key factors driving innovation in our edge AIoT SoCs.”
“RISC-V is increasingly important in embedded products. We have partnered with all leading RISC-V CPU IP vendors to ensure our comprehensive Glass-to-Glass (from camera-in to display-out) intelligent pixel processing IP portfolio collaborates seamlessly and efficiently with RISC-V architectures,” said Wei-Jin Dai, Executive VP and GM of IP Division at VeriSilicon. “Through our close collaboration with Canaan, the edge AIoT SoC K230 has achieved high image quality while maintaining low power consumption and latency. Moreover, K230 can support multiple sensors leveraging the advanced Multi-Context Management (MCM) feature of ISP8000, further enhancing its market competitiveness.”
About Canaan Inc.
Canaan Inc. (Nasdaq: CAN) is a leading provider of high-performance ASIC chips. With a diversified strategy centered on “blockchain + AI”, Canaan is dedicated to the research and development of high-performance ASIC computing chips, AI chips, and devices. As a Nasdaq-listed company, Canaan holds the distinction of being the world’s “first blockchain stock company” and the initial Chinese firm with independent intellectual property in AI chips to be listed in the US. Canaan is committed to harnessing ASIC technology to achieve its mission of “Super Computing Is What We Do, Social Enrichment is Why We Do”, positioning itself as a leader in high-performance computing for blockchain and AI.
For more information, please visit: canaan.io
About VeriSilicon
VeriSilicon is committed to providing customers with platform-based, all-around, one-stop custom silicon services and semiconductor IP licensing services leveraging its in-house semiconductor IP. For more information, please visit: www.verisilicon.com
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240313405660/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
IFF to Webcast Fireside Chat at Barclays Global Consumer Conference on Sept. 1018.8.2026 22:15:00 CEST | Press release
IFF (NYSE: IFF) today announced that Chief Executive Officer Erik Fyrwald will participate in a fireside chat at the Barclays Global Consumer Conference on Thursday, Sept. 10, 2026 at 945 a.m. ET. Investors may access the live webcast on the Company's website at ir.iff.com. For those unable to listen to the live webcast, a recorded version will be made available for replay. Welcome to IFF At IFF (NYSE: IFF), we make joy through science, creativity and heart. As the global leader in flavors, fragrances, and health and biosciences, we deliver groundbreaking, sustainable innovations that elevate everyday products—advancing wellness, delighting the senses and enhancing the human experience.Learn more at iff.com, LinkedIn, Instagram and Facebook. View source version on businesswire.com: https://www.businesswire.com/news/home/20260818490253/en/
Lehman Brothers Treasury Announces the Successful Sale of its Remaining Intercompany Claim against Lehman Brothers Holdings Inc.18.8.2026 21:15:00 CEST | Press release
In connection with its previously announced final wind-down, Lehman Brothers Treasury Co. B.V. in liquidation (“LBT”), through its U.S. counsel Herbert Smith Freehills Kramer (US) LLP, announced that its placement agent, Seaport Loan Products LLC, successfully closed the sale of LBT’s remaining $19.6 billion Class 4A intercompany claim against Lehman Brothers Holdings Inc. The net proceeds of the sale, together with certain available cash (but after deducting various sale-related and other administrative costs and expenses), will be used to fund a final distribution to the holders of LBT’s existing notes, after which such existing notes will be canceled and LBT shall be fully wound down. As a result, LBT will cease to exist. LBT expects the final distribution to occur in the course of October 2026 and the wind down to have been completed before the end of 2026. View source version on businesswire.com: https://www.businesswire.com/news/home/20260818004215/en/
GenBio AI Builds First World Model of the Human Cell18.8.2026 15:00:00 CEST | Press release
First-of-its-kind system simulates human cell behavior across the full biological hierarchy, from DNA and RNA through protein to the whole-cell level GenBio AI ('GenBio') is an AI for Science company co-founded by Nobel Laureate David Baker, leading AI scientist Eric Xing, and other prominent life science and artificial intelligence researchers from Stanford, Carnegie Mellon University, Mohamed Bin Zayed University of Artificial Intelligence, Harvard, Weizmann Institute, and other research institutions. Today, the company introduced AIDO Cell, its virtual cell world model — the first system capable of simulating a human cell, both in its natural state and in response to drugs and other interventions, across its full biological hierarchy, from DNA and RNA through protein to the whole-cell level. A Key First in Biological and Medical Sciences: Full-hierarchy virtual cell simulation has been widely identified as a key milestone in computational biology. Compared to the previous efforts by
Xsolla Partner Network Expands Verified Creator Partnerships and Unifies Campaign Management Ahead of gamescom 202618.8.2026 15:00:00 CEST | Press release
Developers Gain Vetted Creator Partnerships And A Single Campaign Workflow, Managed From The Publisher Account They Already Use Xsolla, a global video game commerce company, today announced an expansion of the Xsolla Partner Network ahead of gamescom 2026 in Cologne, giving game developers a simpler, more reliable way to grow their games through creators. The creator platform now lives within Xsolla Publisher Account, where developers already run their business, with verified creator onboarding and a redesigned and unified campaign workflow. Flat-fee campaigns, a new guaranteed payment option alongside revenue share, and data-driven creator recommendations are coming soon. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260818140062/en/ Graphic: Xsolla Xsolla Partner Network gives developers one place to launch, manage, track, and report on creator campaigns while Xsolla handles payments, payouts, taxes, and compliance.Verifi
KOCCA to Showcase 13 Korean Game Companies at ‘Gamescom 2026’ with PC, Mobile, and VR Lineups18.8.2026 14:48:00 CEST | Press release
- Featuring a diverse lineup of roguelike deckbuilders, AI-powered rhythm education, and cooperative horror games - Ranging from new titles based on the popular animated IP ‘LARVA’ to real-time K-POP dance coaching content - Hands-on experience available August 26–28 at the Korea Joint Pavilion B2B Hall, Koelnmesse, Booth Hall 3.2 C-050g–D051g The Korea Creative Content Agency (KOCCA) announced that 13 Korean game companies will gather under one roof at Gamescom 2026, Europe’s largest game show, held in Cologne, Germany, from August 26 to 28 (B2B, 09:00~20:00). Located in Booth Hall 3.2 C-050g–D051g, the Korea Joint Pavilion offers visitors hands-on experiences with an expansive lineup of titles, ranging from PC and mobile games to VR-powered titles across diverse genres. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260818271881/en/ KOCCA will bring 13 Korean game companies to Gamescom 2026 in Cologne, Germany (Image: KOCC
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
