CA-ALPHAWAVE-SEMI
Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute solutions for the world’s technology infrastructure, today announced the successful bring-up of its first chiplet-connectivity silicon platform on TSMC’s most advanced 3nm process. This new silicon-proven Universal Chiplet Interconnect Express (UCIeTM) subsystem expands Alphawave Semi’s portfolio and leadership in connectivity silicon. It paves the way for a robust, open chiplet ecosystem that accelerates connectivity and compute for high-performance AI systems. An industry-first live demo of Alphawave Semi’s 24Gbps UCIe silicon platform on the TSMC 3nm process was recently unveiled at the Chiplet Summit in Santa Clara, CA.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240311461384/en/
Alphawave Semi 24Gbps UCIe 3nm silicon platform (Graphic: Business Wire)
Alphawave Semi’s 3nm UCIe complete PHY + Controller subsystem is capable of 24Gbps data rates, delivering high bandwidth density at extremely low power and low latency. The solution is compliant with the latest UCIe Revision 1.1 Specification and includes a highly configurable Die-to-Die D2D controller that supports streaming, PCIe®/CXLTM, AXI-4, AXI-S, CXS, and CHI protocols. The subsystem features Bit Error Rate (BER) Health Monitoring to ensure reliable operation. The PHY can be configured to support TSMC’s advanced packaging technologies such as Chip-on-Wafer-on-Substrate (CoWoS®) and Integrated Fan-Out (InFO) which maximize signal densities, as well as organic substrates for a more cost-effective solution.
“We’re pleased with the results of our latest collaboration with Alphawave Semi in the delivery of a silicon-proven chiplet-connectivity solution on TSMC’s 3nm process,” said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. “We will continue to work with our Open Innovation Platform® (OIP) partners like Alphawave Semi to help foster a robust and open chiplet ecosystem for high-performance connectivity and compute silicon solutions to enable more AI applications.”
“Achieving 3nm silicon-proven status for our 24Gbps UCIe subsystem is a key milestone for Alphawave Semi, as it is an essential piece of our chiplet connectivity platform tailored for hyperscaler and data-infrastructure applications,” said Letizia Giuliana, VP IP Product Marketing at Alphawave Semi. “We are thankful to our TSMC team for their outstanding support, and we look forward to accelerating our mutual customers' high-performance chiplet-based designs on TSMC's leading-edge 3nm process.”
For more information, visit http://awavesemi.com.
Customers can benefit from Alphawave Semi’s application-optimized IP subsystems and advanced 2.5D/3D packaging expertise through the integration of advanced interfaces such as UCIe, PCIe, CXL, Multi-Standard-Serdes, and HBM onto custom chips and chiplets.
About Alphawave Semi
Alphawave Semi is a global leader in high-speed connectivity and compute silicon for the world's technology infrastructure. Faced with the exponential growth of data, Alphawave Semi's technology services a critical need: enabling data to travel faster, more reliably, and with higher performance at lower power. We are a vertically integrated semiconductor company, and our IP, custom silicon, and connectivity products are deployed by global tier-one customers in data centers, compute, networking, AI, 5G, autonomous vehicles, and storage. Founded in 2017 by an expert technical team with a proven track record in licensing semiconductor IP, our mission is to accelerate the critical data infrastructure at the heart of our digital world. To find out more about Alphawave Semi, visit: awavesemi.com.
Alphawave Semi and the Alphawave Semi logo are trademarks of Alphawave IP Group plc. All rights reserved.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240311461384/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
SPIE Announces the Best New Products in the Photonics Industry at Its 18th Annual Prism Awards22.1.2026 17:44:00 CET | Press release
The industry-focused awards recognized innovations in areas such as lasers, quantum tech, sensors, optical materials and components, and XR tech On 21 January, SPIE, the international society for optics and photonics, recognized the top-rated new optics and photonics products with the industry-focused Prism Awards. The gala evening, held during SPIE Photonics West, marked the Prism Awards’ 18th year of honoring companies that are bringing transformative products to market. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260122875759/en/ Each year, the SPIE Prism Awards reflect the rapidly growing trajectory, exciting latest developments, and rich technical innovations across photonics and photonics-enabled industries. Each year, the SPIE Prism Awards reflect the rapidly growing trajectory, exciting latest developments, and rich technical innovations across photonics and photonics-enabled industries. This year, the annual cere
Fabasoft Positioned as a Challenger in the 2026 Gartner® Magic Quadrant™ for Quality Management System Software22.1.2026 17:15:00 CET | Press release
Analyst firm publishes overview of providers of quality management software Fabasoft, a leading European cloud vendor for document and business process management, has been positioned as a Challenger with its Fabasoft Approve product by Gartner® in its first Magic Quadrant™ 2026 for Quality Management System Software. In the report, the analyst firm recognizes the company’s strengths and cautions. “Gartner defines the market for quality management system (QMS/eQMS) software as stand-alone digital solutions with embedded emerging technological capabilities that enable organizations to systematically manage, monitor and improve the quality of their products, processes and services.” In its independent report, the IT analyst firm evaluated 12 different vendors based on 15 weighted criteria. “We are delighted that Gartner has positioned our QMS as a Challenger. We see this as confirmation of our strategic direction and our technological innovations, particularly in the field of AI. At the
ClickHouse Announces Native Postgres Service, Offering a Unified Data Stack for Real-Time and AI-Driven Applications22.1.2026 17:00:00 CET | Press release
ClickHouse, Inc., the company behind the world’s fastest real-time analytical database, announced a high-performance, enterprise-grade Postgres service natively integrated with ClickHouse, delivering a unified data stack for developers building modern, real-time and AI-driven applications. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260122173204/en/ ClickHouse Co-Founders (left to right): Yury Izrailevsky, Aaron Katz, Alexey Milovidov The service is built in partnership with Ubicloud, Inc., an open-source cloud company delivering high-performance Postgres, led by a team with proven track record at Citus Data, Heroku, and Microsoft. This launch reinforces ClickHouse’s commitment to unifying transactional and analytical workloads on a single, scalable foundation. This announcement also builds on ClickHouse’s acquisition of PeerDB Inc. in 2024, a Postgres company whose technology is helping power real-time data synchronizati
World Governments Summit 2026 to Include Largest International Participation Yet22.1.2026 16:59:00 CET | Press release
WGS 2026 Hosts High Level Investment Forum Latin America & Caribbean, and World Laureates Summit's Global First The 2026 edition of the World Governments Summit (WGS) will host the largest ever international participation since its inception and convene several landmark forums, underlining its rising global stature and significance. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260122197654/en/ The 2026 edition of the World Governments Summit is set to welcome the largest-ever international participation in the Summit's history, including 35+ heads of state and 150+ governments, as well as landmark forums, such as the World Laureates Summit, that are marking their global debut (Photo: AETOSWire) The roster of world-leading corporations and knowledge institutions at the global forum includes the International Monetary Fund (IMF), International Finance Corporation (IFC), a member of The World Bank, as well as more than 35 hea
Tageos and Wiliot Partner to Accelerate Ambient IoT, Battery-Free BLE Sensing22.1.2026 16:07:00 CET | Press release
Strategic partnership unlocks latest advancements from Tageos’ Innovation Center of Excellence, starting with the battery-free EOS-654 BLE G3 inlay for Wiliot’s Gen3 IoT Pixel sensor and the Wiliot Intelligence Platform Tageos, a global leader in RFID and wireless IoT inlays and tags, today announced a strategic partnership with ambient IoT pioneer Wiliot. The first outcome of this collaboration is the launch of a new passive Bluetooth® Low Energy (BLE) inlay, the EOS-654 BLE G3. In response growing demand for real-time location and condition monitoring across retail and logistics supply chains, this inlay was developed to support large-scale deployment of Wiliot’s Gen3 IoT Pixel sensor and the Wiliot Intelligence Platform. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260122940104/en/ The new EOS-654 BLE G3 features a dual-band architecture operating at 2.4 GHz and sub-1 GHz. This inlay design enables longer-range energizi
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom