REPLY
6.3.2024 09:31:32 CET | Business Wire | Press release
Concept Reply, a leader in IoT solutions in the Reply network announces the launch of a groundbreaking AI-driven innovation poised to transform the safety and efficiency of autonomous vehicles, in collaboration with Intel. Drawing on their collective expertise, this advanced AI solution enables precise traffic light detection, bolstering road safety in urban environments.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240306685754/en/
By harnessing the power of machine learning, Intel Habana Gaudi processors, and AWS, Concept Reply created an advanced AI-based solution that allows autonomous vehicles to accurately detect traffic lights, improving road safety in urban areas. (Photo: Business Wire)
At the core of this solution lies CARLA, a sophisticated platform designed to simulate complex car sensor functionalities, including GPS, LIDAR, and accelerometers. CARLA facilitates precise simulations of various driving scenarios, such as nighttime driving and diverse weather conditions. This innovative approach allowed to fine-tune the algorithms and elevate the precision of the solution.
Ensuring the reliability and precision of CARLA's robust capabilities demands extensive machine learning training. Traditionally, GPUs have been the preferred choice for this task. However, in light of the current shortage of GPUs, Concept Reply pursued innovative alternatives. In this pursuit, Intel emerged as the perfect choice.
Intel stands as a prominent industry leader, shaping groundbreaking hardware, software, and service technologies. They specialize in embedding intelligence and AI across the entire spectrum of computing devices, from the cloud to the edge, thus unlocking the full potential of data.
This is what drew Concept Reply to Intel, in addition to the expert collaboration and perseverance to accomplish this goal. The result delivered a powerful solution that seamlessly integrates with cloud instances, optimized by Intel. This cutting-edge platform possesses the flexibility to dynamically scale, effortlessly accommodating varying numbers of vehicles during peak hours while efficiently conserving resources during quieter times and running with sustainable computing in mind.
By pioneering this AI-driven solution in collaboration with Intel, Concept Reply aims to set new benchmarks in autonomous vehicle safety. Beyond its application in self-driving cars, this solution also extends its benefits to individuals with color blindness or color vision deficiencies (CVD), contributing to safer roads for everyone.
To learn more about this groundbreaking solution, click here.
Reply
Reply [EXM, STAR: REY] specialises in the design and implementation of solutions based on new communication channels and digital media. As a network of highly specialised companies, Reply defines and develops business models enabled by the new models of AI, big data, cloud computing, digital media and the internet of things. Reply delivers consulting, system integration and digital services to organisations across the telecom and media; industry and services; banking and insurance; and public sectors. www.reply.com
Concept Reply
Concept Reply specializes in the research, development, and validation of innovative solutions in the IoT (Internet of Things) field, with a focus on automotive, manufacturing, and smart infrastructure sectors. Today, we are recognized as a center of expertise and excellence in Testing and Quality Assurance and include a Business Unit that specializes in this service. Thanks to our laboratories and to an international team of professionals specializing in the QA and Validation fields, we are able to offer companies end-to-end support for the validation of products and services, while also optimizing costs and time-to-market. www.concept.reply.com
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240306685754/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom