10X1000-TECH
5.3.2024 14:28:31 CET | Business Wire | Press release
The Global Digital Talent Community 10x1000 Tech for Inclusion (“10x1000”) and FINOLAB, a Tokyo-based fintech office and business community, have entered into a collaborative effort to enhance digital capacity and drive digital economic growth.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240305260615/en/
The Global Digital Talent Community 10x1000 Tech for Inclusion (“10x1000”) and FINOLAB have entered into a collaborative effort to enhance digital capacity and drive digital economic growth. (Photo: Business Wire)
Pursuant to a signed Memorandum of Understanding (MoU), FINOLAB will collaborate with 10x1000 to identify and invite qualified participants through its network of member institutions, partners, affiliates, and other stakeholders to participate in the learning programs provided by 10x1000. Participants will be afforded the opportunity to serve as both learners and industry experts.
Additionally, the two organizations will work together to develop learning content that highlights and promotes the digital landscape and opportunities in Japan and drive knowledge sharing through their respective networks.
The MoU was signed by Jennifer Tan, Program Head for 10x1000 Tech for Inclusion, and Makoto Shibata, Head of FINOLAB and Chief Community Officer at FINOLAB. The signing ceremony was witnessed by Sopnendu Mohanty, Chief Fintech Officer at the Monetary Authority of Singapore, Leiming Chen, Chief Sustainability Officer of Ant International and Senior Vice President at Ant Group, and Chie Ito, Chief Executive Officer of FINOLAB.
“We are honored to join hands with FINOLAB to extend the network of 10x1000 in terms of both learners and lecturers, which will benefit the community profoundly. This collaboration marks a pivotal moment in our journey towards cultivating a vibrant and inclusive talent development ecosystem, where innovation knows no boundaries,” said Ms. Tan.
“Our members would benefit immensely from the knowledge accumulation of 10x1000 and we may also be able to contribute our experiences in Japan to the 10x1000 community members. The collaboration would be an appropriate opportunity for all of us to appreciate the true value of open innovation,” commented Mr. Shibata.
By the year 2023, 10x1000 has certified a total of 6,243 learners from over 100 countries and regions. The Philippines, Indonesia, Thailand, Bangladesh, and Nigeria were the top five countries from which most learners came. Of the certified learners, females accounted for 49% of the total learner base. It is noteworthy that the certified learners represent more than 2,000 organizations, and nearly 80% of them are micro, small, or medium-sized enterprises (MSMEs).
About 10x1000 Tech for Inclusion
10x1000 Tech for Inclusion is an open and global learning community that enables learners to become drivers of digital economic growth. Its mission is to nurture and inspire at least 1,000 emerging talents and tech leaders each year for the next ten years. 10x1000 is a philanthropic initiative launched jointly by the International Finance Corporation (IFC), a member of the World Bank Group, and Alipay in 2018.
About FINOLAB
FINOLAB is a membership business community and an office space located in the heart of international financial district in Tokyo to promote FinTech ecosystem and open innovation. Launched in Feb. 2016 by Mitsubishi Estate and Dentsu Group as the first FinTech Center in Japan, it consists of stakeholders, including startups, corporates, and regulators.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240305260615/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Lattice Delivers Industry-First PQC-Enabled Platform Firmware Resilience for AI Infrastructure with Lattice Sentry Solution Stack12.10.2026 22:00:00 CEST | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced the latest version of its Lattice Sentry™ solution stack (v5.0), the industry’s first post-quantum cryptography (PQC)-enabled Platform Firmware Resilience (PFR) and attestation solution. Extending Lattice's post-quantum cryptography leadership from silicon to a complete platform security stack, Lattice Sentry now delivers CNSA 2.0-aligned, NIST-compliant protection across AI data centers, and critical infrastructure, giving system designers a validated, production-ready path to quantum-resistant security. Lattice Sentry extends the company’s PQC leadership, combining the industry's first CNSA 2.0-compliant FPGA portfolio with AMI's platform management software to deliver a complete, integrated platform security solution. “AI infrastructure and the threat landscape are evolving rapidly. Platform firmware has become a primary attack vector, and the quantum era will upend decades
Cooler Master Expands End-to-End Cooling Solutions for AI Infrastructure12.10.2026 19:00:00 CEST | Press release
2,500 kW CDU anchors a portfolio spanning facility cooling, coolant distribution, rack-level thermal management and deployment equipment for high-density AI infrastructure Cooler Master, a global leader in digital infrastructure cooling solutions, has outlined its end-to-end cooling portfolio for AI infrastructure, designed to support high-density computing deployments in new data centers and existing facilities expanding AI capacity. Anchored by a 2,500 kW Liquid-to-Liquid In-Row Coolant Distribution Unit (CDU), the portfolio spans facility-level heat transfer, rack and server cooling, and the equipment used to prepare liquid cooling systems for operation. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012102572/en/ “Customers need choices that bring fast time-to-market, flexibility, and scalability for the deployment of their facilities,” said Thomas Chen, CEO at Cooler Master Corporation. “We aim to help them put liqui
GigaDevice Deepens Ecosystem Collaboration with LVGL to Advance GD32’s Global Open-Source GUI Ecosystem12.10.2026 15:00:00 CEST | Press release
GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, is deepening its ecosystem collaboration with LVGL. LVGL's Open graphics library is one of the world’s most widely‑adopted open‑source embedded frameworks. Eight GD32 MCU product families have now been officially included in the LVGL ecosystem, providing developers worldwide with more convenient and efficient support for embedded graphics development. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012320702/en/ Eight GD32 product series supported on LVGL website LVGL is an open-source graphical user interface framework designed for embedded devices, commercially supported by LVGL Ltd., a technology company based in Cambridge, UK. Lightweight, efficient, and cross-platform, it can be widely used in applications such as smart home devices, industrial control systems, consumer electronics, a
W. L. Gore & Associates Launches GORE® Battery Vents – MultiVent Series at the Battery Show12.10.2026 14:00:00 CEST | Press release
The integrated battery vent combines pressure equalization, moisture protection, and resealable thermal-runaway evacuation in a single part, with one opening in the pack wall. Today, W. L. Gore & Associates (Gore) introduced GORE® Battery Vents – MultiVent Series at The Battery Show North America 2026, a new integrated venting architecture that combines all three functions into a single device. Designed for lithium-ion battery packs in electric vehicles and energy storage systems, GORE® MultiVent is an integrated battery vent: one device that equalizes pressure, protects against moisture and evacuates gas during thermal runaway, then reseals. It gives pack designers an alternative to combining dual-stage vents, separate evacuation valves and desiccants. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012625188/en/ GORE® MultiVent GORE MultiVent builds on technology Gore acquired from Vernay Laboratories in 2026 and combine
Echodyne and ACS Sign Strategic Collaboration Agreement to Advance Counter-UAS Capabilities Worldwide12.10.2026 14:00:00 CEST | Press release
Successful integration of EchoShield® radar with ACS’s Bullfrog™ autonomousweapon station delivers precise tracking and affordable kinetic defeat across land and maritime missions. Echodyne, the radar platform company, and ACS, a precision robotics company for defense, today announced the signing of a Strategic Collaboration Agreement to accelerate the development, demonstration, and deployment of integrated counter-unmanned aircraft system (C-UAS) solutions. The agreement establishes collaboration across Echodyne’s high-performance commercial counter-UAS radar hardware and software roadmaps and ACS’s Bullfrog robotic weapon station capabilities, and follows the recent announcement of each company’s award from Joint Interagency Task Force 401 for Domestic Shield, the JIATF-401 C-UAS Marketplace, and other critical counter-drone requirements. Bullfrog combines computer vision, autonomous control, and precision robotics with existing weapon systems to detect, track, identify, and engage
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
