DC-XYLEM
5.3.2024 11:01:28 CET | Business Wire | Press release
Global water technology leader Xylem (NYSE: XYL) is inviting high school and university students worldwide to develop solutions to the world’s biggest water challenges by joining the 2024 Global Student Innovation Challenge.
Innovators aged between 13-25 can submit ideas to tackle three global problems: reducing plastic ocean waste, lowering greenhouse gas (GHG) emissions, and minimizing water waste – all of which supports more secure and resilient water systems for communities.
During the 8-week challenge, which begins on March 15, students will be mentored by leading water industry experts and learn about key water challenges and concepts. The top teams will share a $20,000 prize pool and can join the Xylem Ignite Innovation Incubator to further develop their solutions. The deadline for submissions is May 8, 2024.
“We’re at an inflection point for water - with intensifying challenges, but also enormous opportunity to solve these issues through innovation," said Austin Alexander, Vice President of Sustainability and Social Impact at Xylem. “Innovative and ambitious ideas are vital to tackling these challenges. Our Global Student Innovation Challenge harnesses the vision and ingenuity of the next generation of water leaders to advance water security globally.”
In 2023, more than 1,000 students from 78 countries participated in the Global Student Innovation Challenge. Team WASTE2H from Portugal won the grand prize in the high school category for their approach to reducing the water intensity of green hydrogen production. The winners in the university category, The Ocean Rescuers Team from India, Hong Kong, and Pakistan, were recognized for their system to identify, map, and propose solutions for waterways impacted by plastic pollution.
To learn more, visit innovationchallenge.xylem.com.
About Xylem
Xylem (XYL) is a leading global water technology company committed to solving the world’s critical water challenges with innovation and expertise. Our 23,000 diverse employees delivered combined pro forma revenue of $8.1 billion in 2023. We are creating a more sustainable world by enabling our customers to optimize water and resource management and helping communities in more than 150 countries become water-secure. Join us at www.xylem.com and Let’s Solve Water.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240305474258/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
Toshiba Showcases End-to-End Innovations Shaping What’s Next in Retail at EuroShop 202617.2.2026 15:45:00 CET | Press release
At EuroShop, Toshiba showcases intelligent, scalable solutions that combine AI, computer vision, and energy-efficient design to transform the future of retail. At EuroShop 2026, Toshiba Global Commerce Solutions will showcase how retailers across Europe are using scalable, sustainable innovation to address today’s challenges and build what’s next. Exhibiting in Hall 6, Booth C41 from the 22nd to 26th February, Toshiba will demonstrate technologies designed to evolve with retailers, empowering flexibility, resilience, and long-term growth, and prepare them for what’s next. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260216755053/en/ At EuroShop, we’re showing how Toshiba empowers retailers across all segments to transform with confidence by scaling intelligent solutions to deliver lasting impact. “Retailers are under pressure to move faster, operate more efficiently, and deliver better experiences than ever before. At Euro
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom