Business Wire

QUECTEL-WIRELESS

26.2.2024 09:01:34 CET | Business Wire | Press release

Share
Quectel Unveils Four New High Performance Wi-Fi and Bluetooth Modules to Increase Developer Options and Help Accelerate Digital Transformation

MWC – Quectel Wireless Solutions, a global IoT solutions provider, is pleased to announce the launch of two new Wi-Fi and Bluetooth modules, the FCU741R and the FCS950R, along with two Bluetooth modules, the HCM010S and the HCM111Z. This expansion of Quectel’s module portfolio aims to empower designers and developers with an expanded array of options, catering to diverse needs in terms of size, cost, and power efficiency. As a result, Quectel continues to demonstrate its commitment to meeting the evolving requirements of the IoT industry, providing innovative solutions for a variety of use cases.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240226444518/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

Quectel unveils four new high performance Wi-Fi and Bluetooth modules to increase developer options and help accelerate digital transformation (Photo: Business Wire)

“Adding the Quectel FCU741R, FCS950R and HCM010S to our portfolio enables developers and designers to select the module that best suits the needs of their use case,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “The combination of low power, efficient design, compact size and high-performance makes these modules ideal for many IoT use cases.”

The Quectel FCU741R is a high-performance Wi-Fi 4 module for wireless LAN connections that supports 2.4GHz and 5GHz frequencies to deliver a maximum data rate of 150Mbps. Measuring just 13.0mm x 12.2mm x 2.25mm the module has been designed to provide an optimal combination of size and cost for end products, making it ideal for size-sensitive applications. In addition, the module’s design minimizes design-in time and development effort, enabling faster time-to-market.

The module also offers an operating temperature range of -20 °C to +70 °C and a reliable USB2.0 interface. It supports two antenna designs, first generation RF coaxial connector and pin antenna interface with surface-mount technology (SMT) that makes the FCU741R an ideal option for durable and rugged designs.

The Quectel FCS950R is a Wi-Fi 5 and Bluetooth 4.2 module that can support a wide range of commercial applications thanks to its SDIO 3.0 interface which supports low power consumption and high-speed data transmission. The module is also compact, measuring just 12.0mm x 12.0mm x 2.35mm and weighs 0.58g. Offering support for IEEE 802.11a/b/g/n/ac, the FCS950R delivers a maximum data rate of up to 433.3Mbps in 802.11ac mode.

In common with the FCU741R, the FCS950R has been designed to address size-constrained deployments and its SMT technology makes it suitable for rugged designs. The module’s advanced package and the laser-engraved label achieve better heat dissipation and its indelible markings allow for large-scale automated manufacturing, which has a positive impact on cost and efficiency. The FCS950R also offers an operating temperature range of -20 °C to +70 °C.

Quectel has also launched the Quectel HCM010S, high-performance MCU Bluetooth module which boasts an ARM Cortex M33 processor and supports both Bluetooth Low Energy (BLE) and Bluetooth Mesh technologies. The module features built-in 64KB SRAM and 768KB flash, ensuring efficient performance. The HCM010S is provided in a LCC + DIP form factor with an ultra-compact size of 20.0mm × 15.6mm × 2.4mm.

Able to operate in temperatures from -40 °C to +105 °C, the Quectel HCM010S supports standard Bluetooth mesh network and is suitable for BLE devices that enable many-to-many communications for use cases in smart lighting, smart building and smart home wireless networks. The module also supports Tx power up to +20dBm for longer transmission range ensuring robust and reliable communication. Importantly, the module offers Secure Vault, an enhanced security option that features a higher level of IoT security.

Finally, the Quectel HCM111Z stands out as a high-performance MCU Bluetooth module, equipped with a Cortex-M3 processor running at a frequency of up to 48MHz. The module supports BLE 5.3, delivering an impressive maximum data rate of 2 Mbps. With built-in 48 KB SRAM and 512 KB flash, the module ensures efficient and reliable performance. The HCM111Z is equipped with a built-in Codec that enables microphone pickup and audio playback. This feature makes it well-suited for integration into smart devices such as voice-controlled remote controls, smart toy cars, sports and health gadgets, and home appliances.

Measuring a mere 15.0 mm × 12.0 mm × 2.25 mm in size, the HCM111Z is an ultra-compact Bluetooth module. It boasts support for up to 13 GPIOs, facilitating UART, SWD, SPI, I2C, ADC, PWM, and I2S* functions within the QuecOpen® solution. Additionally, it features Bluetooth low power mode, enhancing flexibility and adaptability for various applications, particularly in smart homes and industrial IoT scenarios.

Quectel’s IoT modules are developed with security at the core. From product architecture to firmware/software development, Quectel incorporates leading industry practices and standards, mitigating potential vulnerabilities with third party independent test houses and have incorporated security practices like generating SBOMs and VEX files as well as performing firmware binary analysis into the entire software development lifecycle.

Quectel provides a comprehensive range of embedded and external antennas, offering end-to-end support from design to certification and post-deployment. Quectel’s integrated approach with antennas, modules, and certifications significantly reduces cost and accelerates time-to-market, streamlining the journey from concept to mass market.

Customers are able to find out more about the Quectel antenna portfolio on the Quectel website.

About Quectel

Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of 5,900 professionals sets the pace for innovation in cellular, GNSS, Wi-Fi and Bluetooth modules as well as antennas and services.

With regional offices and support across the globe, our international leadership is devoted to advancing IoT and helping build a smarter world.

For more information, please visit: www.quectel.com, LinkedIn, Facebook, and X.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240226444518/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Lattice Delivers Industry-First PQC-Enabled Platform Firmware Resilience for AI Infrastructure with Lattice Sentry Solution Stack12.10.2026 22:00:00 CEST | Press release

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced the latest version of its Lattice Sentry™ solution stack (v5.0), the industry’s first post-quantum cryptography (PQC)-enabled Platform Firmware Resilience (PFR) and attestation solution. Extending Lattice's post-quantum cryptography leadership from silicon to a complete platform security stack, Lattice Sentry now delivers CNSA 2.0-aligned, NIST-compliant protection across AI data centers, and critical infrastructure, giving system designers a validated, production-ready path to quantum-resistant security. Lattice Sentry extends the company’s PQC leadership, combining the industry's first CNSA 2.0-compliant FPGA portfolio with AMI's platform management software to deliver a complete, integrated platform security solution. “AI infrastructure and the threat landscape are evolving rapidly. Platform firmware has become a primary attack vector, and the quantum era will upend decades

Cooler Master Expands End-to-End Cooling Solutions for AI Infrastructure12.10.2026 19:00:00 CEST | Press release

2,500 kW CDU anchors a portfolio spanning facility cooling, coolant distribution, rack-level thermal management and deployment equipment for high-density AI infrastructure Cooler Master, a global leader in digital infrastructure cooling solutions, has outlined its end-to-end cooling portfolio for AI infrastructure, designed to support high-density computing deployments in new data centers and existing facilities expanding AI capacity. Anchored by a 2,500 kW Liquid-to-Liquid In-Row Coolant Distribution Unit (CDU), the portfolio spans facility-level heat transfer, rack and server cooling, and the equipment used to prepare liquid cooling systems for operation. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012102572/en/ “Customers need choices that bring fast time-to-market, flexibility, and scalability for the deployment of their facilities,” said Thomas Chen, CEO at Cooler Master Corporation. “We aim to help them put liqui

GigaDevice Deepens Ecosystem Collaboration with LVGL to Advance GD32’s Global Open-Source GUI Ecosystem12.10.2026 15:00:00 CEST | Press release

GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, is deepening its ecosystem collaboration with LVGL. LVGL's Open graphics library is one of the world’s most widely‑adopted open‑source embedded frameworks. Eight GD32 MCU product families have now been officially included in the LVGL ecosystem, providing developers worldwide with more convenient and efficient support for embedded graphics development. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012320702/en/ Eight GD32 product series supported on LVGL website LVGL is an open-source graphical user interface framework designed for embedded devices, commercially supported by LVGL Ltd., a technology company based in Cambridge, UK. Lightweight, efficient, and cross-platform, it can be widely used in applications such as smart home devices, industrial control systems, consumer electronics, a

W. L. Gore & Associates Launches GORE® Battery Vents – MultiVent Series at the Battery Show12.10.2026 14:00:00 CEST | Press release

The integrated battery vent combines pressure equalization, moisture protection, and resealable thermal-runaway evacuation in a single part, with one opening in the pack wall. Today, W. L. Gore & Associates (Gore) introduced GORE® Battery Vents – MultiVent Series at The Battery Show North America 2026, a new integrated venting architecture that combines all three functions into a single device. Designed for lithium-ion battery packs in electric vehicles and energy storage systems, GORE® MultiVent is an integrated battery vent: one device that equalizes pressure, protects against moisture and evacuates gas during thermal runaway, then reseals. It gives pack designers an alternative to combining dual-stage vents, separate evacuation valves and desiccants. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012625188/en/ GORE® MultiVent GORE MultiVent builds on technology Gore acquired from Vernay Laboratories in 2026 and combine

Echodyne and ACS Sign Strategic Collaboration Agreement to Advance Counter-UAS Capabilities Worldwide12.10.2026 14:00:00 CEST | Press release

Successful integration of EchoShield® radar with ACS’s Bullfrog™ autonomousweapon station delivers precise tracking and affordable kinetic defeat across land and maritime missions. Echodyne, the radar platform company, and ACS, a precision robotics company for defense, today announced the signing of a Strategic Collaboration Agreement to accelerate the development, demonstration, and deployment of integrated counter-unmanned aircraft system (C-UAS) solutions. The agreement establishes collaboration across Echodyne’s high-performance commercial counter-UAS radar hardware and software roadmaps and ACS’s Bullfrog robotic weapon station capabilities, and follows the recent announcement of each company’s award from Joint Interagency Task Force 401 for Domestic Shield, the JIATF-401 C-UAS Marketplace, and other critical counter-drone requirements. Bullfrog combines computer vision, autonomous control, and precision robotics with existing weapon systems to detect, track, identify, and engage

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye