Business Wire

QUECTEL-WIRELESS

26.2.2024 09:01:34 CET | Business Wire | Press release

Share
Quectel Unveils Four New High Performance Wi-Fi and Bluetooth Modules to Increase Developer Options and Help Accelerate Digital Transformation

MWC – Quectel Wireless Solutions, a global IoT solutions provider, is pleased to announce the launch of two new Wi-Fi and Bluetooth modules, the FCU741R and the FCS950R, along with two Bluetooth modules, the HCM010S and the HCM111Z. This expansion of Quectel’s module portfolio aims to empower designers and developers with an expanded array of options, catering to diverse needs in terms of size, cost, and power efficiency. As a result, Quectel continues to demonstrate its commitment to meeting the evolving requirements of the IoT industry, providing innovative solutions for a variety of use cases.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240226444518/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

Quectel unveils four new high performance Wi-Fi and Bluetooth modules to increase developer options and help accelerate digital transformation (Photo: Business Wire)

“Adding the Quectel FCU741R, FCS950R and HCM010S to our portfolio enables developers and designers to select the module that best suits the needs of their use case,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “The combination of low power, efficient design, compact size and high-performance makes these modules ideal for many IoT use cases.”

The Quectel FCU741R is a high-performance Wi-Fi 4 module for wireless LAN connections that supports 2.4GHz and 5GHz frequencies to deliver a maximum data rate of 150Mbps. Measuring just 13.0mm x 12.2mm x 2.25mm the module has been designed to provide an optimal combination of size and cost for end products, making it ideal for size-sensitive applications. In addition, the module’s design minimizes design-in time and development effort, enabling faster time-to-market.

The module also offers an operating temperature range of -20 °C to +70 °C and a reliable USB2.0 interface. It supports two antenna designs, first generation RF coaxial connector and pin antenna interface with surface-mount technology (SMT) that makes the FCU741R an ideal option for durable and rugged designs.

The Quectel FCS950R is a Wi-Fi 5 and Bluetooth 4.2 module that can support a wide range of commercial applications thanks to its SDIO 3.0 interface which supports low power consumption and high-speed data transmission. The module is also compact, measuring just 12.0mm x 12.0mm x 2.35mm and weighs 0.58g. Offering support for IEEE 802.11a/b/g/n/ac, the FCS950R delivers a maximum data rate of up to 433.3Mbps in 802.11ac mode.

In common with the FCU741R, the FCS950R has been designed to address size-constrained deployments and its SMT technology makes it suitable for rugged designs. The module’s advanced package and the laser-engraved label achieve better heat dissipation and its indelible markings allow for large-scale automated manufacturing, which has a positive impact on cost and efficiency. The FCS950R also offers an operating temperature range of -20 °C to +70 °C.

Quectel has also launched the Quectel HCM010S, high-performance MCU Bluetooth module which boasts an ARM Cortex M33 processor and supports both Bluetooth Low Energy (BLE) and Bluetooth Mesh technologies. The module features built-in 64KB SRAM and 768KB flash, ensuring efficient performance. The HCM010S is provided in a LCC + DIP form factor with an ultra-compact size of 20.0mm × 15.6mm × 2.4mm.

Able to operate in temperatures from -40 °C to +105 °C, the Quectel HCM010S supports standard Bluetooth mesh network and is suitable for BLE devices that enable many-to-many communications for use cases in smart lighting, smart building and smart home wireless networks. The module also supports Tx power up to +20dBm for longer transmission range ensuring robust and reliable communication. Importantly, the module offers Secure Vault, an enhanced security option that features a higher level of IoT security.

Finally, the Quectel HCM111Z stands out as a high-performance MCU Bluetooth module, equipped with a Cortex-M3 processor running at a frequency of up to 48MHz. The module supports BLE 5.3, delivering an impressive maximum data rate of 2 Mbps. With built-in 48 KB SRAM and 512 KB flash, the module ensures efficient and reliable performance. The HCM111Z is equipped with a built-in Codec that enables microphone pickup and audio playback. This feature makes it well-suited for integration into smart devices such as voice-controlled remote controls, smart toy cars, sports and health gadgets, and home appliances.

Measuring a mere 15.0 mm × 12.0 mm × 2.25 mm in size, the HCM111Z is an ultra-compact Bluetooth module. It boasts support for up to 13 GPIOs, facilitating UART, SWD, SPI, I2C, ADC, PWM, and I2S* functions within the QuecOpen® solution. Additionally, it features Bluetooth low power mode, enhancing flexibility and adaptability for various applications, particularly in smart homes and industrial IoT scenarios.

Quectel’s IoT modules are developed with security at the core. From product architecture to firmware/software development, Quectel incorporates leading industry practices and standards, mitigating potential vulnerabilities with third party independent test houses and have incorporated security practices like generating SBOMs and VEX files as well as performing firmware binary analysis into the entire software development lifecycle.

Quectel provides a comprehensive range of embedded and external antennas, offering end-to-end support from design to certification and post-deployment. Quectel’s integrated approach with antennas, modules, and certifications significantly reduces cost and accelerates time-to-market, streamlining the journey from concept to mass market.

Customers are able to find out more about the Quectel antenna portfolio on the Quectel website.

About Quectel

Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of 5,900 professionals sets the pace for innovation in cellular, GNSS, Wi-Fi and Bluetooth modules as well as antennas and services.

With regional offices and support across the globe, our international leadership is devoted to advancing IoT and helping build a smarter world.

For more information, please visit: www.quectel.com, LinkedIn, Facebook, and X.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240226444518/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Visa and World Bank Group Announce New Risk-Sharing Initiative to Expand Digital Payments and Financial Inclusion in Emerging Markets9.9.2026 11:00:00 CEST | Press release

Visa (NYSE: V), a global leader in digital payments, and the International Finance Corporation (IFC), a member of the World Bank Group focused on the private sector, are partnering on an innovative risk-sharing initiative designed to help expand financial inclusion by increasing access to digital financial services in emerging markets. Under the agreement, IFC will share credit settlement risk for Visa transactions associated with enrolled financial institutions, enabling these institutions to connect more underbanked consumers and small businesses to digital payments. The facility is expected to support approximately $200 million in risk sharing over five years, with an initial focus on 14 countries in Latin America and the Caribbean and reach approximately 50 financial institutions with below-investment grade ratings. Together, Visa and IFC aim to help financial institutions enable millions more people and small businesses to save, spend, borrow, grow, and participate more fully in t

Chiesi Group Delivers Solid H1 2026 Performance, Combining Growth, Continued Investment in Innovation and Positive Economic Impact Across Communities9.9.2026 11:00:00 CEST | Press release

HIGHLIGHTS H1 2026 revenues of €1.89 billion, up +3.6% at CER versus H1 2025, driven by growth in the inhaled triple therapy portfolio and strong momentum in the rare diseases therapeutic area Continued investment in innovation with €426 million invested in R&D (22.5% of sales) Completed strategic investment for treatment of hereditary angioedema (HAE) with acquisition of KalVista Pharmaceuticals EBITDA continues to remain close to 30%, reflecting continued strong profitability and disciplined resource allocation Recent Economic Footprint study highlights Chiesi's contribution to economic development, supporting 56,488 jobs globally, generating €6.0 billion in GDP impact and €2.0 billion in taxes and public revenues worldwide Chiesi Group ("Chiesi"), an international research-focused biopharmaceutical company and certified B Corp, today announced its financial results for the six months ended 30 June 2026 ("H1 2026"). Performance across therapeutic areas and regions Chiesi reported rev

Ant Group Open-Sources Ling-3.0-flash-Fin for Real-World Financial Workflows9.9.2026 10:36:00 CEST | Press release

Ant Group today announced the open-sourcing of Ling-3.0-flash-Fin at the 2026 Inclusion·Conference on the Bund. Grounded in actual business needs as an open model for real-world financial workflows, this release continues Ant Group's exploration of bringing AI into practical scenarios, focusing on delivering utility and high efficiency for complex tasks. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260908565055/en/ Solving Real-World Challenges Through Efficiency Financial work depends on trustworthy sources, consistent definitions, accurate calculations and auditable outputs. AI in this sector must go beyond simple question-and-answer interactions to navigate dynamic information, complex accounting standards, and stringent compliance requirements. Ling-3.0-flash-Fin was co-developed with leading financial institutions and industry experts to embed professional expertise directly into task definition, data systems, and eva

1NCE adds Data Benchmarking, AI Capabilities and ISO certification9.9.2026 10:00:00 CEST | Press release

1NCE Insights now offers access to benchmarks from 30,000+ global deployments across 17 industries, enabling customers to compare their solutions to real-world peers. Launch of 1NCE AI, a unified API gateway providing access to leading AI models with centralized vendor management. ISO/IEC 27001:2022 certified infrastructure, reflecting 1NCE's commitment to data security. 1NCE announced a new upgrade of 1NCE Insights and the launch of 1NCE AI. Both expand 1NCE's foundational platform services, giving customers greater intelligence and control over connected device data. The new 1NCE Insights upgrade gives customers access to aggregated benchmark data from 30,000+ deployments. They can compare network usage patterns, battery performance, hardware choices and traffic optimization against real-world peers, enabling faster product development. 1NCE AI provides access to leading AI models through a unified API gateway, eliminating vendor fragmentation. The service is Germany-hosted and fully

HSCALE Secures Landmark Strategic Deal With Major US Cloud Provider for Hyperscale Data Centre Campus in Spain9.9.2026 09:00:00 CEST | Press release

The deal represents over US$1 billion in contract value which underpins the expansion and development of one of Spain's largest data centres currently under construction Major long-term agreement with a leading global cloud platform provider. First Ready-for-Service date in 2027. Project represents approximately US$1 billion of capex investment, strengthening and further cementing Spain's position in Europe's AI and cloud economy HSCALE, the pan-European hyperscale data centre platform, announced today a major strategic deal with a significant global cloud provider to deliver large-scale, high-performance digital infrastructure in a strategic metropolitan area within the Iberian Peninsula. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260909242953/en/ HSCALE's CCO Paul Berry-Selwood The agreement is a defining milestone for HSCALE and anchors the development of a next-generation campus designed for the demanding requirement

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye