QUECTEL-WIRELESS
26.2.2024 09:01:34 CET | Business Wire | Press release
MWC – Quectel Wireless Solutions, a global IoT solutions provider, is pleased to announce the launch of two new Wi-Fi and Bluetooth modules, the FCU741R and the FCS950R, along with two Bluetooth modules, the HCM010S and the HCM111Z. This expansion of Quectel’s module portfolio aims to empower designers and developers with an expanded array of options, catering to diverse needs in terms of size, cost, and power efficiency. As a result, Quectel continues to demonstrate its commitment to meeting the evolving requirements of the IoT industry, providing innovative solutions for a variety of use cases.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240226444518/en/
Quectel unveils four new high performance Wi-Fi and Bluetooth modules to increase developer options and help accelerate digital transformation (Photo: Business Wire)
“Adding the Quectel FCU741R, FCS950R and HCM010S to our portfolio enables developers and designers to select the module that best suits the needs of their use case,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “The combination of low power, efficient design, compact size and high-performance makes these modules ideal for many IoT use cases.”
The Quectel FCU741R is a high-performance Wi-Fi 4 module for wireless LAN connections that supports 2.4GHz and 5GHz frequencies to deliver a maximum data rate of 150Mbps. Measuring just 13.0mm x 12.2mm x 2.25mm the module has been designed to provide an optimal combination of size and cost for end products, making it ideal for size-sensitive applications. In addition, the module’s design minimizes design-in time and development effort, enabling faster time-to-market.
The module also offers an operating temperature range of -20 °C to +70 °C and a reliable USB2.0 interface. It supports two antenna designs, first generation RF coaxial connector and pin antenna interface with surface-mount technology (SMT) that makes the FCU741R an ideal option for durable and rugged designs.
The Quectel FCS950R is a Wi-Fi 5 and Bluetooth 4.2 module that can support a wide range of commercial applications thanks to its SDIO 3.0 interface which supports low power consumption and high-speed data transmission. The module is also compact, measuring just 12.0mm x 12.0mm x 2.35mm and weighs 0.58g. Offering support for IEEE 802.11a/b/g/n/ac, the FCS950R delivers a maximum data rate of up to 433.3Mbps in 802.11ac mode.
In common with the FCU741R, the FCS950R has been designed to address size-constrained deployments and its SMT technology makes it suitable for rugged designs. The module’s advanced package and the laser-engraved label achieve better heat dissipation and its indelible markings allow for large-scale automated manufacturing, which has a positive impact on cost and efficiency. The FCS950R also offers an operating temperature range of -20 °C to +70 °C.
Quectel has also launched the Quectel HCM010S, high-performance MCU Bluetooth module which boasts an ARM Cortex M33 processor and supports both Bluetooth Low Energy (BLE) and Bluetooth Mesh technologies. The module features built-in 64KB SRAM and 768KB flash, ensuring efficient performance. The HCM010S is provided in a LCC + DIP form factor with an ultra-compact size of 20.0mm × 15.6mm × 2.4mm.
Able to operate in temperatures from -40 °C to +105 °C, the Quectel HCM010S supports standard Bluetooth mesh network and is suitable for BLE devices that enable many-to-many communications for use cases in smart lighting, smart building and smart home wireless networks. The module also supports Tx power up to +20dBm for longer transmission range ensuring robust and reliable communication. Importantly, the module offers Secure Vault, an enhanced security option that features a higher level of IoT security.
Finally, the Quectel HCM111Z stands out as a high-performance MCU Bluetooth module, equipped with a Cortex-M3 processor running at a frequency of up to 48MHz. The module supports BLE 5.3, delivering an impressive maximum data rate of 2 Mbps. With built-in 48 KB SRAM and 512 KB flash, the module ensures efficient and reliable performance. The HCM111Z is equipped with a built-in Codec that enables microphone pickup and audio playback. This feature makes it well-suited for integration into smart devices such as voice-controlled remote controls, smart toy cars, sports and health gadgets, and home appliances.
Measuring a mere 15.0 mm × 12.0 mm × 2.25 mm in size, the HCM111Z is an ultra-compact Bluetooth module. It boasts support for up to 13 GPIOs, facilitating UART, SWD, SPI, I2C, ADC, PWM, and I2S* functions within the QuecOpen® solution. Additionally, it features Bluetooth low power mode, enhancing flexibility and adaptability for various applications, particularly in smart homes and industrial IoT scenarios.
Quectel’s IoT modules are developed with security at the core. From product architecture to firmware/software development, Quectel incorporates leading industry practices and standards, mitigating potential vulnerabilities with third party independent test houses and have incorporated security practices like generating SBOMs and VEX files as well as performing firmware binary analysis into the entire software development lifecycle.
Quectel provides a comprehensive range of embedded and external antennas, offering end-to-end support from design to certification and post-deployment. Quectel’s integrated approach with antennas, modules, and certifications significantly reduces cost and accelerates time-to-market, streamlining the journey from concept to mass market.
Customers are able to find out more about the Quectel antenna portfolio on the Quectel website.
About Quectel
Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of 5,900 professionals sets the pace for innovation in cellular, GNSS, Wi-Fi and Bluetooth modules as well as antennas and services.
With regional offices and support across the globe, our international leadership is devoted to advancing IoT and helping build a smarter world.
For more information, please visit: www.quectel.com, LinkedIn, Facebook, and X.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240226444518/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
BOCHK and Ant International Forge Strategic Partnership to Enhance Cross-border Payment Connectivity and Innovative Corporate Financial Service Solutions Through Fintech20.8.2026 08:00:00 CEST | Press release
Ant International and Bank of China (Hong Kong) (“BOCHK”) announced that the two parties have forged a strategic partnership. Leveraging BOCHK’s banking strengths and Ant International’s leading fintech and AI technologies, the two parties seek to explore the frontier of AI-driven innovative financial services, empower real-time treasury management and cross-border payments, deliver efficient and intelligent liquidity management and financial service solutions for global enterprises, while continuously enhancing financial services for small and medium-sized enterprises (“SMEs”). This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819555366/en/ From left to right: Kelvin Li, General Manager of Platform Tech and Senior Vice President of Ant International, Eric Jing, Chairman of Ant International, Sun Yu, Vice Chairman and Chief Executive of BOCHK, and Wang Huabin, Deputy Chief Executive of BOCHK Sun Yu, Vice Chairman and Chief E
Ant International’s FalconTST Model 2.0 Achieves SOTA, Elevating Predictive AI Application in Finance to New Levels20.8.2026 03:55:00 CEST | Press release
FalconTST 2.0 has achieved state-of-the-art performance on MASE metricon top global benchmark.Banks use FalconTST 2.0 to better forecast liquidity exposure with Barclays, Citi, Deutsche Bank and Standard Chartered having integrated FalconTST 2.0 for cashflow forecasting and FX management.FalconTST 2.0 has achieved >93% forecast accuracy rate consistently and is ready for broader industry application, including logistics, aviation, e-commerce, besides financial sector. Ant International has introduced Falcon Time-Series Transformer (TST) AI Model 2.0, its most advanced TST model so far designed to deliver more accurate forecasting in real-world FX risk management of cross-border payments, with more industry applications to come, such as demand forecasting for supply chain management for e-commerce platforms, and predictive operations management for aviation industry. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819055561
Grid Dynamics Earns MACH Alliance's 2026 Agent Ready Award for Production-Scale Agentic AI19.8.2026 22:05:00 CEST | Press release
Key Takeaways: Grid Dynamics is named to MACH Alliance's inaugural 2026 Agent Ready cohort. Grid Dynamics won the award for its agentic AI capabilities and for programs delivered at a global food and beverage company and a global payments company. Grid Dynamics delivered the qualifying work through its Grid Dynamics AI Native (GAIN) platforms and Forward Deployed Engineer delivery model. Grid Dynamics Holdings, Inc. (Nasdaq: GDYN) (“Grid Dynamics”), a premier AI transformation partner for the Fortune 1000, today announced it has earned MACH Alliance's 2026 Agent Ready Award, becoming one of 35 companies named in the program's inaugural cohort. Agent Ready is an advanced certification that builds upon MACH Certification, the MACH Alliance's baseline standard for open, composable, and connected technology. The honor recognizes certified members that have moved agentic AI from pilots and demos into production, at scale, with the guardrails enterprise deployment requires. Every award is in
Xsolla Announces Multi-Year Strategic Partnership With the Good Game Club Podcast to Amplify Positive Stories From the Global Games Industry19.8.2026 18:10:00 CEST | Press release
Collaboration Brings Co-Created Episodes, Live Recordings At gamescom And GDC, And Stories From Studios, With Episodes Recorded Across the Globe Xsolla, a global video game commerce company, today announced a multi-year strategic partnership with Good Game Club, the independent, global podcast dedicated to sharing positive stories from the gaming ecosystem. The partnership builds on a broader effort to support the developers, publishers, and creators shaping the future of the games industry in a positive way by supporting good stories from the human side of video game businesses. The partnership spans the global events calendar, with joint podcast recordings planned each year at gamescom in Cologne and the Game Developers Conference (GDC) in San Francisco. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819127662/en/ Graphic: Xsolla Xsolla and Good Game Club will collaborate on recurring editorial segments and deep-dive ep
KAGA FEI Expands Its Software-Embedded Bluetooth Low Energy Module Lineup with ES4L15MA1 and EC4L15MA119.8.2026 16:00:00 CEST | Press release
KAGA FEI Co., Ltd., a global provider of advanced short-range wireless modules, announced today the development of the ES4L15MA1 and EC4L15MA1 Bluetooth Low Energy modules with embedded software for wireless communication. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260802953307/en/ ES4L15MA1 (left) and EC4L15MA1 (right) sample modules These products are versions of KAGA FEI’s ES4L15BA1 and EC4L15BA1 wireless modules with embedded software, which use Nordic Semiconductor’s nRF54L15. Because the modules include the functions required for Bluetooth Low Energy communication, device manufacturers can develop products in a shorter period without having to develop wireless communication software from scratch. The modules help reduce software development workloads, shorten product development cycles, and lower development costs for a wide range of IoT devices. The need for wireless connectivity in IoT applications is growing acr
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
