QUECTEL-WIRELESS
26.2.2024 09:01:34 CET | Business Wire | Press release
MWC – Quectel Wireless Solutions, a global IoT solutions provider, is pleased to announce the launch of two new Wi-Fi and Bluetooth modules, the FCU741R and the FCS950R, along with two Bluetooth modules, the HCM010S and the HCM111Z. This expansion of Quectel’s module portfolio aims to empower designers and developers with an expanded array of options, catering to diverse needs in terms of size, cost, and power efficiency. As a result, Quectel continues to demonstrate its commitment to meeting the evolving requirements of the IoT industry, providing innovative solutions for a variety of use cases.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240226444518/en/
Quectel unveils four new high performance Wi-Fi and Bluetooth modules to increase developer options and help accelerate digital transformation (Photo: Business Wire)
“Adding the Quectel FCU741R, FCS950R and HCM010S to our portfolio enables developers and designers to select the module that best suits the needs of their use case,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “The combination of low power, efficient design, compact size and high-performance makes these modules ideal for many IoT use cases.”
The Quectel FCU741R is a high-performance Wi-Fi 4 module for wireless LAN connections that supports 2.4GHz and 5GHz frequencies to deliver a maximum data rate of 150Mbps. Measuring just 13.0mm x 12.2mm x 2.25mm the module has been designed to provide an optimal combination of size and cost for end products, making it ideal for size-sensitive applications. In addition, the module’s design minimizes design-in time and development effort, enabling faster time-to-market.
The module also offers an operating temperature range of -20 °C to +70 °C and a reliable USB2.0 interface. It supports two antenna designs, first generation RF coaxial connector and pin antenna interface with surface-mount technology (SMT) that makes the FCU741R an ideal option for durable and rugged designs.
The Quectel FCS950R is a Wi-Fi 5 and Bluetooth 4.2 module that can support a wide range of commercial applications thanks to its SDIO 3.0 interface which supports low power consumption and high-speed data transmission. The module is also compact, measuring just 12.0mm x 12.0mm x 2.35mm and weighs 0.58g. Offering support for IEEE 802.11a/b/g/n/ac, the FCS950R delivers a maximum data rate of up to 433.3Mbps in 802.11ac mode.
In common with the FCU741R, the FCS950R has been designed to address size-constrained deployments and its SMT technology makes it suitable for rugged designs. The module’s advanced package and the laser-engraved label achieve better heat dissipation and its indelible markings allow for large-scale automated manufacturing, which has a positive impact on cost and efficiency. The FCS950R also offers an operating temperature range of -20 °C to +70 °C.
Quectel has also launched the Quectel HCM010S, high-performance MCU Bluetooth module which boasts an ARM Cortex M33 processor and supports both Bluetooth Low Energy (BLE) and Bluetooth Mesh technologies. The module features built-in 64KB SRAM and 768KB flash, ensuring efficient performance. The HCM010S is provided in a LCC + DIP form factor with an ultra-compact size of 20.0mm × 15.6mm × 2.4mm.
Able to operate in temperatures from -40 °C to +105 °C, the Quectel HCM010S supports standard Bluetooth mesh network and is suitable for BLE devices that enable many-to-many communications for use cases in smart lighting, smart building and smart home wireless networks. The module also supports Tx power up to +20dBm for longer transmission range ensuring robust and reliable communication. Importantly, the module offers Secure Vault, an enhanced security option that features a higher level of IoT security.
Finally, the Quectel HCM111Z stands out as a high-performance MCU Bluetooth module, equipped with a Cortex-M3 processor running at a frequency of up to 48MHz. The module supports BLE 5.3, delivering an impressive maximum data rate of 2 Mbps. With built-in 48 KB SRAM and 512 KB flash, the module ensures efficient and reliable performance. The HCM111Z is equipped with a built-in Codec that enables microphone pickup and audio playback. This feature makes it well-suited for integration into smart devices such as voice-controlled remote controls, smart toy cars, sports and health gadgets, and home appliances.
Measuring a mere 15.0 mm × 12.0 mm × 2.25 mm in size, the HCM111Z is an ultra-compact Bluetooth module. It boasts support for up to 13 GPIOs, facilitating UART, SWD, SPI, I2C, ADC, PWM, and I2S* functions within the QuecOpen® solution. Additionally, it features Bluetooth low power mode, enhancing flexibility and adaptability for various applications, particularly in smart homes and industrial IoT scenarios.
Quectel’s IoT modules are developed with security at the core. From product architecture to firmware/software development, Quectel incorporates leading industry practices and standards, mitigating potential vulnerabilities with third party independent test houses and have incorporated security practices like generating SBOMs and VEX files as well as performing firmware binary analysis into the entire software development lifecycle.
Quectel provides a comprehensive range of embedded and external antennas, offering end-to-end support from design to certification and post-deployment. Quectel’s integrated approach with antennas, modules, and certifications significantly reduces cost and accelerates time-to-market, streamlining the journey from concept to mass market.
Customers are able to find out more about the Quectel antenna portfolio on the Quectel website.
About Quectel
Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of 5,900 professionals sets the pace for innovation in cellular, GNSS, Wi-Fi and Bluetooth modules as well as antennas and services.
With regional offices and support across the globe, our international leadership is devoted to advancing IoT and helping build a smarter world.
For more information, please visit: www.quectel.com, LinkedIn, Facebook, and X.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240226444518/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
INNIO Group Announces Filing of Registration Statement for Proposed Initial Public Offering11.5.2026 21:49:00 CEST | Press release
INNIO Group ("INNIO"), a leading global distributed energy solutions provider, today announces that it has publicly filed a registration statement on Form S-1 with the U.S. Securities and Exchange Commission ("SEC") relating to a proposed initial public offering of its common shares. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260511389675/en/ INNIO Group Announces Filing of Registration Statement for Proposed Initial Public Offering The timing of the offering, number of shares to be offered and the price range for the proposed offering have not yet been determined. INNIO has applied to list its common shares on the Nasdaq Global Select Market under the ticker symbol "INIO." Goldman Sachs & Co. LLC, J.P. Morgan and Morgan Stanley are acting as joint lead book-running managers for the proposed offering. BofA Securities, Barclays and Citigroup are acting as book-running managers for the proposed offering. Baird, BNP Paribas
Only 7% of Companies Achieve Full Compliance as Global Expansion Increases Legal Complexity11.5.2026 15:00:00 CEST | Press release
47% of general counsels say beneficial ownership rules pose the biggest risks to legal operations44% lack confidence in meeting cross-border data security requirements As businesses accelerate their global expansion in 2026, compliance fails to keep pace. In fact, only 7% of organizations report full compliance across their global entities, according to a new study by CSC, the leading provider of global business administration and compliance solutions. CSC surveyed 350 general counsel (GCs) and senior legal professionals across Europe, North America, and Asia Pacific to examine how their teams navigate international expansion, regulatory pressure, and the increasing adoption of artificial intelligence (AI).¹ The findings appear in CSC’s latest report, General Counsel Barometer 2026: From Complexity to Control. Most organizations report partial compliance, with over half (53%) estimating they are 50–75% compliant, and a further 35% placing themselves between 76%–99%. This leaves just 7%
IFF Opens Vanilla Innovation Center in Madagascar11.5.2026 14:15:00 CEST | Press release
Advancing science‑led flavor innovation where vanilla is grown IFF (NYSE: IFF)—a global leader in flavors, fragrances, food ingredients, health & bioscience—today announced the opening of its Vanilla Innovation Center in Madagascar, reinforcing vanilla as a strategic and priority tonality for IFF and strengthening its ability to innovate at origin. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260508110162/en/ IFF's Vanilla Innovation Center in Madagascar “The opening of the center marks an important step in how we approach vanilla innovation,” said Adam Jańczuk, Ph.D., senior vice president, research, creation and design, Taste, IFF. “By strengthening our presence at origin, we connect science, creativity and sustainability more closely, responding to climate changes, safeguarding quality and creating value across the supply chain.” Located in Toamasina, Madagascar’s principal seaport, near vanilla growing areas and post‑h
ARIS Recognised as a Leader in Gartner® Magic Quadrant™ for Process Intelligence Platforms, Believes This Reinforces Its Role in Enabling Enterprise AI at Scale11.5.2026 14:00:00 CEST | Press release
ARIS, the process context foundation platform for enterprise AI deployment, today announced its recognition as a Leader in the Gartner® Magic Quadrant™ for Process Intelligence Platforms. This is the fourth consecutive year that ARIS has been recognized as a Leader in the report and the company believes it underscores a continued commitment to innovation and growth as enterprises focus on turning AI ambition into measurable business outcomes. While technology has advanced rapidly, companies are struggling to operationalise AI across complex operating models. ARIS sees this recognition by Gartner as a reflection of its strength in delivering a single unified platform for process intelligence, providing the context layer on which G2000 organisations can successfully deploy and scale agentic AI. “AI is moving from experimentation to execution – but many enterprises are finding it difficult to scale,” said Guillaume Bacuvier, CEO of ARIS. “The reason is simple: AI lacks the context it need
HistoSonics Moves to Advance Additional Histotripsy Applications Announcing FDA Submission for Kidney Tumors11.5.2026 14:00:00 CEST | Press release
HistoSonics, the developer of the Edison® Histotripsy System and novel histotripsy therapy platform, today announced it has submitted a De Novo request to the U.S. Food and Drug Administration seeking authorization to expand the use of its Edison® Histotripsy System to include the destruction of kidney (renal) tumors. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260511268688/en/ HistoSonics Edison® Histotripsy System This milestone marks a significant step forward in the company’s mission to transform the treatment of solid tumors with a completely non-invasive technology that harnesses focused ultrasound to mechanically liquefy and destroy targeted tissue, reducing the risk of many complications and side effects associated with surgery, radiation, and other common therapies. “This submission is an important milestone in expanding histotripsy beyond the liver and into the kidney, an area where patients and physicians are s
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
