Business Wire

OR-RADISYS

26.2.2024 08:01:32 CET | Business Wire | Press release

Share
Radisys Unveils Engage Clarity to Enhance Phone Conversations for People Experiencing Hearing Loss

The World Health Organization estimates that 20% of the world’s population today suffers from some degree of hearing loss. This figure is expected to increase to an estimated 25% (nearly 2.5 billion) by 2050. Over time, individuals with hearing loss tend to stop socializing – leading to impacts on friends and family members as well as increasing the risk of other health issues, including a higher likelihood of dementia. Hearing difficulties are particularly challenging in phone conversations as telephony is not designed to cater to those with hearing loss, and visual cues like lip reading that can help overcome some hearing difficulties are absent.

Radisys® Corporation, a global leader of open telecom solutions, today announced the availability of Engage Clarity, a unique service that enhances the quality and comprehensibility of voice calls for people with hearing challenges. With the goal to significantly enhance their quality of life and interactions, a personalized and unique service profile is activated, enabling in-line, real-time enhancements that deliver a superior experience. Engage Clarity seamlessly integrates with telecom operators' communication networks, ensuring a smooth and user-friendly implementation experience without requiring any special applications and devices. The Engage Clarity is accessible via any device through mobile voice, fixed voice, or OTT/web communication service.

With Radisys’ Engage Clarity, MNOs have a unique opportunity to offer a fully personalized wellness solution to their subscribers and meet inclusivity and societal improvement objectives. With a suggested street price per month that is less than the cost of a cup of coffee, this unique solution enhances the quality of life and improves accessibility to services for people with hearing loss. The solution benefits can be extended to anyone in consumer and business calls.

With global leadership in media processing, Radisys is uniquely positioned to deliver the benefits of Engage Clarity through service providers. “The ability to ensure the voice clarity in conversations between grandparents and grandchildren, patients and doctors, businesses and their customers – regardless of the background noise - has broad benefits to users and operators,” said Al Balasco, Head of Digital Experiences and Applications Business, Radisys. “Voice is communication’s lowest common denominator, and ensuring the highest quality experience can be life-changing for those experiencing hearing challenges.”

Radisys’ Engage Clarity addresses a critical need for people with hearing difficulties during voice calls. Clinical trials revealed high levels of user satisfaction, with 90% of users finding speech clearer and easier to hear and 74% of users reporting that calls were less tiring, highlighting the positive impact of the service on the overall communication experience for everyone, not only people with hearing difficulties.

Hearing wellness is often neglected. Compared to examining their eyes annually, people rarely take a hearing test. Radisys’ Engage Clarity offers a unique entry point for MNOs to help people manage hearing wellness by suggesting regular check-ins with the Engage hearing profile creator when they change their handset or perhaps once a year.

Experience Engage Clarity at MWC Barcelona

Hear the difference Radisys’ Engage Clarity brings. Visit Radisys at MWC Barcelona, Stand 2D50 for a demonstration, or learn more by visiting www.engagedigital.ai/clarity. To schedule a meeting with Radisys’ experts, contact open@radisys.com.

About Radisys

Radisys is a global leader in open telecom solutions and services. Its disaggregated platforms and integration services leverage open reference architectures and standards combined with open software and hardware, enabling service providers to drive open digital transformation. Radisys offers an end-to-end solutions portfolio from digital endpoints to disaggregated and open access and core solutions, to immersive digital applications and engagement platforms. Its world-class and experienced network services organization delivers full lifecycle services to help service providers build and operate highly scalable and high-performance networks at optimum total cost of ownership. For more information, visit www.Radisys.com.

Radisys® is a registered trademark of Radisys. All other trademarks are the property of their respective owners.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240225545999/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release

Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana

Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp

Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release

Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve

ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release

ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material

ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release

Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye