Business Wire

MAVENIR

24.2.2024 12:38:26 CET | Business Wire | Press release

Share
Mavenir in Collaboration with Intel Delivers Optimised Performance and Power Efficiency for 4G and 5G Open vRAN Solution

Mavenir, the cloud-native network infrastructure provider building the future of networks, today announces availability of its cutting-edge Open vRAN solution powered by 4th Gen Intel Xeon Scalable processors with Intel vRAN Boost – delivering a cloud-native, high-performance and energy-efficient solution for latency-sensitive and compute-intensive mobile network applications. The move to Intel’s recent processors for vRAN marks the latest solution optimisation for Mavenir, which has driven Open RAN momentum through three generations of Intel Xeon Scalable processors.

Mavenir's Open vRAN solution, powered by 4th Gen Intel Xeon Scalable processors with Intel vRAN Boost, offers an exceptional suite of performance, functionality, and integrated artificial intelligence (AI) and machine learning (ML) application for the next generation 4G and 5G networks. Mavenir has built a close and long-standing technology collaboration with Intel, and the adoption of Intel’s processors enables the development of more efficient and cost-effective RANs. These optimisations are being achieved through the availability of more processing power with higher capacity, resulting in reduction of number of cores or servers needed per cell site.

Mavenir's Open vRAN solution comprises the virtualised distributed Unit (vDU) and the centralised unit (vCU), supporting all mobile network generations (2G, 4G, 5G) and providing a complete baseband unit (BBU) functionality. The solution is cloud-native and easily deployable on Intel architecture-based private, hybrid, or public clouds. The Mavenir vDU incorporates Intel’s FlexRAN reference software, which utilises modular, virtualised control functions across well-defined interfaces that allow flexible and programmable control of the layer 1 wireless infrastructure.

The fully integrated vRAN acceleration feature of 4th Gen Intel Xeon Scalable processors with Intel vRAN Boost eliminates the need for an external acceleration card and delivers up to 2x capacity increase with an additional 20% power savings1 versus the previous generation processor for applications like massive MIMO (mMIMO). This fully integrated solution allows Mobile Network Operators (MNOs) to deploy cloud-native, energy-efficient and AI-driven RAN solutions at a significantly lower cost.

Mavenir's pioneering Open vRAN solution has driven significant industry progress for Open RAN technology, and made Open RAN a mainstream consideration for all operators expanding their 4G and 5G networks, whether building new networks from scratch or upgrading existing ones. The combination sets the stage for more significant advances in next-generation O-RANs including dramatic energy savings, RAN slice assurance, AI/ML-powered SLAs, expanded RAN capacity, and optimised functionality splits.

BG Kumar, President, Access Networks, Platforms and Digital Enablement for Mavenir commented: “Mavenir values our ongoing collaboration with Intel, which is leading the industry in driving forward high-performance and sustainable Open vRAN solutions for 4G and 5G networks. Mavenir’s integrated solution powered by 4th Gen Intel Xeon Scalable processors with Intel vRAN Boost optimises the Open vRAN solution offerings even further– giving CSPs worldwide the ability to deploy cloud-native, energy-efficient, and cost-effective AI/ML powered RAN infrastructure built on world-class technology.”

Cristina Rodriguez, Vice President and General Manager, Wireless Access Networking Division at Intel said: “Operators’ journey to design and deploy new networks drives a key set of technology needs and challenges to be addressed. Mavenir’s solution leverages the best features of Intel’s 4th Gen Intel Xeon platform to provide operators a flexible solution with advanced functionalities to meet the diverse needs of both greenfield and brownfield operators.”

Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries.

About Mavenir:

Mavenir is building the future of networks today with cloud-native, AI-enabled solutions which are green by design, empowering operators to realise the benefits of 5G and achieve intelligent, automated, programmable networks. As the pioneer of Open RAN and a proven industry disruptor, Mavenir’s award-winning solutions are delivering automation and monetization across mobile networks globally, accelerating software network transformation for 300+ Communications Service Providers in over 120 countries, which serve more than 50% of the world’s subscribers. For more information, please visit www.mavenir.com

Meet Mavenir at Mobile World Congress 2024 (Barcelona, Feb 26 – 29 2024)

To explore our latest innovations, MWC show announcements and learn more about how Mavenir is delivering the Future of Networks – Today, visit our team in Hall 2 (Stand 2H60).

____________________________
1 For workloads and configurations visit www.Intel.com/PerformanceIndex. Results may vary.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240223458554/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

IQM and Real Asset Acquisition Corp. to Host Conference Call/Webcast to Discuss Proposed Transaction27.2.2026 13:00:00 CET | Press release

IQM Finland Oy, a global leader in full-stack superconducting quantum computers (“IQM”, “IQM Quantum Computers” or the “Company”), and Real Asset Acquisition Corp. (Nasdaq: RAAQ), a special purpose acquisition company (“RAAQ”), announced that they will host a conference call to discuss their recently announced business combination, including certain transaction highlights. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260227472716/en/ IQM Radiance quantum computer As previously disclosed, on February 23, 2026, IQM and RAAQ announced they have entered into a definitive business combination agreement, which will result in IQM becoming a public company and listing American Depositary Shares on one of the two leading U.S. stock exchanges. The transaction provides funding with the aim to accelerate IQM’s technology and commercial development towards fault-tolerance quantum computing, further advancing its position as a leading p

HighRadius Launches $0 Implementation Fee, $0 Subscription Fee via Outcome Based Pricing for oCFO Software27.2.2026 12:00:00 CET | Press release

HighRadius launches Office of the CFO first Outcome Based Pricing with $0 Implementation fee and $0 Subscription until Go-Live. Customers only pay a fraction of realized gains based on P&L impact. Chapter 1: Outcome Based Pricing (OBP)Introduction of OBP: HighRadius, a provider of 190+ AI agents for Order-to-Cash, Accounts Payable, Record-to-Report, and Treasury introduces Outcome Based Pricing (OBP). Three Components of OBP: Customers pay a) $0 in Implementation fees, b) $0 in Subscription fees until Go Live, c) HighRadius earns a fraction of the actual savings realized by the client. Chapter 2: US GAAP & ASC 606 ConstraintsNot Designed for Innovation: The traditional ASC 606 model requires companies to standardize and recognize revenue based on contractual obligations. For a traditional SaaS subscription, the obligation is access to software over time. AI agents are designed to deliver quantifiable, real-time Business Outcomes that do not fit the traditional accounting framework. Cha

Kioxia Appoints Yoshihiko Kawamura as Chief Financial Officer27.2.2026 09:15:00 CET | Press release

Kioxia Holdings Corporation (TOKYO:285A), a world leader in memory solutions, today announced the appointment of Yoshihiko Kawamura as Chief Financial Officer (CFO), effective April 1, 2026. Mr. Kawamura brings extensive international experience to Kioxia, having held assignments at Mitsubishi Corporation’s U.S. headquarters, served as General Manager of its Chicago office, and completed a tenure at the World Bank. At Hitachi, Ltd., he held senior leadership positions, including Chief Strategy Officer (CSO), Chief Financial Officer (CFO), and Chief Risk Management Officer (CRMO), where he was instrumental in leading the company’s management reforms. Since joining Kioxia as Executive Vice President in June 2025, Mr. Kawamura has worked closely with the executive team to advance the business through strategic capital and financial planning. Following its initial public offering on the Prime Market of the Tokyo Stock Exchange in December 2024, Kioxia is entering a new phase of growth char

DNP Invests in Rapidus to Support the Establishment of Mass Production for Next-Generation Semiconductors27.2.2026 08:18:00 CET | Press release

Will accelerate the development and mass production of EUV lithography photomasks Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) today announced that it has participated in Rapidus Corporation’s funding round as one of the round investors. This strategic funding initiative supports Rapidus’ plan to steadily progress from its current R&D phase to mass production of 2nm (10⁻⁹ meters) logic semiconductors by 2027. Through this initiative, DNP will advance the development and mass production of EUV lithography photomasks and support Rapidus as it establishes a mass production system for 2nm & next-generation semiconductors. Background In recent years, the rise in energy consumption, in line with increased data generation, has become a challenge, driving demand for next-generation semiconductors capable of improving device performance and reducing power consumption. Next-generation semiconductors manufactured using EUV lithography enable the formation of finer patterns on silicon wafers co

EdgeConneX Looks to Enter Swedish Market as Part of European Data Center Expansion Strategy27.2.2026 08:05:00 CET | Press release

Planned data center campus in Skellefteå would support future AI and cloud infrastructure needs EdgeConneX®, an EQT portfolio company with an extensive Pan-European data center footprint, looks to expand its presence with a new site located in Skellefteå, Sweden. The data center site will be acquired from Lyten, a global company that specializes in lithium-sulfur batteries and energy storage. The site would support EdgeConneX broader strategy to expand digital infrastructure capacity across the Nordics. Subject to the completion of applicable administrative and regulatory processes, EdgeConneX will look to develop a data center campus with potential capacity of up to one gigawatt in support of future AI and cloud computing workloads. Upon completion, the data center campus would be one of the largest facilities in Europe that would be primarily powered by renewable energy. “Sweden represents an attractive long‑term market for digital infrastructure investment. The country’s access to r

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye