OR-RADISYS
21.2.2024 14:01:28 CET | Business Wire | Press release
Radisys® Corporation, a global leader of open telecom solutions, today announced the launch of its groundbreaking 5G Advanced Wireless Connectivity Software designed specifically for Industry 4.0 and private 5G networks. This significant advancement in the evolution of enterprise solutions offers unparalleled capabilities to establish private networks with enhanced performance, ease of deployability and management, and data protection with guaranteed Quality of Service (QoS). Radisys’ innovative 5G Advanced Wireless Connectivity software enables enterprises to meet the surging demand for private 5G and Industry 4.0 solutions capable of meeting evolving business needs.
By seamlessly integrating licensed, lightly licensed (CBRS) and unlicensed Wifi access via N3IWF, the advanced software solution delivers low latency, cloud-native solutions for both the RAN and Core networks. The cloudification of both RAN and Core networks offers flexible deployment options that allow for segregated and collocated distribution units (DU), central units (CU) and user plane functions (UPF) within a Kubernetes cloud environment, with the additional capability of deploying CU and UPF in the public cloud. This streamlined approach facilitates automation and simplifies the deployment of 5G networks, ultimately reducing capital expenditure (CapEx) and operational expenditure (OpEx) for private and Industry 4.0 5G operators.
Key features include:
- Time Sensitive Network (TSN) and 5G Ultra-Reliable Low Latency Communication (5G-URLLC) features for deterministic, low latency communication, targeted at Industry 4.0 automation requirements.
- 5G Reduced Capability (RedCap) for connectivity of the low-cost sensors enabling smart manufacturing processes and more.
- N3IWF (Non-3GPP Inter-working Function) to allow convergence of existing Wifi access with the 5G Core Network in enterprise and manufacturing sectors. Additionally, N3IWF enables integration of non-3GPP traditional and legacy access technologies with the 5G. This enhances accessibility and flexibility, providing a high-performance network solution for Industry 4.0 private and enterprise networks with reduced CapEx.
- CBRS band support with ease of integration into CBRS networks via a scalable CBRS Domain Proxy to enable acceleration of CBRS deployment for private and enterprise networks.
- Enabling intelligent Private 5G and Industry 4.0 solutions through advanced RAN functions controlled via ORAN E2 interface and pre-integrated with xApps/rApps and RIC platforms from different vendors.
“Recognizing the specific needs of Industry 4.0 and private 5G networks, Radisys continues to deliver innovative advanced 5G RAN and Core features to accelerate the adoption of 5G in these markets,” said Munish Chhabra, Head of Mobility Software and Services Business, Radisys. “Radisys remains committed to driving innovation in wireless technologies, empowering businesses to harness the full potential of Industry 4.0 and the future of connectivity for private and enterprise networks through its award-winning Connect RAN 5G Software solution.”
Meet with Radisys at MWC Barcelona
Experience Radisys’ disaggregated Connect RAN solutions, including demonstrations of its 5G Advanced Wireless Connectivity RAN software, at MWC Barcelona, Stand 2D50. To schedule a meeting with Radisys’ RAN experts, contact open@radisys.com.
About Radisys
Radisys is a global leader in open telecom solutions and services. Its disaggregated platforms and integration services leverage open reference architectures and standards combined with open software and hardware, enabling service providers to drive open digital transformation. Radisys offers an end-to-end solutions portfolio from digital endpoints, to disaggregated and open access and core solutions, to immersive digital applications and engagement platforms. Its world-class and experienced network services organization delivers full lifecycle services to help service providers build and operate highly scalable and high-performance networks at optimum total cost of ownership. For more information, visit www.Radisys.com.
Radisys® is a registered trademark of Radisys. All other trademarks are the property of their respective owners.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240221279407/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Biocytogen Announces Clinical Milestone with First Patient Dosed in Phase 1 Trial of IDEAYA’s First-in-Class B7H3/PTK7 Bispecific TOP1 ADC IDE03428.2.2026 01:00:00 CET | Press release
IDE034 is a B7H3/PTK7 bispecific TOP1 ADC designed to target tumor cells expressing both B7H3 and PTK7 preferentially, and is being evaluated as monotherapy and in combination with IDEAYA’s PARG inhibitor IDE161. IDEAYA has dosed the first patient in its Phase 1 trial of IDE034, initially evaluating safety, tolerability, and PK. First dosing triggers a $5 million milestone payment to Biocytogen under the companies’ option and license agreement. Biocytogen Pharmaceuticals (Beijing) Co., Ltd. (Biocytogen, SSE: 688796; HKEX: 02315), a global biotechnology company that drives the research and development of novel antibody-based drugs with innovative technologies, today announced that its partner IDEAYA Biosciences, Inc. (“IDEAYA”; Nasdaq: IDYA) has dosed the first patient in IDEAYA’s Phase 1 dose-escalation/expansion clinical trial of IDE034, an investigational B7H3/PTK7 bispecific TOP1 ADC. Pursuant to the companies’ option and license agreement, first patient dosing triggers a $5 million
IQM and Real Asset Acquisition Corp. to Host Conference Call/Webcast to Discuss Proposed Transaction27.2.2026 13:00:00 CET | Press release
IQM Finland Oy, a global leader in full-stack superconducting quantum computers (“IQM”, “IQM Quantum Computers” or the “Company”), and Real Asset Acquisition Corp. (Nasdaq: RAAQ), a special purpose acquisition company (“RAAQ”), announced that they will host a conference call to discuss their recently announced business combination, including certain transaction highlights. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260227472716/en/ IQM Radiance quantum computer As previously disclosed, on February 23, 2026, IQM and RAAQ announced they have entered into a definitive business combination agreement, which will result in IQM becoming a public company and listing American Depositary Shares on one of the two leading U.S. stock exchanges. The transaction provides funding with the aim to accelerate IQM’s technology and commercial development towards fault-tolerance quantum computing, further advancing its position as a leading p
HighRadius Launches $0 Implementation Fee, $0 Subscription Fee via Outcome Based Pricing for oCFO Software27.2.2026 12:00:00 CET | Press release
HighRadius launches Office of the CFO first Outcome Based Pricing with $0 Implementation fee and $0 Subscription until Go-Live. Customers only pay a fraction of realized gains based on P&L impact. Chapter 1: Outcome Based Pricing (OBP)Introduction of OBP: HighRadius, a provider of 190+ AI agents for Order-to-Cash, Accounts Payable, Record-to-Report, and Treasury introduces Outcome Based Pricing (OBP). Three Components of OBP: Customers pay a) $0 in Implementation fees, b) $0 in Subscription fees until Go Live, c) HighRadius earns a fraction of the actual savings realized by the client. Chapter 2: US GAAP & ASC 606 ConstraintsNot Designed for Innovation: The traditional ASC 606 model requires companies to standardize and recognize revenue based on contractual obligations. For a traditional SaaS subscription, the obligation is access to software over time. AI agents are designed to deliver quantifiable, real-time Business Outcomes that do not fit the traditional accounting framework. Cha
Kioxia Appoints Yoshihiko Kawamura as Chief Financial Officer27.2.2026 09:15:00 CET | Press release
Kioxia Holdings Corporation (TOKYO:285A), a world leader in memory solutions, today announced the appointment of Yoshihiko Kawamura as Chief Financial Officer (CFO), effective April 1, 2026. Mr. Kawamura brings extensive international experience to Kioxia, having held assignments at Mitsubishi Corporation’s U.S. headquarters, served as General Manager of its Chicago office, and completed a tenure at the World Bank. At Hitachi, Ltd., he held senior leadership positions, including Chief Strategy Officer (CSO), Chief Financial Officer (CFO), and Chief Risk Management Officer (CRMO), where he was instrumental in leading the company’s management reforms. Since joining Kioxia as Executive Vice President in June 2025, Mr. Kawamura has worked closely with the executive team to advance the business through strategic capital and financial planning. Following its initial public offering on the Prime Market of the Tokyo Stock Exchange in December 2024, Kioxia is entering a new phase of growth char
DNP Invests in Rapidus to Support the Establishment of Mass Production for Next-Generation Semiconductors27.2.2026 08:18:00 CET | Press release
Will accelerate the development and mass production of EUV lithography photomasks Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) today announced that it has participated in Rapidus Corporation’s funding round as one of the round investors. This strategic funding initiative supports Rapidus’ plan to steadily progress from its current R&D phase to mass production of 2nm (10⁻⁹ meters) logic semiconductors by 2027. Through this initiative, DNP will advance the development and mass production of EUV lithography photomasks and support Rapidus as it establishes a mass production system for 2nm & next-generation semiconductors. Background In recent years, the rise in energy consumption, in line with increased data generation, has become a challenge, driving demand for next-generation semiconductors capable of improving device performance and reducing power consumption. Next-generation semiconductors manufactured using EUV lithography enable the formation of finer patterns on silicon wafers co
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom