OR-RADISYS
21.2.2024 14:01:28 CET | Business Wire | Press release
Radisys® Corporation, a global leader of open telecom solutions, today announced the launch of its groundbreaking 5G Advanced Wireless Connectivity Software designed specifically for Industry 4.0 and private 5G networks. This significant advancement in the evolution of enterprise solutions offers unparalleled capabilities to establish private networks with enhanced performance, ease of deployability and management, and data protection with guaranteed Quality of Service (QoS). Radisys’ innovative 5G Advanced Wireless Connectivity software enables enterprises to meet the surging demand for private 5G and Industry 4.0 solutions capable of meeting evolving business needs.
By seamlessly integrating licensed, lightly licensed (CBRS) and unlicensed Wifi access via N3IWF, the advanced software solution delivers low latency, cloud-native solutions for both the RAN and Core networks. The cloudification of both RAN and Core networks offers flexible deployment options that allow for segregated and collocated distribution units (DU), central units (CU) and user plane functions (UPF) within a Kubernetes cloud environment, with the additional capability of deploying CU and UPF in the public cloud. This streamlined approach facilitates automation and simplifies the deployment of 5G networks, ultimately reducing capital expenditure (CapEx) and operational expenditure (OpEx) for private and Industry 4.0 5G operators.
Key features include:
- Time Sensitive Network (TSN) and 5G Ultra-Reliable Low Latency Communication (5G-URLLC) features for deterministic, low latency communication, targeted at Industry 4.0 automation requirements.
- 5G Reduced Capability (RedCap) for connectivity of the low-cost sensors enabling smart manufacturing processes and more.
- N3IWF (Non-3GPP Inter-working Function) to allow convergence of existing Wifi access with the 5G Core Network in enterprise and manufacturing sectors. Additionally, N3IWF enables integration of non-3GPP traditional and legacy access technologies with the 5G. This enhances accessibility and flexibility, providing a high-performance network solution for Industry 4.0 private and enterprise networks with reduced CapEx.
- CBRS band support with ease of integration into CBRS networks via a scalable CBRS Domain Proxy to enable acceleration of CBRS deployment for private and enterprise networks.
- Enabling intelligent Private 5G and Industry 4.0 solutions through advanced RAN functions controlled via ORAN E2 interface and pre-integrated with xApps/rApps and RIC platforms from different vendors.
“Recognizing the specific needs of Industry 4.0 and private 5G networks, Radisys continues to deliver innovative advanced 5G RAN and Core features to accelerate the adoption of 5G in these markets,” said Munish Chhabra, Head of Mobility Software and Services Business, Radisys. “Radisys remains committed to driving innovation in wireless technologies, empowering businesses to harness the full potential of Industry 4.0 and the future of connectivity for private and enterprise networks through its award-winning Connect RAN 5G Software solution.”
Meet with Radisys at MWC Barcelona
Experience Radisys’ disaggregated Connect RAN solutions, including demonstrations of its 5G Advanced Wireless Connectivity RAN software, at MWC Barcelona, Stand 2D50. To schedule a meeting with Radisys’ RAN experts, contact open@radisys.com.
About Radisys
Radisys is a global leader in open telecom solutions and services. Its disaggregated platforms and integration services leverage open reference architectures and standards combined with open software and hardware, enabling service providers to drive open digital transformation. Radisys offers an end-to-end solutions portfolio from digital endpoints, to disaggregated and open access and core solutions, to immersive digital applications and engagement platforms. Its world-class and experienced network services organization delivers full lifecycle services to help service providers build and operate highly scalable and high-performance networks at optimum total cost of ownership. For more information, visit www.Radisys.com.
Radisys® is a registered trademark of Radisys. All other trademarks are the property of their respective owners.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240221279407/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
SLB Awarded Multiple Offshore Drilling Contracts by Mubadala Energy for Tangkulo Deepwater Development in Indonesia12.2.2026 14:00:00 CET | Press release
Contracts support offshore gas development with first gas targeted before end of 2028 Global energy technology company SLB (NYSE: SLB) has been awarded multiple offshore drilling services contracts by Mubadala Energy, the Abu Dhabi headquartered international energy company, for the Tangkulo natural gas deepwater development and associated exploration and appraisal drilling activities in the Andaman Sea, offshore Indonesia. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260212809124/en/ The project will leverage SLB’s offshore and deepwater technologies, including real-time downhole monitoring, to reduce operational risk, improve well placement and strengthen project economics. Under the awards, SLB will work with Mubadala Energy to deliver integrated drilling and well services across the full well life cycle. The scope includes directional drilling, drilling fluids, cementing, wireline, slickline, coiled tubing, well testin
Align Partners Issues Formal Shareholder Proposals to Dentium12.2.2026 13:43:00 CET | Press release
Align Partners Capital Management Inc. (“Align Partners”), a shareholder of Dentium Co., Ltd. (“Dentium” or the “Company”), has submitted formal shareholder proposals for inclusion in the agenda of Dentium’s upcoming 26th Annual General Meeting (“AGM”), urging the Company to strengthen governance practices and improve capital allocation discipline. Align Partners noted that, given shareholder proposals will be presented at this year’s AGM, Dentium should follow the Korea Exchange (KRX) Corporate Governance Key Indicators by publishing the AGM convocation notice at least four weeks prior to the meeting date and adopting an electronic voting system to enhance shareholder participation. Dentium is widely recognized as a global leader in the dental implant industry, supported by superior technology and more than 23 years of long-term clinical data. Despite this strong positioning, Align Partners believes the Company continues to trade at a meaningful discount. As of February 11, 2026, Dent
Align Partners Issues Public Shareholder Letter and Submits Formal Shareholder Proposals to SoluM12.2.2026 13:42:00 CET | Press release
Align Partners Capital Management Inc. (“Align Partners”), a shareholder of SoluM Co., Ltd. (“SoluM” or the “Company”), has submitted formal shareholder proposals for inclusion in the agenda of SoluM’s 2026 Annual General Meeting (“AGM”) and issued its first public shareholder letter to the Company’s Board of Directors. Align Partners requested that SoluM’s Board and management provide a public written response to the shareholder letter by the AGM convocation notice deadline ahead of the March 2026 meeting. The campaign reflects Align Partners’ view that meaningful governance reforms and strategic focus are urgently needed to unlock shareholder value. SoluM operates a high-growth Electronic Shelf Label (“ESL”) business with strong global positioning and attractive long-term market potential. Despite this, the Company’s share price has remained near historical lows since its listing. As of February 11, 2026, SoluM trades at a last-twelve-month EV/EBIT multiple of 28.9x, representing a s
GigaDevice Extends European Reach with SEMITRON Partnership for DACH region12.2.2026 10:52:00 CET | Press release
GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has entered into a distribution agreement with SEMITRON, a leading electronic component distributor that specializes with a focus on the DACH region. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260203746978/en/ Under the terms of the deal, SEMITRON is set to supply both GigaDevice's leading Flash, MCU, power and sensor lines in conjunction with field application engineering support to customers in the industrial, automotive and communication technology sectors. In particular, SEMITRON offers professional test house services, technical know-how and local on-the-ground expertise and support. The partnership further extends GigaDevice's reach into this major European market, with on the ground support in Germany, Austria, Switzerland. Jürgen Rohland, Managing Director of SEMITRON W. Röck Gmb
Samsung Ships Industry-First Commercial HBM4 With Ultimate Performance for AI Computing12.2.2026 10:48:00 CET | Press release
Mass production commences for HBM4 with consistent transfer speed of 11.7Gbps, capable of up to 13GbpsLeading-edge DRAM with 4nm logic base die maximizes performance, reliability and energy efficiency for next-generation datacentersSecure process technology and supply capabilities strengthen Samsung’s HBM roadmap beyond HBM4 Samsung Electronics Co., Ltd., a global leader in advanced memory technology, today announced that it has begun mass production of its industry-leading HBM4 and has shipped commercial products to customers. This achievement marks a first in the industry, securing an early leadership position in the HBM4 market. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260212674509/en/ Samsung Ships Industry-First Commercial HBM4 With Ultimate Performance for AI Computing By proactively leveraging its most advanced 6th-generation 10 nanometer (nm)-class DRAM process (1c), the company achieved stable yields and indus
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
