OR-RADISYS
21.2.2024 14:01:28 CET | Business Wire | Press release
Radisys® Corporation, a global leader of open telecom solutions, today announced the launch of its groundbreaking 5G Advanced Wireless Connectivity Software designed specifically for Industry 4.0 and private 5G networks. This significant advancement in the evolution of enterprise solutions offers unparalleled capabilities to establish private networks with enhanced performance, ease of deployability and management, and data protection with guaranteed Quality of Service (QoS). Radisys’ innovative 5G Advanced Wireless Connectivity software enables enterprises to meet the surging demand for private 5G and Industry 4.0 solutions capable of meeting evolving business needs.
By seamlessly integrating licensed, lightly licensed (CBRS) and unlicensed Wifi access via N3IWF, the advanced software solution delivers low latency, cloud-native solutions for both the RAN and Core networks. The cloudification of both RAN and Core networks offers flexible deployment options that allow for segregated and collocated distribution units (DU), central units (CU) and user plane functions (UPF) within a Kubernetes cloud environment, with the additional capability of deploying CU and UPF in the public cloud. This streamlined approach facilitates automation and simplifies the deployment of 5G networks, ultimately reducing capital expenditure (CapEx) and operational expenditure (OpEx) for private and Industry 4.0 5G operators.
Key features include:
- Time Sensitive Network (TSN) and 5G Ultra-Reliable Low Latency Communication (5G-URLLC) features for deterministic, low latency communication, targeted at Industry 4.0 automation requirements.
- 5G Reduced Capability (RedCap) for connectivity of the low-cost sensors enabling smart manufacturing processes and more.
- N3IWF (Non-3GPP Inter-working Function) to allow convergence of existing Wifi access with the 5G Core Network in enterprise and manufacturing sectors. Additionally, N3IWF enables integration of non-3GPP traditional and legacy access technologies with the 5G. This enhances accessibility and flexibility, providing a high-performance network solution for Industry 4.0 private and enterprise networks with reduced CapEx.
- CBRS band support with ease of integration into CBRS networks via a scalable CBRS Domain Proxy to enable acceleration of CBRS deployment for private and enterprise networks.
- Enabling intelligent Private 5G and Industry 4.0 solutions through advanced RAN functions controlled via ORAN E2 interface and pre-integrated with xApps/rApps and RIC platforms from different vendors.
“Recognizing the specific needs of Industry 4.0 and private 5G networks, Radisys continues to deliver innovative advanced 5G RAN and Core features to accelerate the adoption of 5G in these markets,” said Munish Chhabra, Head of Mobility Software and Services Business, Radisys. “Radisys remains committed to driving innovation in wireless technologies, empowering businesses to harness the full potential of Industry 4.0 and the future of connectivity for private and enterprise networks through its award-winning Connect RAN 5G Software solution.”
Meet with Radisys at MWC Barcelona
Experience Radisys’ disaggregated Connect RAN solutions, including demonstrations of its 5G Advanced Wireless Connectivity RAN software, at MWC Barcelona, Stand 2D50. To schedule a meeting with Radisys’ RAN experts, contact open@radisys.com.
About Radisys
Radisys is a global leader in open telecom solutions and services. Its disaggregated platforms and integration services leverage open reference architectures and standards combined with open software and hardware, enabling service providers to drive open digital transformation. Radisys offers an end-to-end solutions portfolio from digital endpoints, to disaggregated and open access and core solutions, to immersive digital applications and engagement platforms. Its world-class and experienced network services organization delivers full lifecycle services to help service providers build and operate highly scalable and high-performance networks at optimum total cost of ownership. For more information, visit www.Radisys.com.
Radisys® is a registered trademark of Radisys. All other trademarks are the property of their respective owners.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240221279407/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products atKitakami Plant Fab23.7.2026 12:19:00 CEST | Press release
Companies Showcase Ongoing Buildout of Manufacturing Infrastructure at K2 to Address Growing Demand for NAND Flash Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today announced the start of production for their 10th-generation 3D Flash memory technology at Fab2 (K2) at the Kitakami Plant in Iwate Prefecture in Japan. The milestone comes as the companies continue to drive meaningful, multi-year bit growth to address the strong demand for their innovative flash memory technology. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702296115/en/ Unveiling ceremony for the K2 facility In conjunction with the start of production, the companies held an unveiling ceremony for the K2 facility. Opening in September 2025, the facility has produced the companies’ 8th-generation 3D flash memory products and will begin to scale production with the introduction of their
VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications3.7.2026 12:02:00 CEST | Press release
Enhancing image quality and visual perception for moving-camera systems VeriSilicon (688521.SH) today announced its high-performance CPP2000 Camera Post-Processing (CPP) IP, expanding the company’s Image Signal Processing (ISP) solutions with advanced post-processing capabilities. By improving image quality and visual perception in mobile imaging scenarios, CPP2000 enables more reliable vision performance in robotics, drones, and other mobile vision applications. CPP2000 integrates multiple image processing technologies and can further optimize YUV images output from image signal processors. The IP supports image and video processing at up to 8K resolution and offers multiple hardware configuration options to meet diverse requirements in Power, Performance, Area (PPA), and latency across different applications. CPP2000 leverages the combined operation of multiple image processing technologies, including motion-compensated temporal filtering, advanced spatial noise reduction, chroma adj
Messer Acquires Singapore-Based Industrial Gas Platform; Japan Corporate Advisory Institute Advises Sellers3.7.2026 11:11:00 CEST | Press release
Acquisition of WKS Group strengthens Messer’s Southeast Asia presence Messer, the world’s largest privately held specialist for industrial, medical, electronic and specialty gases, has acquired WKS Group, a Singapore-based industrial gas platform with operations across Singapore and southern Malaysia. Transaction terms were not disclosed. Messer reported consolidated sales of approximately EUR 4.5 billion for its 2025 financial year. Founded in Singapore in 1977, WKS Group comprises six companies and employs approximately 195 people across Singapore and southern Malaysia. The acquisition expands Messer’s operating footprint in Southeast Asia and strengthens its access to key industrial clusters across the region. “We are pleased to have completed this transaction with Messer, whose strategic vision makes them an excellent partner for WKS Group,” said Mr. Wong Koh Hoi, shareholder of WKS Group. “We appreciate JCAI’s professionalism and dedication throughout the process, and their expert
Access Advance Welcomes Meta Platforms, Inc. and Alibaba Group to the Video Distribution Patent Pool3.7.2026 01:00:00 CEST | Press release
Access Advance LLC today announced that Meta Platforms, Inc., one of the world's largest distributors of video content across its Facebook, Instagram, Threads, and WhatsApp services, has joined the Video Distribution Patent Pool (VDP Pool) as a Licensee. Meta also joined both the HEVC Advance and VVC Advance pools as a Licensee. Alibaba Group, whose video infrastructure spans a wide range of video-based services across e-commerce, entertainment, and digital media platforms, was also announced as a VDP Pool Licensee this week. Meta and Alibaba joining the VDP Pool further reinforces the program’s market leading position in resolving the licensing issues around the use of modern video codecs, including VP9, AV1, HEVC and VVC, across all the diverse business models of internet video streaming. "A significant U.S.-based company like Meta joining as a Licensee is a milestone moment for the content distribution business and the VDP Pool," said Peter Moller, CEO of Access Advance. "Meta reach
Kioxia Commences Sample Shipments of 10th-Generation BiCS FLASH™ Devices Delivering High Performance, High Capacity and Low Power Consumption3.7.2026 01:00:00 CEST | Press release
Production planned at Fab2 of Kitakami Plant Kioxia Corporation, a world leader in memory solutions, today announced that it has commenced sample shipments of 1Tb (terabit) Triple-Level-Cell (TLC) memory devices utilizing its 10th-generation BiCS FLASH™ 3D flash memory technology.1 These will be primarily integrated into the company’s enterprise and data center SSDs, strengthening Kioxia’s lineup to meet the growing demand for AI storage, which requires higher performance, higher capacity, and lower power consumption. These new products will be manufactured using state-of-the-art equipment at Kioxia’s Kitakami Plant Fab2 facility in Iwate Prefecture, Japan. By leveraging innovative CMOS directly Bonded to Array (CBA) technology2 and On-Pitch Select Gate Drain (OPS) technology,3 both adopted since the 8th-generation BiCS FLASH™, the 10th-generation technology achieves a NAND interface speed of 4.8 Gb/s,4 a 33% improvement over the 8th generation. Bit density has increased by 59% by stac
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom