GIGABYTE
15.2.2024 18:31:29 CET | Business Wire | Press release
GIGABYTE Technology, an IT pioneer whose focus is to advance global industries through cloud and AI computing systems, is coming to MWC 2024 with its next-generation servers empowering telcos, cloud service providers, enterprises, and SMBs to swiftly harness the value of 5G and AI. Featured is a cutting-edge AI server boasting AMD Instinct™ MI300X 8-GPU, and a comprehensive AI/HPC server series supporting the latest chip technology from AMD, Intel, and NVIDIA. The showcase will also feature integrated green computing solutions excelling in heat dissipation and energy reduction.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240215917651/en/
Inviting the AI-powered 5G Era, GIGABYTE will Present Next-Gen Servers for AI HPC, Telecom, and Green Computing Solutions at MWC 2024
Continuing the booth theme “Future of COMPUTING”, GIGABYTE's presentation will cover servers for AI/HPC, RAN and Core networks, modular edge platforms, all-in-one green computing solutions, and AI-powered self-driving technology. The exhibits will demonstrate how industries extend AI applications from cloud to edge and terminal devices through 5G connectivity, expanding future opportunities with faster time to market and sustainable operations. The showcase spans from February 26th to 29th at Booth #5F60, Hall 5, Fira Gran Via, Barcelona.
Tomorrow’s AI Supercomputers
The demand for AI-ready infrastructure and high-speed storage is escalating within the 5G framework, business operations, and academic research, driven by the exponential growth in data volume and the complexity of AI models. GIGABYTE will showcase its latest series of AI/HPC servers and an all-flash array (AFA) storage server. These servers support AMD Instinct™ MI300X OAM GPU modules, MI300A APUs, 5th Gen Intel® Xeon® Scalable Processors, NVIDIA HGX H100 8-GPU, and NVIDIA Grace Hopper Superchip, also leveraging the next-gen HBM3, ensuring hyper-speed data transmission. This technological leap is poised to advance exascale AI workloads and real-time big data analysis.
Flexible Server Architectures for the AI-enabled 5G Networks
The massive deployment of 5G applications requires flexibly configured digital infrastructure capable of supporting diverse IT ecosystems. GIGABYTE will introduce one of its modular edge platforms designed to manage a wide range of workloads, including networking, AI inferencing, and cloud computing. This platform offers seamless upgrades to accommodate multi-generational chip technologies and components, ensuring agile adaptation to rapid market changes with minimized maintenance costs.
In response to the rising demand for 5G and AI applications across businesses of varying scales, GIGABYTE will introduce its latest servers tailored for RAN and Core networks. These servers offer robust performance, catering to a range of computing needs from large-scale cloud-native workloads and telecom services to SMB IT operations. They excel in energy efficiency and provide expansion opportunities for AI-accelerated computing.
Sustainable AI and Cloud Computing Ensures Optimized TCO
At MWC, GIGABYTE is set to showcase its comprehensive all-in-one green computing solution, featuring a large-scale immersion cooling tank and two immersion-ready servers tailored for AI and cloud computing. The exhibit emphasizes their remarkable heat-dissipation capabilities and significantly lower power consumption. These features translate into a favorable total cost of ownership (TCO), highlighting GIGABYTE's commitment to sustainable and efficient computing solutions.
Future-Proof E-mobility Driven by Edge AI
Leveraging the 5G network and advanced AI algorithms, GIGABYTE's autonomous vehicle technology offers an exceptionally intelligent driving experience driven by edge AI. The high-speed data transmission performance ensures that GIGABYTE's Advanced Driver Assistance Systems (ADAS) and telematics efficiently process vast amounts of data from cameras, radars, and ultrasonic sensors. This enables the system to deliver precise real-time driving decisions, even in complex road conditions.
At GIGABYTE’s booth, enterprises can explore innovative and flexible computing solutions aligning with their strategies to gain a competitive edge in the AI-accelerated 5G future.
Visit GIGABYTE’s MWC event page.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240215917651/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Westlake Epoxy Expands Distribution Relationship with Brenntag to India18.2.2026 02:30:00 CET | Press release
Westlake Corporation (NYSE: WLK) today announced that Westlake Epoxy will expand its long‑standing distribution relationship with Brenntag to South and West India. The agreement builds on a successful collaboration across Europe, North and South America, and Southeast Asia, extending Westlake Epoxy’s reach into one of the world’s fastest‑growing coatings, adhesives and construction markets. Under the expanded collaboration, Brenntag will distribute Westlake Epoxy’s established portfolio of epoxy solutions for coatings, adhesives and construction applications, including the EPON™, EPIKOTE™, EPIKURE™ and EPI‑REZ™ product lines. Customers are expected to benefit from reliable local supply, technical service and application‑focused formulation support tailored to regional requirements. India’s coatings, adhesives and construction sectors continue to grow, driven by infrastructure investment, urbanization and increasing performance expectations. By combining Westlake Epoxy’s proven epoxy te
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom