B2BINPAY
14.2.2024 09:22:28 CET | Business Wire | Press release
B2BinPay, the trusted blockchain-backed payment platform, has officially released its version 19 update to the public. This upgrade boasts many enhancements, including state-of-the-art instant swaps and expanded support for various blockchains. As always, B2BinPay remains dedicated to providing a seamless and secure platform for all cryptocurrency transactions.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240214263094/en/
B2BinPay v19 goes live with instant swaps and expanded blockchain support (Photo: Business Wire)
New Instant Swaps and Competitive VWAP-powered Rates
Swaps have become a preferred strategy for managing digital assets due to the direct exchange of cryptocurrencies between different addresses. This is a contrarian approach to conventional exchanges, which use the order books system for asset trading.
With B2BinPay, clients can easily access instant swaps without navigating through complicated order books and comparing prices across different venues. This is made possible with the Volume-Weighted Average Price (VWAP) tool, which automatically selects the best available price from multiple centralised platforms based on transaction volume.
In addition, the use of swaps by B2BinPay clients eliminates two blockchain commission costs, namely, the transaction to the centralised exchange and the transaction back to the B2BinPay wallet, which adds flexibility and cost-effectiveness in dealing with digital assets.
Instant swaps can be accessed through the dedicated Swaps Tab on the platform's front-end menu, along with separate wallets for each crypto asset.
Commission-Free Wallet Funding, Smooth Swapping Process
The latest release introduces a customised top-up process for swap wallets tailored to different user categories. Those with digital wallets can now take advantage of swift transactions for instant fund transfers, while owners of blockchain wallets benefit from on-chain transactions that offer both transparency and security through recorded data on the blockchain. It is crucial to note that topping up must be done in the wallet's designated currency.
In addition, users can enjoy a commission-free top-up process from their B2BinPay accounts. Note that blockchain wallets will still incur a minimal fee for on-chain transactions.
New Blockchain Network Integration: Avalanche and Polygon
B2BinPay's latest release has integrated support for two in-demand blockchains, Polygon and Avalanche. This integration brings an array of stablecoin transaction options to the platform, including popular choices like USDT, USDC, DAI, FRAX, TUSD, and EUROC on new networks.
Known for its scalability and minimal transaction fees, Polygon is a popular choice for a large number of crypto users. In comparison, Avalanche shines with its high throughput and rapid processing times, providing a powerful platform for speedy transfers.
Final Remarks
B2BinPay continues to push the boundaries of crypto processing with their latest version 19 release. This update offers clients even more flexibility, allowing them to access more blockchains and cryptocurrencies and make instant exchanges with swap wallets.
The team isn't stopping there – they are actively working on reducing fees to make their services even more cost-effective for all clients in future releases. This dedication to continuous improvement demonstrates B2BinPay's commitment to meeting the evolving needs of businesses and startups alike.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240214263094/en/
About Business Wire
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 22:06:00 CET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 22:00:00 CET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 19:50:00 CET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 18:08:00 CET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 16:00:00 CET | Press release
Company opens 20,000 sq ft HQ in Silicon Valley to deploy AI Agents to accelerate chip design workflows. Sandeep Bharathi joins Advisory Board. ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom