Business Wire

LENOVO

14.2.2024 08:01:26 CET | Business Wire | Press release

Share
Lenovo to unveil its latest portfolio of AI PCs and Far Edge Computing at MWC, delivering innovative AI for all

At MWC, the technology industry’s largest connectivity ecosystem event (26th – 29th February, Barcelona, Spain), Lenovo (Booth #3N30) will unveil its latest portfolio of AI devices and infrastructure solutions to date, as well as showcase two new device concepts that challenge the traditional PC and smartphone form factors.

At CES, Lenovo launched its first AI PCs, bringing the technology into its ThinkBook, ThinkPad, Yoga, Legion, and ThinkCentre PC portfolio. With the company's vision of “AI for All” at MWC, Lenovo will unveil several new AI PCs and edge computing solutions, bringing the technology more into the mainstream for 2024/2025. The company expects the trend of hybrid AI to fuel the demand for both AI PCs and AI smartphones and drive another industry refreshment cycle.

Purpose-built to support AI, Lenovo’s AI PCs are designed and engineered to perform tasks such as reasoning, problem-solving, and learning. More importantly, they create a user-machine bond, bringing tailored experiences amplified by AI. With stronger computing power and larger storage, large language models (LLMs) can easily run on the device rather than in the cloud. Over time, these models adapt to the user's preferences and habits, enhancing their assistance as time goes on, resulting in a more personalized experience while safeguarding privacy.

In addition, Lenovo plans to unveil several next-generation infrastructure solutions for telecom that help businesses harness vast bodies of data at the far edge for transformative AI applications at scale, while reducing energy consumption of cloud services. As the telecom industry evolves to connect today’s digital economy, Lenovo’s Edge AI computing solutions are forging new AI capabilities across city streets throughout Barcelona and Madrid, like using video analytics and computer vision to identify smoke and fire, improve emergency response times and support public safety.

At its Tech World event in October 2023, Lenovo unveiled its hybrid AI for All vision and showcased how it is unleashing the power of AI to drive intelligent transformation in every aspect of people’s lives and in every industry and its commitment to investing US$1 billion investment in AI innovation.

Also, at MWC, Lenovo will show two new concept products for the first time at a public event. Motorola’s adaptive display concept, a world-first product which uses a FHD+ pOLED display that can be bent and shaped into different forms depending on users’ needs, and also another world-first proof of concept and eye-catching innovative laptop form factor that push the boundaries of engineering, design, and user experience from the Intelligent Devices Group and Lenovo Research teams.

About Lenovo

Lenovo is a US$62 billion revenue global technology powerhouse, ranked #217 in the Fortune Global 500, employing 77,000 people around the world, and serving millions of customers every day in 180 markets. Focused on a bold vision to deliver Smarter Technology for All, Lenovo has built on its success as the world's largest PC company by further expanding into growth areas that fuel the advancement of 'New IT' technologies (client, edge, cloud, network, and intelligence) including server, storage, mobile, software, solutions, and services. This transformation together with Lenovo's world-changing innovation is building a more inclusive, trustworthy, and smarter future for everyone, everywhere. Lenovo is listed on the Hong Kong stock exchange under Lenovo Group Limited (HKSE: 992)(ADR: LNVGY). To find out more visit https://www.lenovo.com, and read about the latest news via our StoryHub

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240213802038/en/

About Business Wire

Business Wire
Business Wire
101 California Street, 20th Floor
CA 94111 San Francisco

http://businesswire.com
DK

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Medscape Brings AI to the Hematology Frontline at EHA 20262.6.2026 08:00:00 CEST | Press release

Landmark symposium to equip clinicians with practical, ethical AI frameworks, chaired by a lead author of Europe's ESMO EBAI and ELCAP oncology guidelines. Medscape Education will launch Future-Ready Hematologists: Practical and Ethical Use of AI in Hematology and Oncology at EHA 2026 on June 11, where leading experts will convene to explore responsible AI in one of medicine's most complex, rapidly evolving specialties. Registration is free for all EHA delegates. Reserve your seat here. The session is chaired by Prof. Jakob N. Kather, MD, MSc, Else Kroener Fresenius Center for Digital Health, Technical University Dresden, and NCT, University Hospital Heidelberg. He is joined by Prof. Chan Cheah, MBBS, DMSc, Consultant Hematologist, Sir Charles Gairdner Hospital, Perth, Australia; and Prof. Matthew Lunning, DO, FACP, Chief of Hematology and Assistant Vice Chancellor of Research, University of Nebraska Medical Center. Hematology moves faster than any clinician can track alone. AI can clo

Signaloid Announces Preview of New ASIC Targeted at Physical AI and Robotics Applications2.6.2026 06:00:00 CEST | Press release

Signaloid previews a new ASIC purpose-built for physical AI and robotics workloads.The chip, taped out with TSMC in partnership with IC-Link by imec and Cadence, is projected to deliver up to 1000× better performance-per-watt in key physical AI workloads. Signaloid (https://signaloid.com), a computing platform company providing hardware and binary-translation-based acceleration of AI, robotics, aerospace, and quantitative finance workloads, today announced the tapeout and preliminary specifications documents for its C0-ASIC. Delivery of engineering samples to the first customer is due in Q3 2026 and additional FPGA-based systems implementing the ASIC’s design are under discussion for deployment in the UK and Switzerland later in 2026. The C0-ASIC was targeted specifically at energy-efficient physical AI workloads. The UK Advanced Research and Invention Agency (ARIA) will take delivery of systems based on the ASIC for use in next-generation AI workloads such as second order methods. “Th

Blackstone Raises its Largest Asia Private Equity Fund at $13.1 Billion2.6.2026 03:00:00 CEST | Press release

Oversubscribed Fund More than Doubles Capital Raised for Predecessor Vehicle Blackstone (NYSE: BX) today announced the final close of Blackstone Capital Partners Asia III (“BCP Asia III”) at $13.1 billion, exceeding its $10 billion target and marking the firm’s largest private equity fundraise in the region. The oversubscribed fund reached its hard cap and builds on the strong performance of the strategy’s first two vintages, with this close representing more than double the amount of capital raised for its predecessor vehicle. Joe Baratta, Global Head of Blackstone Private Equity Strategies,said: “We are grateful for the continued trust of our investors in Blackstone and our leading Asia Private Equity franchise. This successful fundraise reflects the strength of our platform and our ability to perform through cycles. Asia Pacific is the fastest-growing region in the world, presenting compelling opportunities to invest at scale behind our high-conviction themes and deliver for our inv

Phison Unlocks Full-Scale AI Deployment Across Industries2.6.2026 02:00:00 CEST | Press release

Building an Ecosystem with Pascari aiDAPTIV™ Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a new strategic initiative at COMPUTEX 2026 under the theme “AI Enabler: Evolving Data Storage Intelligence.” Expanding beyond its role as a storage technology leader, Phison is taking a systems-level approach to AI solutions spanning AI infrastructure, edge AI computing and AI software platforms. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601070396/en/ Phison evolving data storage intelligence at COMPUTEX 2026 At COMPUTEX 2026, Phison is showcasing comprehensive AI storage and computing architecture solutions designed to address key challenges facing enterprises and end users in the AI era, including high AI deployment costs, GPU and memory limitations, data privacy concerns and the increasing storage bandwidth and power demands driven by AI workloads. Four Core Te

Phison Collaborates with Intel to Bring Larger Local AI Workloads to Intel AI PC Platforms2.6.2026 02:00:00 CEST | Press release

Phison's Pascari aiDAPTIV™ removes local memory constraints on client PCs, enabling larger MoE AI models and agentic AI applications COMPUTEX — Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a collaboration with Intel to enable AI PCs to deploy larger, more capable AI applications locally. The collaboration combines Intel® Core™ Ultra Series 3 processors with Phison’s Pascari aiDAPTIV, a memory extension solution that unblocks memory-constrained systems to support larger Mixture-of-Experts (MoE) AI models, longer-running AI sessions and agentic AI workflows. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601878925/en/ Phison and Intel collaborate to bring larger local AI workloads to Intel AI PC Platforms Today, AI PCs are moving beyond simple assistant applications toward more advanced local AI use cases. These solutions now support end users and businesses i

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye